KR102269436B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

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Publication number
KR102269436B1
KR102269436B1 KR1020197020576A KR20197020576A KR102269436B1 KR 102269436 B1 KR102269436 B1 KR 102269436B1 KR 1020197020576 A KR1020197020576 A KR 1020197020576A KR 20197020576 A KR20197020576 A KR 20197020576A KR 102269436 B1 KR102269436 B1 KR 102269436B1
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KR
South Korea
Prior art keywords
substrate
liquid
landing position
chemical
liquid landing
Prior art date
Application number
KR1020197020576A
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English (en)
Korean (ko)
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KR20190094427A (ko
Inventor
다카시 오타
구니오 야마다
도모아키 아이하라
지로 오쿠다
마사유키 하야시
Original Assignee
가부시키가이샤 스크린 홀딩스
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Publication of KR20190094427A publication Critical patent/KR20190094427A/ko
Application granted granted Critical
Publication of KR102269436B1 publication Critical patent/KR102269436B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02343—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020197020576A 2017-02-09 2017-11-17 기판 처리 장치 및 기판 처리 방법 KR102269436B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2017-022006 2017-02-09
JP2017022006A JP6812262B2 (ja) 2017-02-09 2017-02-09 基板処理装置および基板処理方法
PCT/JP2017/041506 WO2018146897A1 (ja) 2017-02-09 2017-11-17 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
KR20190094427A KR20190094427A (ko) 2019-08-13
KR102269436B1 true KR102269436B1 (ko) 2021-06-24

Family

ID=63107352

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197020576A KR102269436B1 (ko) 2017-02-09 2017-11-17 기판 처리 장치 및 기판 처리 방법

Country Status (5)

Country Link
JP (1) JP6812262B2 (zh)
KR (1) KR102269436B1 (zh)
CN (1) CN110192267B (zh)
TW (1) TWI686243B (zh)
WO (1) WO2018146897A1 (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014132641A (ja) * 2012-12-06 2014-07-17 Ebara Corp 基板洗浄装置及び基板洗浄方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4931285B2 (ja) * 2000-04-20 2012-05-16 アイメック 基板の表面の局所化された液体処理のための方法及び装置
JP2005138053A (ja) * 2003-11-07 2005-06-02 Sumitomo Precision Prod Co Ltd 基板洗浄装置
JP4451175B2 (ja) * 2004-03-19 2010-04-14 大日本スクリーン製造株式会社 ノズル洗浄装置および基板処理装置
JP4347765B2 (ja) * 2004-07-21 2009-10-21 大日本スクリーン製造株式会社 基板処理装置
JP2006120666A (ja) * 2004-10-19 2006-05-11 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2007237363A (ja) * 2006-03-10 2007-09-20 Komatsu Machinery Corp 基板表面加工装置
JP2008098227A (ja) * 2006-10-06 2008-04-24 Dainippon Screen Mfg Co Ltd 基板処理装置
JP5516447B2 (ja) * 2011-02-08 2014-06-11 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP2015015284A (ja) * 2013-07-03 2015-01-22 株式会社荏原製作所 基板洗浄装置および基板洗浄方法
JP6298277B2 (ja) * 2013-12-03 2018-03-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP5994804B2 (ja) * 2014-03-17 2016-09-21 東京エレクトロン株式会社 基板洗浄方法
JP6600470B2 (ja) 2014-04-01 2019-10-30 株式会社荏原製作所 洗浄装置及び洗浄方法
JP6375160B2 (ja) * 2014-07-08 2018-08-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
US9460944B2 (en) * 2014-07-02 2016-10-04 SCREEN Holdings Co., Ltd. Substrate treating apparatus and method of treating substrate
KR102285832B1 (ko) * 2014-07-25 2021-08-05 삼성전자주식회사 기판 처리 장치 및 기판 처리 방법
US10037902B2 (en) * 2015-03-27 2018-07-31 SCREEN Holdings Co., Ltd. Substrate processing device and substrate processing method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014132641A (ja) * 2012-12-06 2014-07-17 Ebara Corp 基板洗浄装置及び基板洗浄方法

Also Published As

Publication number Publication date
TW201829073A (zh) 2018-08-16
WO2018146897A1 (ja) 2018-08-16
CN110192267A (zh) 2019-08-30
JP2018129422A (ja) 2018-08-16
KR20190094427A (ko) 2019-08-13
TWI686243B (zh) 2020-03-01
CN110192267B (zh) 2023-03-17
JP6812262B2 (ja) 2021-01-13

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