JP6797526B2 - 基板洗浄装置 - Google Patents

基板洗浄装置 Download PDF

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Publication number
JP6797526B2
JP6797526B2 JP2015218517A JP2015218517A JP6797526B2 JP 6797526 B2 JP6797526 B2 JP 6797526B2 JP 2015218517 A JP2015218517 A JP 2015218517A JP 2015218517 A JP2015218517 A JP 2015218517A JP 6797526 B2 JP6797526 B2 JP 6797526B2
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JP
Japan
Prior art keywords
substrate
cover
cleaning device
cleaning
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015218517A
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English (en)
Japanese (ja)
Other versions
JP2016096337A (ja
Inventor
孝一 深谷
孝一 深谷
幸次 前田
幸次 前田
知淳 石橋
知淳 石橋
央二郎 中野
央二郎 中野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to KR1020177012422A priority Critical patent/KR102324564B1/ko
Priority to CN201580061139.XA priority patent/CN107004593B/zh
Priority to PCT/JP2015/081570 priority patent/WO2016076303A1/ja
Priority to KR1020217036118A priority patent/KR102461262B1/ko
Priority to TW104137139A priority patent/TWI725003B/zh
Priority to TW109100851A priority patent/TWI741473B/zh
Publication of JP2016096337A publication Critical patent/JP2016096337A/ja
Application granted granted Critical
Publication of JP6797526B2 publication Critical patent/JP6797526B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
JP2015218517A 2014-11-11 2015-11-06 基板洗浄装置 Active JP6797526B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020177012422A KR102324564B1 (ko) 2014-11-11 2015-11-10 기판 세정 장치
CN201580061139.XA CN107004593B (zh) 2014-11-11 2015-11-10 基板清洗装置
PCT/JP2015/081570 WO2016076303A1 (ja) 2014-11-11 2015-11-10 基板洗浄装置
KR1020217036118A KR102461262B1 (ko) 2014-11-11 2015-11-10 기판 세정 장치
TW104137139A TWI725003B (zh) 2014-11-11 2015-11-11 基板洗淨裝置
TW109100851A TWI741473B (zh) 2014-11-11 2015-11-11 基板洗淨裝置及基板處理方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014229313 2014-11-11
JP2014229313 2014-11-11

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019108364A Division JP6775638B2 (ja) 2014-11-11 2019-06-11 基板洗浄装置

Publications (2)

Publication Number Publication Date
JP2016096337A JP2016096337A (ja) 2016-05-26
JP6797526B2 true JP6797526B2 (ja) 2020-12-09

Family

ID=56071339

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2015218517A Active JP6797526B2 (ja) 2014-11-11 2015-11-06 基板洗浄装置
JP2019108364A Active JP6775638B2 (ja) 2014-11-11 2019-06-11 基板洗浄装置
JP2020168861A Active JP7050875B2 (ja) 2014-11-11 2020-10-06 基板洗浄装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2019108364A Active JP6775638B2 (ja) 2014-11-11 2019-06-11 基板洗浄装置
JP2020168861A Active JP7050875B2 (ja) 2014-11-11 2020-10-06 基板洗浄装置

Country Status (4)

Country Link
JP (3) JP6797526B2 (ko)
KR (2) KR102324564B1 (ko)
CN (1) CN107004593B (ko)
TW (1) TWI725003B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7161415B2 (ja) * 2019-01-21 2022-10-26 株式会社ディスコ 加工装置

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0795540B2 (ja) * 1988-04-11 1995-10-11 株式会社日立製作所 超音波洗浄スプレイノズルを用いた基板両面の洗浄方法及び洗浄装置
JPH1070100A (ja) * 1996-08-27 1998-03-10 Matsushita Electric Ind Co Ltd 基板処理装置
JPH11283948A (ja) * 1998-03-27 1999-10-15 Dainippon Screen Mfg Co Ltd 基板回転処理装置
JP2000153210A (ja) 1998-11-19 2000-06-06 Hitachi Ltd 回転基板処理装置
JP3973196B2 (ja) * 2001-12-17 2007-09-12 東京エレクトロン株式会社 液処理方法及び液処理装置
JP4040906B2 (ja) * 2002-05-20 2008-01-30 芝浦メカトロニクス株式会社 スピン処理装置
JP2004349470A (ja) * 2003-05-22 2004-12-09 Dainippon Screen Mfg Co Ltd 基板処理装置およびその方法
KR100790273B1 (ko) * 2003-12-12 2007-12-31 동부일렉트로닉스 주식회사 펜슬 스펀지 클리닝 장치 및 그 방법
JP4464850B2 (ja) 2004-03-09 2010-05-19 株式会社ルネサステクノロジ 基板洗浄用２流体ノズル及び基板洗浄装置
JP2006114884A (ja) * 2004-09-17 2006-04-27 Ebara Corp 基板洗浄処理装置及び基板処理ユニット
JP2006286947A (ja) * 2005-03-31 2006-10-19 Toshiba Corp 電子デバイス洗浄方法及び電子デバイス洗浄装置
JP2006286665A (ja) * 2005-03-31 2006-10-19 Toshiba Corp 電子デバイス洗浄方法及び電子デバイス洗浄装置
JP4753757B2 (ja) * 2006-03-15 2011-08-24 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
KR101019445B1 (ko) * 2006-04-18 2011-03-07 도쿄엘렉트론가부시키가이샤 액 처리 장치
US7793610B2 (en) * 2006-04-18 2010-09-14 Tokyo Electron Limited Liquid processing apparatus
JP4638402B2 (ja) * 2006-10-30 2011-02-23 大日本スクリーン製造株式会社 二流体ノズル、ならびにそれを用いた基板処理装置および基板処理方法
JP2008153322A (ja) * 2006-12-15 2008-07-03 Dainippon Screen Mfg Co Ltd 二流体ノズル、基板処理装置および基板処理方法
JP2009016752A (ja) * 2007-07-09 2009-01-22 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP5242242B2 (ja) * 2007-10-17 2013-07-24 株式会社荏原製作所 基板洗浄装置
JP4929144B2 (ja) * 2007-12-10 2012-05-09 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP5031671B2 (ja) * 2008-06-03 2012-09-19 東京エレクトロン株式会社 液処理装置、液処理方法および記憶媒体
JP5712061B2 (ja) * 2011-06-16 2015-05-07 株式会社荏原製作所 基板処理方法及び基板処理ユニット
JP5667545B2 (ja) * 2011-10-24 2015-02-12 東京エレクトロン株式会社 液処理装置および液処理方法
JP5866227B2 (ja) * 2012-02-23 2016-02-17 株式会社荏原製作所 基板洗浄方法
JP2013214737A (ja) * 2012-03-09 2013-10-17 Ebara Corp 基板処理方法及び基板処理装置

Also Published As

Publication number Publication date
CN107004593A (zh) 2017-08-01
JP2019169731A (ja) 2019-10-03
TWI725003B (zh) 2021-04-21
JP6775638B2 (ja) 2020-10-28
KR20210137232A (ko) 2021-11-17
JP2021002686A (ja) 2021-01-07
JP2016096337A (ja) 2016-05-26
JP7050875B2 (ja) 2022-04-08
TW201628727A (zh) 2016-08-16
KR102461262B1 (ko) 2022-10-28
CN107004593B (zh) 2021-06-11
KR102324564B1 (ko) 2021-11-09
KR20170084073A (ko) 2017-07-19

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