JP6787124B2 - 樹脂積層膜、それを含む積層体、ｔｆｔ基板、有機ｅｌ素子カラーフィルターならびにそれらの製造方法。 - Google Patents

樹脂積層膜、それを含む積層体、ｔｆｔ基板、有機ｅｌ素子カラーフィルターならびにそれらの製造方法。 Download PDF

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Publication number
JP6787124B2
JP6787124B2 JP2016518214A JP2016518214A JP6787124B2 JP 6787124 B2 JP6787124 B2 JP 6787124B2 JP 2016518214 A JP2016518214 A JP 2016518214A JP 2016518214 A JP2016518214 A JP 2016518214A JP 6787124 B2 JP6787124 B2 JP 6787124B2
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resin
film
polyimide
laminated film
resin laminated
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JPWO2016152906A1 (ja
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耕司 上岡
耕司 上岡
潤史 脇田
潤史 脇田
野中　晴支
晴支 野中
大地 宮崎
大地 宮崎
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Toray Industries Inc
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Toray Industries Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/10—Process efficiency

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Optical Filters (AREA)
JP2016518214A 2015-03-26 2016-03-23 樹脂積層膜、それを含む積層体、ｔｆｔ基板、有機ｅｌ素子カラーフィルターならびにそれらの製造方法。 Active JP6787124B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015064014 2015-03-26
JP2015064014 2015-03-26
PCT/JP2016/059158 WO2016152906A1 (ja) 2015-03-26 2016-03-23 樹脂積層膜、それを含む積層体、ｔｆｔ基板、有機ｅｌ素子カラーフィルターならびにそれらの製造方法。

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JPWO2016152906A1 JPWO2016152906A1 (ja) 2018-02-15
JP6787124B2 true JP6787124B2 (ja) 2020-11-18

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Country Status (5)

Country Link
JP (1) JP6787124B2 (zh)
KR (1) KR102656566B1 (zh)
CN (1) CN107405907B (zh)
TW (1) TWI735434B (zh)
WO (1) WO2016152906A1 (zh)

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WO2018020333A1 (en) 2016-07-29 2018-02-01 Semiconductor Energy Laboratory Co., Ltd. Separation method, display device, display module, and electronic device
TWI753868B (zh) * 2016-08-05 2022-02-01 日商半導體能源研究所股份有限公司 剝離方法、顯示裝置、顯示模組及電子裝置
JP2018027660A (ja) * 2016-08-19 2018-02-22 コニカミノルタ株式会社 機能性積層体及びその製造方法
JP6458099B2 (ja) * 2016-09-16 2019-01-23 旭化成株式会社 ポリイミド前駆体、樹脂組成物、樹脂フィルム及びその製造方法
KR20190077015A (ko) * 2016-10-27 2019-07-02 우베 고산 가부시키가이샤 폴리이미드 및 그것을 사용한 플렉시블 디바이스
WO2018143588A1 (ko) * 2017-01-31 2018-08-09 주식회사 엘지화학 가요성 기판 제조용 적층체 및 이를 이용한 가요성 기판의 제조방법
KR102008766B1 (ko) 2017-01-31 2019-08-09 주식회사 엘지화학 가요성 기판 제조용 적층체 및 이를 이용한 가요성 기판의 제조방법
JP6787179B2 (ja) * 2017-02-27 2020-11-18 三菱ケミカル株式会社 ガラス積層体、電子デバイス作製用基板、及び電子デバイスの製造方法。
US20190333425A1 (en) * 2017-08-02 2019-10-31 Sharp Kabushiki Kaisha Flexible display device
CN111164131B (zh) * 2017-10-04 2022-08-02 三菱瓦斯化学株式会社 酰亚胺树脂、聚酰亚胺清漆和聚酰亚胺薄膜
WO2019078051A1 (ja) * 2017-10-16 2019-04-25 大日本印刷株式会社 ポリイミドフィルム、ポリイミドフィルムの製造方法、積層体、ディスプレイ用表面材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置
JP7247510B2 (ja) * 2017-10-16 2023-03-29 大日本印刷株式会社 ポリイミドフィルム、ポリイミドフィルムの製造方法、積層体、ディスプレイ用表面材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置
JP7016258B2 (ja) * 2017-12-28 2022-02-04 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルムの製造方法及びガラス－ポリイミド積層体
JP7051446B2 (ja) * 2018-01-10 2022-04-11 株式会社ジャパンディスプレイ 表示装置の製造方法
JP7363030B2 (ja) * 2018-01-17 2023-10-18 東レ株式会社 樹脂組成物、硬化膜、硬化膜のレリーフパターンの製造方法、電子部品、半導体装置、電子部品の製造方法、半導体装置の製造方法
JP7230398B2 (ja) * 2018-09-26 2023-03-01 東レ株式会社 犠牲層用樹脂組成物、およびこれを用いた半導体電子部品の製造方法
CN109679095A (zh) * 2018-12-18 2019-04-26 苏州予信天材新材料应用技术有限公司 一种耐高温型聚酰胺-聚醚酰亚胺增韧聚合物及其制备方法
JP7217220B2 (ja) * 2018-12-28 2023-02-02 日鉄ケミカル＆マテリアル株式会社 ポリイミド前駆体組成物及びそれから生じるポリイミドフィルム及びフレキシブルデバイス、ポリイミドフィルムの製造方法
KR20210014533A (ko) 2019-07-30 2021-02-09 삼성전자주식회사 적층 필름, 및 적층 필름 제조용 조성물
CN110643040B (zh) * 2019-09-03 2020-10-27 武汉华星光电半导体显示技术有限公司 聚酰亚胺前驱物、以其形成之聚酰亚胺膜和该聚酰亚胺膜之制备方法
JP7184858B2 (ja) * 2019-09-28 2022-12-06 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルム、金属張積層板及び回路基板
KR102254505B1 (ko) * 2019-12-31 2021-05-21 (주)켐이 폴리이미드계 화합물 및 이를 포함하는 감광성 조성물
CN111303423A (zh) * 2020-04-01 2020-06-19 武汉华星光电半导体显示技术有限公司 聚酰亚胺基材及其制造方法、显示面板
JP2020115238A (ja) * 2020-04-17 2020-07-30 堺ディスプレイプロダクト株式会社 フレキシブル発光デバイスの製造方法および製造装置
EP4316815A1 (en) * 2021-04-01 2024-02-07 Toray Industries, Inc. Laminate and manufacturing method of semiconductor device

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JP2811675B2 (ja) * 1988-06-23 1998-10-15 東レ株式会社 カラーフィルタ用耐熱着色ペースト
JP3641952B2 (ja) * 1998-11-05 2005-04-27 ソニーケミカル株式会社 ポリイミドフィルム及びフレキシブル基板
GB0327093D0 (en) 2003-11-21 2003-12-24 Koninkl Philips Electronics Nv Active matrix displays and other electronic devices having plastic substrates
JP5336371B2 (ja) 2006-08-10 2013-11-06 コーニンクレッカ フィリップス エヌ ヴェ アクティブ・マトリックス・ディスプレイ及びプラスチックの基体を有する他の電子デバイス
WO2010126047A1 (ja) * 2009-04-28 2010-11-04 宇部興産株式会社 多層ポリイミドフィルム
WO2013024849A1 (ja) * 2011-08-18 2013-02-21 東レ株式会社 ポリアミド酸樹脂組成物、ポリイミド樹脂組成物およびポリイミドオキサゾール樹脂組成物ならびにそれらを含有するフレキシブル基板
TWI664087B (zh) * 2012-09-27 2019-07-01 日商日鐵化學材料股份有限公司 顯示裝置之製造方法
JP2015127124A (ja) * 2013-12-27 2015-07-09 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． ガスバリアフィルム（Ｇａｓｂａｒｒｉｅｒｆｉｌｍ）及びガスバリアフィルムの製造方法

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Publication number Publication date
JPWO2016152906A1 (ja) 2018-02-15
TW201700301A (zh) 2017-01-01
KR20170131435A (ko) 2017-11-29
KR102656566B1 (ko) 2024-04-12
CN107405907A (zh) 2017-11-28
WO2016152906A1 (ja) 2016-09-29
TWI735434B (zh) 2021-08-11
CN107405907B (zh) 2019-06-18

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