JP6764370B2 - コネクタ - Google Patents
コネクタ Download PDFInfo
- Publication number
- JP6764370B2 JP6764370B2 JP2017094008A JP2017094008A JP6764370B2 JP 6764370 B2 JP6764370 B2 JP 6764370B2 JP 2017094008 A JP2017094008 A JP 2017094008A JP 2017094008 A JP2017094008 A JP 2017094008A JP 6764370 B2 JP6764370 B2 JP 6764370B2
- Authority
- JP
- Japan
- Prior art keywords
- connector
- housing
- plate
- pen
- shaped conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 claims description 76
- 239000000758 substrate Substances 0.000 claims description 62
- 230000013011 mating Effects 0.000 claims description 40
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 25
- 239000011347 resin Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000003780 insertion Methods 0.000 description 8
- 230000037431 insertion Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21L—LIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
- F21L4/00—Electric lighting devices with self-contained electric batteries or cells
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/50—Bases; Cases formed as an integral body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Description
Claims (7)
- 板状導体、導電コンタクト、及び、これらを互いに絶縁状態に保持するハウジングを有するコネクタ本体と、
ペン型電子機器の外装をなし、相手コネクタが挿入可能に構成される貫通孔を有し、前記貫通孔を形成する内壁に互いに対向する一対の溝状の段差部を有する金属製の筐体と、を備え、
前記導電コンタクトは、前記ペン型電子機器において前記板状導体とは異なる電気回路の一部を構成し、
前記相手コネクタと電気的に接続される前記コネクタ本体の先端部が前記貫通孔の内部に配置されるように、前記コネクタ本体の両側部において側方へ突出する前記板状導体の端部がそれぞれ一対の前記段差部に係合して前記内壁に固定される、コネクタ。 - 前記板状導体は、前記板状導体の端部を前記内壁に向けて付勢する弾性部を備える、請求項1に記載のコネクタ。
- 前記筐体は、前記相手コネクタを前記コネクタ本体の先端部に接続したときに、前記相手コネクタの先端が当接する当接面を有する、請求項1又は2に記載のコネクタ。
- 前記コネクタ本体の前記導電コンタクトは前記板状導体の表面と裏面に沿って配置される、請求項1〜3のいずれか一項に記載のコネクタ。
- 前記導電コンタクトは、前記コネクタ本体の先端部及び後端部において前記ハウジングから露出するように延在し、前記コネクタ本体の後端部に前記ペン型電子機器に内蔵される基板と電気的に接続される接続部を有する、請求項1〜4のいずれか一項に記載のコネクタ。
- 前記コネクタ本体の後端部に、前記コネクタ本体と前記基板の相対的な位置を決める位置決め部を有し、
前記コネクタ本体を平面視したときに、前記位置決め部は、少なくとも一つの前記導電コンタクトよりも、前記コネクタ本体の先端部から後端部に向かう方向に沿って延びる前記コネクタ本体の中心線側に配置される、請求項5に記載のコネクタ。 - 前記位置決め部は、前記導電コンタクト及び前記板状導体よりも前記方向に突出する突起を有する、請求項6に記載のコネクタ。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017094008A JP6764370B2 (ja) | 2017-05-10 | 2017-05-10 | コネクタ |
PCT/JP2018/015269 WO2018207540A1 (ja) | 2017-05-10 | 2018-04-11 | コネクタ |
CN201880026457.6A CN110582898B (zh) | 2017-05-10 | 2018-04-11 | 连接器 |
US16/610,913 US10931065B2 (en) | 2017-05-10 | 2018-04-11 | Connector including plate-shaped conductor and casing with through hole |
TW107113980A TW201902058A (zh) | 2017-05-10 | 2018-04-25 | 連接器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017094008A JP6764370B2 (ja) | 2017-05-10 | 2017-05-10 | コネクタ |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2018190652A JP2018190652A (ja) | 2018-11-29 |
JP2018190652A5 JP2018190652A5 (ja) | 2019-10-10 |
JP6764370B2 true JP6764370B2 (ja) | 2020-09-30 |
Family
ID=64104524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017094008A Expired - Fee Related JP6764370B2 (ja) | 2017-05-10 | 2017-05-10 | コネクタ |
Country Status (5)
Country | Link |
---|---|
US (1) | US10931065B2 (ja) |
JP (1) | JP6764370B2 (ja) |
CN (1) | CN110582898B (ja) |
TW (1) | TW201902058A (ja) |
WO (1) | WO2018207540A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6763340B2 (ja) * | 2017-05-10 | 2020-09-30 | I−Pex株式会社 | コネクタ |
WO2021090728A1 (ja) * | 2019-11-08 | 2021-05-14 | 株式会社ワコム | 電子ペン |
US11329414B2 (en) * | 2020-09-09 | 2022-05-10 | Google Llc | Conductive receptacle collar for desense mitigation |
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-
2017
- 2017-05-10 JP JP2017094008A patent/JP6764370B2/ja not_active Expired - Fee Related
-
2018
- 2018-04-11 US US16/610,913 patent/US10931065B2/en active Active
- 2018-04-11 WO PCT/JP2018/015269 patent/WO2018207540A1/ja active Application Filing
- 2018-04-11 CN CN201880026457.6A patent/CN110582898B/zh not_active Expired - Fee Related
- 2018-04-25 TW TW107113980A patent/TW201902058A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2018190652A (ja) | 2018-11-29 |
TW201902058A (zh) | 2019-01-01 |
CN110582898A (zh) | 2019-12-17 |
US10931065B2 (en) | 2021-02-23 |
US20200161812A1 (en) | 2020-05-21 |
CN110582898B (zh) | 2022-01-25 |
WO2018207540A1 (ja) | 2018-11-15 |
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