JP6740129B2 - 技術スケーリングのためのmram統合技法 - Google Patents
技術スケーリングのためのmram統合技法 Download PDFInfo
- Publication number
- JP6740129B2 JP6740129B2 JP2016539325A JP2016539325A JP6740129B2 JP 6740129 B2 JP6740129 B2 JP 6740129B2 JP 2016539325 A JP2016539325 A JP 2016539325A JP 2016539325 A JP2016539325 A JP 2016539325A JP 6740129 B2 JP6740129 B2 JP 6740129B2
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- Prior art keywords
- layer
- mtj
- forming
- cap
- mram
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1659—Cell access
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Hall/Mr Elements (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/109,200 | 2013-12-17 | ||
| US14/109,200 US9406875B2 (en) | 2013-12-17 | 2013-12-17 | MRAM integration techniques for technology scaling |
| PCT/US2014/070035 WO2015094974A1 (en) | 2013-12-17 | 2014-12-12 | Mram integration techniques for technology scaling |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016541123A JP2016541123A (ja) | 2016-12-28 |
| JP2016541123A5 JP2016541123A5 (enExample) | 2018-01-11 |
| JP6740129B2 true JP6740129B2 (ja) | 2020-08-12 |
Family
ID=52302353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016539325A Expired - Fee Related JP6740129B2 (ja) | 2013-12-17 | 2014-12-12 | 技術スケーリングのためのmram統合技法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US9406875B2 (enExample) |
| EP (1) | EP3084766B1 (enExample) |
| JP (1) | JP6740129B2 (enExample) |
| CN (1) | CN105830161B (enExample) |
| WO (1) | WO2015094974A1 (enExample) |
Families Citing this family (75)
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| US9257636B2 (en) | 2013-09-11 | 2016-02-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Perpendicular magnetic random-access memory (MRAM) formation by direct self-assembly method |
| KR101827294B1 (ko) * | 2013-10-31 | 2018-02-08 | 고쿠리츠켄큐카이하츠호진 카가쿠기쥬츠신코키코 | 스핀 제어 기구 및 스핀 디바이스 |
| CN106062880A (zh) | 2014-03-28 | 2016-10-26 | 英特尔公司 | 用于形成具有点接触的自由磁性层的自旋转移扭矩存储器的技术 |
| US10003014B2 (en) * | 2014-06-20 | 2018-06-19 | International Business Machines Corporation | Method of forming an on-pitch self-aligned hard mask for contact to a tunnel junction using ion beam etching |
| US9437811B2 (en) * | 2014-12-05 | 2016-09-06 | Shanghai Ciyu Information Technologies Co., Ltd. | Method for making a magnetic random access memory element with small dimension and high quality |
| US9559294B2 (en) * | 2015-01-29 | 2017-01-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Self-aligned magnetoresistive random-access memory (MRAM) structure for process damage minimization |
| US9865798B2 (en) | 2015-02-24 | 2018-01-09 | Qualcomm Incorporated | Electrode structure for resistive memory device |
| US10008662B2 (en) | 2015-03-12 | 2018-06-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Perpendicular magnetic tunneling junction (MTJ) for improved magnetoresistive random-access memory (MRAM) process |
| US9847473B2 (en) * | 2015-04-16 | 2017-12-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | MRAM structure for process damage minimization |
| US9806254B2 (en) | 2015-06-15 | 2017-10-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Storage device with composite spacer and method for manufacturing the same |
| US9685604B2 (en) * | 2015-08-31 | 2017-06-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Magnetoresistive random access memory cell and fabricating the same |
| US20170062520A1 (en) * | 2015-09-01 | 2017-03-02 | Kabushiki Kaisha Toshiba | Magnetoresistive memory device and manufacturing method of the same |
| KR102406722B1 (ko) * | 2015-09-25 | 2022-06-09 | 삼성전자주식회사 | 자기 메모리 장치 및 그 제조 방법 |
| US9660179B1 (en) | 2015-12-16 | 2017-05-23 | International Business Machines Corporation | Enhanced coercivity in MTJ devices by contact depth control |
| US10454021B2 (en) | 2016-01-29 | 2019-10-22 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and method of manufacturing the same |
| JP2017157662A (ja) * | 2016-03-01 | 2017-09-07 | ソニー株式会社 | 磁気抵抗素子及び電子デバイス |
| KR20180120151A (ko) * | 2016-03-07 | 2018-11-05 | 인텔 코포레이션 | Stt-mram 메모리 어레이를 로직 프로세서에 통합시키기 위한 접근법 및 결과적 구조체 |
| CN108713261B (zh) * | 2016-03-07 | 2023-06-02 | 英特尔公司 | 用于将自旋霍尔mtj器件嵌入逻辑处理器中的方法和所得到的结构 |
| US11469268B2 (en) * | 2016-03-18 | 2022-10-11 | Intel Corporation | Damascene-based approaches for embedding spin hall MTJ devices into a logic processor and the resulting structures |
| US10811595B2 (en) * | 2016-04-01 | 2020-10-20 | Intel Corporation | Techniques for forming logic including integrated spin-transfer torque magnetoresistive random-access memory |
| US10032828B2 (en) | 2016-07-01 | 2018-07-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor memory device and method for fabricating the same |
| US9893278B1 (en) | 2016-08-08 | 2018-02-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Embedded memory device between noncontigous interconnect metal layers |
| KR102721029B1 (ko) | 2017-01-10 | 2024-10-25 | 삼성전자주식회사 | 반도체 장치 및 이의 제조 방법 |
| KR102621752B1 (ko) * | 2017-01-13 | 2024-01-05 | 삼성전자주식회사 | Mram을 포함한 씨모스 이미지 센서 |
| KR102613512B1 (ko) * | 2017-01-19 | 2023-12-13 | 삼성전자주식회사 | 반도체 장치 및 이를 포함하는 전자 시스템 |
| US9997562B1 (en) * | 2017-03-14 | 2018-06-12 | Globalfoundries Singapore Pte. Ltd. | Mram memory device and manufacturing method thereof |
| US10510802B2 (en) * | 2017-04-13 | 2019-12-17 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device and method of manufacturing the same |
| CN108878471B (zh) * | 2017-05-09 | 2021-10-01 | 中电海康集团有限公司 | 集成电路及其制备方法 |
| CN109256405B (zh) * | 2017-07-14 | 2021-01-22 | 中电海康集团有限公司 | Mram阵列与其的制作方法 |
| CN109560103B (zh) * | 2017-09-27 | 2020-11-13 | 中电海康集团有限公司 | 磁阻式随机存储器及其制备方法 |
| US10727272B2 (en) * | 2017-11-24 | 2020-07-28 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and manufacturing method of the same |
| US10644231B2 (en) | 2017-11-30 | 2020-05-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Memory device and fabrication method thereof |
| US10741417B2 (en) * | 2017-11-30 | 2020-08-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for forming interconnect structure |
| US10374005B2 (en) * | 2017-12-29 | 2019-08-06 | Globalfoundries Singapore Pte. Ltd. | Density-controllable dummy fill strategy for near-MRAM periphery and far-outside-MRAM logic regions for embedded MRAM technology and method for producing the same |
| US10483461B2 (en) * | 2018-04-19 | 2019-11-19 | Globalfoundries Singapore Pte. Ltd. | Embedded MRAM in interconnects and method for producing the same |
| US10529913B1 (en) * | 2018-06-28 | 2020-01-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Techniques for MRAM MTJ top electrode connection |
| US10734572B2 (en) | 2018-07-18 | 2020-08-04 | Globalfoundries Singapore Pte. Ltd. | Device with capping layer for improved residue defect and method of production thereof |
| US11024344B2 (en) * | 2018-10-09 | 2021-06-01 | International Business Machines Corporation | Landing pad in interconnect and memory stacks: structure and formation of the same |
| CN116669524A (zh) | 2018-11-05 | 2023-08-29 | 联华电子股份有限公司 | 半导体装置以及其制作方法 |
| KR102518015B1 (ko) | 2019-01-31 | 2023-04-05 | 삼성전자주식회사 | 자기 저항 메모리 소자 및 그 제조 방법 |
| US11164779B2 (en) | 2019-04-12 | 2021-11-02 | International Business Machines Corporation | Bamboo tall via interconnect structures |
| US10833257B1 (en) | 2019-05-02 | 2020-11-10 | International Business Machines Corporation | Formation of embedded magnetic random-access memory devices with multi-level bottom electrode via contacts |
| TWI801609B (zh) * | 2019-06-19 | 2023-05-11 | 聯華電子股份有限公司 | 磁阻式隨機存取記憶體結構及其製作方法 |
| TWI814864B (zh) | 2019-07-12 | 2023-09-11 | 聯華電子股份有限公司 | 磁穿隧接面裝置 |
| US11282788B2 (en) | 2019-07-25 | 2022-03-22 | International Business Machines Corporation | Interconnect and memory structures formed in the BEOL |
| US11515205B2 (en) | 2019-08-30 | 2022-11-29 | Globalfoundries U.S. Inc. | Conductive structures for contacting a top electrode of an embedded memory device and methods of making such contact structures on an IC product |
| CN112466901B (zh) | 2019-09-06 | 2024-12-20 | 联华电子股份有限公司 | 半导体元件及其制作方法 |
| US11195751B2 (en) | 2019-09-13 | 2021-12-07 | International Business Machines Corporation | Bilayer barrier for interconnect and memory structures formed in the BEOL |
| US11195993B2 (en) * | 2019-09-16 | 2021-12-07 | International Business Machines Corporation | Encapsulation topography-assisted self-aligned MRAM top contact |
| US11462583B2 (en) | 2019-11-04 | 2022-10-04 | International Business Machines Corporation | Embedding magneto-resistive random-access memory devices between metal levels |
| US11444030B2 (en) | 2019-11-22 | 2022-09-13 | Globalfoundries Singapore Pte. Ltd. | Semiconductor device and method of forming the same |
| US11114153B2 (en) * | 2019-12-30 | 2021-09-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | SRAM devices with reduced coupling capacitance |
| US11302639B2 (en) | 2020-01-16 | 2022-04-12 | International Business Machines Corporation | Footing flare pedestal structure |
| US11251360B2 (en) | 2020-02-06 | 2022-02-15 | International Business Machines Corporation | MTJ capping layer structure for improved write error rate slopes and thermal stability |
| KR102759952B1 (ko) | 2020-03-18 | 2025-02-04 | 삼성전자주식회사 | 반도체 소자 및 그의 제조 방법 |
| US11502242B2 (en) | 2020-03-24 | 2022-11-15 | International Business Machines Corporation | Embedded memory devices |
| US11437568B2 (en) | 2020-03-31 | 2022-09-06 | Globalfoundries U.S. Inc. | Memory device and methods of making such a memory device |
| US11785860B2 (en) | 2020-04-13 | 2023-10-10 | Globalfoundries U.S. Inc. | Top electrode for a memory device and methods of making such a memory device |
| US11569437B2 (en) | 2020-04-22 | 2023-01-31 | Globalfoundries U.S. Inc. | Memory device comprising a top via electrode and methods of making such a memory device |
| US11361987B2 (en) | 2020-05-14 | 2022-06-14 | International Business Machines Corporation | Forming decoupled interconnects |
| US11594675B2 (en) * | 2020-06-04 | 2023-02-28 | Globalfoundries Singapore Pte. Ltd. | Magnetic tunnel junction structure and integration schemes |
| US11522131B2 (en) | 2020-07-31 | 2022-12-06 | Globalfoundries Singapore Pte Ltd | Resistive memory device and methods of making such a resistive memory device |
| US11682616B2 (en) * | 2020-08-31 | 2023-06-20 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and method for forming the same |
| US11545486B2 (en) | 2020-10-02 | 2023-01-03 | Globalfoundries Singapore Pte. Ltd. | Integrated thin film resistor and metal-insulator-metal capacitor |
| CN114335331A (zh) * | 2020-10-12 | 2022-04-12 | 联华电子股份有限公司 | 半导体元件及其制作方法 |
| US11758819B2 (en) * | 2020-12-15 | 2023-09-12 | International Business Machines Corporation | Magneto-resistive random access memory with laterally-recessed free layer |
| US11742283B2 (en) | 2020-12-31 | 2023-08-29 | Globalfoundries Singapore Pte. Ltd. | Integrated thin film resistor and memory device |
| US12245517B2 (en) | 2021-09-01 | 2025-03-04 | International Business Machines Corporation | MRAM stack with reduced height |
| US12256554B2 (en) | 2021-09-27 | 2025-03-18 | International Business Machines Corporation | Embedded MRAM integrated with super via and dummy fill |
| US12058942B2 (en) | 2021-10-28 | 2024-08-06 | International Business Machines Corporation | MRAM cell embedded in a metal layer |
| KR20230064702A (ko) | 2021-11-03 | 2023-05-11 | 삼성전자주식회사 | 반도체 소자 |
| US12342726B2 (en) | 2021-11-07 | 2025-06-24 | International Business Machines Corporation | Etching of magnetic tunnel junction (MTJ) stack for magnetoresistive random-access memory (MRAM) |
| US12464955B2 (en) | 2021-12-09 | 2025-11-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Magnetic tunnel junction device and method of forming the same |
| US12402536B2 (en) | 2022-05-31 | 2025-08-26 | International Business Machines Corporation | Magneto-resistive random access memory with hemispherical top electrode |
| US12207561B2 (en) * | 2022-12-05 | 2025-01-21 | International Business Machines Corporation | MRAM device with wrap-around top electrode |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6680500B1 (en) | 2002-07-31 | 2004-01-20 | Infineon Technologies Ag | Insulating cap layer and conductive cap layer for semiconductor devices with magnetic material layers |
| JP5243746B2 (ja) | 2007-08-07 | 2013-07-24 | ルネサスエレクトロニクス株式会社 | 磁気記憶装置の製造方法および磁気記憶装置 |
| US7781231B2 (en) | 2008-03-07 | 2010-08-24 | Qualcomm Incorporated | Method of forming a magnetic tunnel junction device |
| US8455267B2 (en) | 2009-05-14 | 2013-06-04 | Qualcomm Incorporated | Magnetic tunnel junction device and fabrication |
| US8492858B2 (en) | 2009-08-27 | 2013-07-23 | Qualcomm Incorporated | Magnetic tunnel junction device and fabrication |
| US9385308B2 (en) * | 2010-03-26 | 2016-07-05 | Qualcomm Incorporated | Perpendicular magnetic tunnel junction structure |
| US8674465B2 (en) | 2010-08-05 | 2014-03-18 | Qualcomm Incorporated | MRAM device and integration techniques compatible with logic integration |
| JP5551129B2 (ja) * | 2011-09-07 | 2014-07-16 | 株式会社東芝 | 記憶装置 |
| US8866242B2 (en) | 2011-11-10 | 2014-10-21 | Qualcomm Incorporated | MTJ structure and integration scheme |
| JP2013143548A (ja) * | 2012-01-12 | 2013-07-22 | Toshiba Corp | 磁気メモリの製造方法 |
-
2013
- 2013-12-17 US US14/109,200 patent/US9406875B2/en active Active
-
2014
- 2014-12-12 EP EP14825011.1A patent/EP3084766B1/en active Active
- 2014-12-12 CN CN201480068613.7A patent/CN105830161B/zh active Active
- 2014-12-12 JP JP2016539325A patent/JP6740129B2/ja not_active Expired - Fee Related
- 2014-12-12 WO PCT/US2014/070035 patent/WO2015094974A1/en not_active Ceased
-
2016
- 2016-07-18 US US15/213,384 patent/US9595662B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US9406875B2 (en) | 2016-08-02 |
| US20160329488A1 (en) | 2016-11-10 |
| CN105830161B (zh) | 2019-04-23 |
| JP2016541123A (ja) | 2016-12-28 |
| US9595662B2 (en) | 2017-03-14 |
| WO2015094974A1 (en) | 2015-06-25 |
| CN105830161A (zh) | 2016-08-03 |
| EP3084766B1 (en) | 2018-08-29 |
| EP3084766A1 (en) | 2016-10-26 |
| US20150171314A1 (en) | 2015-06-18 |
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