JP6732429B2 - 基板保持装置、リソグラフィ装置、及び物品の製造方法 - Google Patents

基板保持装置、リソグラフィ装置、及び物品の製造方法 Download PDF

Info

Publication number
JP6732429B2
JP6732429B2 JP2015210712A JP2015210712A JP6732429B2 JP 6732429 B2 JP6732429 B2 JP 6732429B2 JP 2015210712 A JP2015210712 A JP 2015210712A JP 2015210712 A JP2015210712 A JP 2015210712A JP 6732429 B2 JP6732429 B2 JP 6732429B2
Authority
JP
Japan
Prior art keywords
area
substrate
region
intake holes
holding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015210712A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016111343A (ja
JP2016111343A5 (enExample
Inventor
直紀 舟橋
直紀 舟橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to US14/947,702 priority Critical patent/US9740109B2/en
Priority to TW104139184A priority patent/TWI596698B/zh
Priority to CN201510845119.3A priority patent/CN105652601B/zh
Priority to KR1020150166921A priority patent/KR102002582B1/ko
Publication of JP2016111343A publication Critical patent/JP2016111343A/ja
Publication of JP2016111343A5 publication Critical patent/JP2016111343A5/ja
Application granted granted Critical
Publication of JP6732429B2 publication Critical patent/JP6732429B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Environmental & Geological Engineering (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Jigs For Machine Tools (AREA)
JP2015210712A 2014-11-28 2015-10-27 基板保持装置、リソグラフィ装置、及び物品の製造方法 Active JP6732429B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US14/947,702 US9740109B2 (en) 2014-11-28 2015-11-20 Holding device, lithography apparatus, and method for manufacturing item
TW104139184A TWI596698B (zh) 2014-11-28 2015-11-25 保持裝置、微影設備以及製造物品的方法
CN201510845119.3A CN105652601B (zh) 2014-11-28 2015-11-27 保持装置、光刻设备以及物品制造方法
KR1020150166921A KR102002582B1 (ko) 2014-11-28 2015-11-27 유지 장치, 리소그래피 장치, 및 물품 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014242525 2014-11-28
JP2014242525 2014-11-28

Publications (3)

Publication Number Publication Date
JP2016111343A JP2016111343A (ja) 2016-06-20
JP2016111343A5 JP2016111343A5 (enExample) 2019-06-27
JP6732429B2 true JP6732429B2 (ja) 2020-07-29

Family

ID=56124840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015210712A Active JP6732429B2 (ja) 2014-11-28 2015-10-27 基板保持装置、リソグラフィ装置、及び物品の製造方法

Country Status (4)

Country Link
JP (1) JP6732429B2 (enExample)
KR (1) KR102002582B1 (enExample)
CN (1) CN105652601B (enExample)
TW (1) TWI596698B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2017357A (en) * 2015-09-28 2017-09-01 Asml Netherlands Bv A Substrate Holder, a Lithographic Apparatus and Method of Manufacturing Devices
JP2017211604A (ja) * 2016-05-27 2017-11-30 株式会社大日本科研 基板吸着保持装置および露光装置
JP6774714B2 (ja) * 2016-07-25 2020-10-28 株式会社アドテックエンジニアリング ワークステージ及び露光装置
JP6894034B2 (ja) * 2016-07-25 2021-06-23 株式会社アドテックエンジニアリング ワーク吸着保持方法、ワークステージ及び露光装置
JP6978840B2 (ja) * 2017-02-28 2021-12-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板保持装置
JP7007816B2 (ja) * 2017-06-08 2022-01-25 株式会社ディスコ チャックテーブル
JP6894772B2 (ja) * 2017-06-14 2021-06-30 日本特殊陶業株式会社 真空チャック
JP7239388B2 (ja) * 2019-05-09 2023-03-14 株式会社アドテックエンジニアリング 直描式露光装置
JP7368263B2 (ja) * 2020-02-14 2023-10-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7537926B2 (ja) * 2020-07-09 2024-08-21 株式会社ディスコ ウェーハを吸引保持するチャックテーブル、及びウェーハのハーフカット方法
KR102588171B1 (ko) * 2020-09-04 2023-10-12 가부시키가이샤 스크린 홀딩스 회전 유지 장치 및 그것을 구비하는 기판 처리 장치
JP6844804B1 (ja) * 2020-11-25 2021-03-17 株式会社ブイ・テクノロジー 露光装置及び露光方法
US20220319903A1 (en) * 2021-03-31 2022-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for substrate handling
CN114603200B (zh) * 2022-05-12 2022-10-11 四川精诚致远门窗工程有限公司 一种门窗铝型材用切割装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03289154A (ja) * 1990-04-05 1991-12-19 Toshiba Corp 半導体ウエーハチャック装置
JPH07183366A (ja) * 1993-12-22 1995-07-21 Hitachi Electron Eng Co Ltd 大型ガラス基板のエア吸着方法
US6809802B1 (en) * 1999-08-19 2004-10-26 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus
JP2001215716A (ja) * 2000-02-02 2001-08-10 Orc Mfg Co Ltd ワークとマスクの分離機構
JP2002009139A (ja) * 2000-06-20 2002-01-11 Nikon Corp 静電チャック
JP2002217276A (ja) * 2001-01-17 2002-08-02 Ushio Inc ステージ装置
JP4666473B2 (ja) * 2005-05-12 2011-04-06 大日本スクリーン製造株式会社 基板熱処理装置
JP4899879B2 (ja) * 2007-01-17 2012-03-21 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP2010249706A (ja) * 2009-04-16 2010-11-04 Murata Mfg Co Ltd 電子部品移送装置用吸着ヘッド
JP5555060B2 (ja) * 2010-06-07 2014-07-23 ラピスセミコンダクタ株式会社 保護テープ剥離方法
JP2012151418A (ja) * 2011-01-21 2012-08-09 Topcon Corp 吸着ステージ
US9022392B2 (en) * 2012-08-31 2015-05-05 United Microelectronics Corporation Chuck and semiconductor process using the same
JP2014195016A (ja) * 2013-03-29 2014-10-09 Sharp Corp 半導体検査装置

Also Published As

Publication number Publication date
TWI596698B (zh) 2017-08-21
CN105652601A (zh) 2016-06-08
KR20160065017A (ko) 2016-06-08
JP2016111343A (ja) 2016-06-20
CN105652601B (zh) 2019-06-14
TW201622060A (zh) 2016-06-16
KR102002582B1 (ko) 2019-07-22

Similar Documents

Publication Publication Date Title
JP6732429B2 (ja) 基板保持装置、リソグラフィ装置、及び物品の製造方法
JP7243797B2 (ja) 搬送システム、露光装置、及び搬送方法
KR102005649B1 (ko) 기판 유지 장치, 리소그래피 장치, 및 물품의 제조 방법
US9740109B2 (en) Holding device, lithography apparatus, and method for manufacturing item
USRE48429E1 (en) Substrate holding method, substrate holding apparatus, exposure apparatus and exposure method
TWI607519B (zh) 吸引裝置、搬入方法、搬送系統及曝光裝置、以及元件製造方法
TWI770500B (zh) 基板保持裝置、曝光裝置及元件製造方法
JP6708455B2 (ja) 保持装置、保持方法、リソグラフィ装置、および物品の製造方法
JP2008103703A (ja) 基板保持装置、該基板保持装置を備える露光装置、およびデバイス製造方法
JP2001185607A (ja) 基板吸着保持装置およびデバイス製造方法
KR102169894B1 (ko) 척, 기판 보유 지지 장치, 패턴 형성 장치, 및 물품의 제조 방법
JP2004221296A (ja) 基板保持装置及び露光装置、並びにデバイス製造方法
JP2014138078A (ja) 搬送システム及び搬送方法、露光装置及び露光方法、並びにデバイス製造方法
JP6362416B2 (ja) 保持装置、リソグラフィ装置、および物品の製造方法
TWI810443B (zh) 基板保持裝置、光刻裝置及物品之製造方法
JP6844804B1 (ja) 露光装置及び露光方法
JP2003332214A (ja) 減圧装置、基板の制御方法、露光装置、半導体デバイスの製造方法
JP2023119554A (ja) 基板保持装置、基板保持方法、リソグラフィ装置及び物品の製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20181023

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190523

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20190628

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190723

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190920

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200303

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200423

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200609

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200708

R151 Written notification of patent or utility model registration

Ref document number: 6732429

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151