KR102002582B1 - 유지 장치, 리소그래피 장치, 및 물품 제조 방법 - Google Patents

유지 장치, 리소그래피 장치, 및 물품 제조 방법 Download PDF

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KR102002582B1
KR102002582B1 KR1020150166921A KR20150166921A KR102002582B1 KR 102002582 B1 KR102002582 B1 KR 102002582B1 KR 1020150166921 A KR1020150166921 A KR 1020150166921A KR 20150166921 A KR20150166921 A KR 20150166921A KR 102002582 B1 KR102002582 B1 KR 102002582B1
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substrate
area
region
intake holes
space
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Korean (ko)
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KR20160065017A (ko
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나오키 후나바시
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캐논 가부시끼가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Environmental & Geological Engineering (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Jigs For Machine Tools (AREA)
KR1020150166921A 2014-11-28 2015-11-27 유지 장치, 리소그래피 장치, 및 물품 제조 방법 Active KR102002582B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2014-242525 2014-11-28
JP2014242525 2014-11-28
JPJP-P-2015-210712 2015-10-27
JP2015210712A JP6732429B2 (ja) 2014-11-28 2015-10-27 基板保持装置、リソグラフィ装置、及び物品の製造方法

Publications (2)

Publication Number Publication Date
KR20160065017A KR20160065017A (ko) 2016-06-08
KR102002582B1 true KR102002582B1 (ko) 2019-07-22

Family

ID=56124840

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KR1020150166921A Active KR102002582B1 (ko) 2014-11-28 2015-11-27 유지 장치, 리소그래피 장치, 및 물품 제조 방법

Country Status (4)

Country Link
JP (1) JP6732429B2 (enExample)
KR (1) KR102002582B1 (enExample)
CN (1) CN105652601B (enExample)
TW (1) TWI596698B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2017357A (en) * 2015-09-28 2017-09-01 Asml Netherlands Bv A Substrate Holder, a Lithographic Apparatus and Method of Manufacturing Devices
JP2017211604A (ja) * 2016-05-27 2017-11-30 株式会社大日本科研 基板吸着保持装置および露光装置
JP6774714B2 (ja) * 2016-07-25 2020-10-28 株式会社アドテックエンジニアリング ワークステージ及び露光装置
JP6894034B2 (ja) * 2016-07-25 2021-06-23 株式会社アドテックエンジニアリング ワーク吸着保持方法、ワークステージ及び露光装置
JP6978840B2 (ja) * 2017-02-28 2021-12-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板保持装置
JP7007816B2 (ja) * 2017-06-08 2022-01-25 株式会社ディスコ チャックテーブル
JP6894772B2 (ja) * 2017-06-14 2021-06-30 日本特殊陶業株式会社 真空チャック
JP7239388B2 (ja) * 2019-05-09 2023-03-14 株式会社アドテックエンジニアリング 直描式露光装置
JP7368263B2 (ja) * 2020-02-14 2023-10-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7537926B2 (ja) * 2020-07-09 2024-08-21 株式会社ディスコ ウェーハを吸引保持するチャックテーブル、及びウェーハのハーフカット方法
KR102588171B1 (ko) * 2020-09-04 2023-10-12 가부시키가이샤 스크린 홀딩스 회전 유지 장치 및 그것을 구비하는 기판 처리 장치
JP6844804B1 (ja) * 2020-11-25 2021-03-17 株式会社ブイ・テクノロジー 露光装置及び露光方法
US20220319903A1 (en) * 2021-03-31 2022-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for substrate handling
CN114603200B (zh) * 2022-05-12 2022-10-11 四川精诚致远门窗工程有限公司 一种门窗铝型材用切割装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217276A (ja) * 2001-01-17 2002-08-02 Ushio Inc ステージ装置
JP2010249706A (ja) * 2009-04-16 2010-11-04 Murata Mfg Co Ltd 電子部品移送装置用吸着ヘッド
JP2011258638A (ja) * 2010-06-07 2011-12-22 Lapis Semiconductor Co Ltd 保護テープ剥離方法
JP2014195016A (ja) * 2013-03-29 2014-10-09 Sharp Corp 半導体検査装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03289154A (ja) * 1990-04-05 1991-12-19 Toshiba Corp 半導体ウエーハチャック装置
JPH07183366A (ja) * 1993-12-22 1995-07-21 Hitachi Electron Eng Co Ltd 大型ガラス基板のエア吸着方法
US6809802B1 (en) * 1999-08-19 2004-10-26 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus
JP2001215716A (ja) * 2000-02-02 2001-08-10 Orc Mfg Co Ltd ワークとマスクの分離機構
JP2002009139A (ja) * 2000-06-20 2002-01-11 Nikon Corp 静電チャック
JP4666473B2 (ja) * 2005-05-12 2011-04-06 大日本スクリーン製造株式会社 基板熱処理装置
JP4899879B2 (ja) * 2007-01-17 2012-03-21 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP2012151418A (ja) * 2011-01-21 2012-08-09 Topcon Corp 吸着ステージ
US9022392B2 (en) * 2012-08-31 2015-05-05 United Microelectronics Corporation Chuck and semiconductor process using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217276A (ja) * 2001-01-17 2002-08-02 Ushio Inc ステージ装置
JP2010249706A (ja) * 2009-04-16 2010-11-04 Murata Mfg Co Ltd 電子部品移送装置用吸着ヘッド
JP2011258638A (ja) * 2010-06-07 2011-12-22 Lapis Semiconductor Co Ltd 保護テープ剥離方法
JP2014195016A (ja) * 2013-03-29 2014-10-09 Sharp Corp 半導体検査装置

Also Published As

Publication number Publication date
TWI596698B (zh) 2017-08-21
CN105652601A (zh) 2016-06-08
JP6732429B2 (ja) 2020-07-29
KR20160065017A (ko) 2016-06-08
JP2016111343A (ja) 2016-06-20
CN105652601B (zh) 2019-06-14
TW201622060A (zh) 2016-06-16

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