JP6730999B2 - 過酷な環境での電子機器用途のための高信頼性無鉛はんだ合金 - Google Patents

過酷な環境での電子機器用途のための高信頼性無鉛はんだ合金 Download PDF

Info

Publication number
JP6730999B2
JP6730999B2 JP2017557168A JP2017557168A JP6730999B2 JP 6730999 B2 JP6730999 B2 JP 6730999B2 JP 2017557168 A JP2017557168 A JP 2017557168A JP 2017557168 A JP2017557168 A JP 2017557168A JP 6730999 B2 JP6730999 B2 JP 6730999B2
Authority
JP
Japan
Prior art keywords
solder
alloy
solder alloy
alloys
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017557168A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018518368A5 (https=
JP2018518368A (ja
Inventor
リュウ，ウェイピン
リー，ニン−チェン
Original Assignee
インディウム コーポレーション
インディウム コーポレーション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by インディウム コーポレーション, インディウム コーポレーション filed Critical インディウム コーポレーション
Publication of JP2018518368A publication Critical patent/JP2018518368A/ja
Publication of JP2018518368A5 publication Critical patent/JP2018518368A5/ja
Application granted granted Critical
Publication of JP6730999B2 publication Critical patent/JP6730999B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H10W70/24—Conductive package substrates serving as an interconnection, e.g. metal plates characterised by materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01223—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in liquid form, e.g. by dispensing droplets or by screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
JP2017557168A 2015-05-05 2016-05-05 過酷な環境での電子機器用途のための高信頼性無鉛はんだ合金 Active JP6730999B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562157302P 2015-05-05 2015-05-05
US62/157,302 2015-05-05
US15/147,137 2016-05-05
US15/147,137 US11229979B2 (en) 2015-05-05 2016-05-05 High reliability lead-free solder alloys for harsh environment electronics applications
PCT/US2016/030915 WO2016179358A1 (en) 2015-05-05 2016-05-05 High reliability lead-free solder alloys for harsh environment electronics applications

Publications (3)

Publication Number Publication Date
JP2018518368A JP2018518368A (ja) 2018-07-12
JP2018518368A5 JP2018518368A5 (https=) 2019-05-30
JP6730999B2 true JP6730999B2 (ja) 2020-07-29

Family

ID=56027204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017557168A Active JP6730999B2 (ja) 2015-05-05 2016-05-05 過酷な環境での電子機器用途のための高信頼性無鉛はんだ合金

Country Status (5)

Country Link
US (4) US11229979B2 (https=)
JP (1) JP6730999B2 (https=)
KR (2) KR102685941B1 (https=)
MY (2) MY186064A (https=)
WO (1) WO2016179358A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024034689A1 (ja) 2022-08-12 2024-02-15 千住金属工業株式会社 はんだ合金、はんだペースト及びはんだ継手
KR20250041178A (ko) 2022-08-12 2025-03-25 센주긴조쿠고교 가부시키가이샤 땜납 합금, 땜납 페이스트 및 땜납 조인트

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6516013B2 (ja) 2015-09-17 2019-05-22 富士電機株式会社 半導体装置用はんだ材
BR112018068596A2 (pt) 2016-03-22 2019-02-12 Tamura Corporation liga de soldas sem chumbo, composição de fluxo, composição de pasta de solda, placa de circuito eletrônico, e controlador eletrônico
FR3061989B1 (fr) * 2017-01-18 2020-02-14 Safran Procede de fabrication d'un module electronique de puissance par fabrication additive, substrat et module associes
US20180153951A1 (en) * 2016-12-05 2018-06-07 Mead Johnson Nutrition Company Methods for Inducing Adipocyte Browning, Improving Metabolic Flexibility, and Reducing Detrimental White Adipocyte Tissue Deposition and Dysfunction
JP6230737B1 (ja) * 2017-03-10 2017-11-15 株式会社タムラ製作所 鉛フリーはんだ合金、ソルダペースト及び電子回路基板
JP6810915B2 (ja) 2017-03-17 2021-01-13 富士電機株式会社 はんだ材
WO2018181873A1 (ja) * 2017-03-31 2018-10-04 千住金属工業株式会社 はんだ合金、ソルダペースト及びはんだ継手
KR102286739B1 (ko) * 2017-08-17 2021-08-05 현대자동차 주식회사 무연 솔더 조성물
US10456872B2 (en) 2017-09-08 2019-10-29 Tamura Corporation Lead-free solder alloy, electronic circuit substrate, and electronic device
MY199939A (en) * 2017-09-14 2023-11-30 Tamura Seisakusho Kk Lead-free solder alloy, electronic circuit substrate, and electronic control device
JP6998557B2 (ja) * 2017-09-29 2022-01-18 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた接合構造体
JP6349615B1 (ja) 2017-10-03 2018-07-04 株式会社弘輝 はんだ合金、はんだ接合材料及び電子回路基板
JP6427752B1 (ja) * 2018-03-06 2018-11-28 株式会社弘輝 はんだ合金、はんだ接合材料及び電子回路基板
WO2020115653A1 (en) * 2018-12-06 2020-06-11 Slovenská Technická Univerzita V Bratislave Active soft solder for ultrasonic soldering at higher application temperatures
TWI725664B (zh) * 2018-12-14 2021-04-21 日商千住金屬工業股份有限公司 焊料合金、焊料膏、焊料預形體及焊料接頭
JP6731034B2 (ja) 2018-12-25 2020-07-29 株式会社タムラ製作所 鉛フリーはんだ合金、はんだ接合用材料、電子回路実装基板及び電子制御装置
KR102187085B1 (ko) * 2019-01-24 2020-12-04 주식회사 경동엠텍 고온 및 진동환경에 적합한 무연솔더 합금 조성물 및 그 제조방법
US11752579B2 (en) 2019-02-26 2023-09-12 Indium Corporation High reliability leadfree solder alloys for harsh service conditions
TWI814081B (zh) * 2019-09-02 2023-09-01 美商阿爾發金屬化工公司 高溫超高可靠性合金、其製造方法及其應用
KR20240019350A (ko) * 2021-06-11 2024-02-14 인듐 코포레이션 혼합 땜납 합금 분말을 갖는 고 신뢰성 무연 땜납 페이스트
JP7133739B1 (ja) 2021-11-30 2022-09-08 株式会社タムラ製作所 接合部、電子回路基板及び半導体パッケージ
JP7079889B1 (ja) * 2021-11-30 2022-06-02 株式会社タムラ製作所 はんだ合金、はんだ接合材、ソルダペースト及び半導体パッケージ
CN119095691A (zh) * 2022-11-07 2024-12-06 富士电机株式会社 焊料材料
WO2025131329A1 (en) 2023-12-20 2025-06-26 Alpha Assembly Solutions Inc. Solder joint comprising a tin alloy and an encapsulant comprising silica particles in an epoxy resin, and electronic device
JP7640921B1 (ja) * 2024-07-23 2025-03-06 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置
JP7810934B1 (ja) * 2025-07-25 2026-02-04 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、はんだボール、はんだプリフォーム、及びはんだ継手

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56165588A (en) 1980-05-26 1981-12-19 Aoki Metal:Kk High temperature solder for copper tube joining
JP3027441B2 (ja) 1991-07-08 2000-04-04 千住金属工業株式会社 高温はんだ
WO1997009455A1 (en) * 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
KR19980068127A (ko) * 1997-02-15 1998-10-15 김광호 납땜용 무연 합금
US6179935B1 (en) 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
JP3296289B2 (ja) 1997-07-16 2002-06-24 富士電機株式会社 はんだ合金
JPH11333590A (ja) 1998-03-26 1999-12-07 Topy Ind Ltd クリープ特性に優れた高強度はんだ
JPH11291083A (ja) 1998-04-14 1999-10-26 Murata Mfg Co Ltd 半田合金
US6176947B1 (en) * 1998-12-31 2001-01-23 H-Technologies Group, Incorporated Lead-free solders
US6139979A (en) 1999-01-28 2000-10-31 Murata Manufacturing Co., Ltd. Lead-free solder and soldered article
GB9903552D0 (en) 1999-02-16 1999-04-07 Multicore Solders Ltd Reflow peak temperature reduction of solder alloys
US6517602B2 (en) * 2000-03-14 2003-02-11 Hitachi Metals, Ltd Solder ball and method for producing same
RU2254971C2 (ru) * 2000-11-16 2005-06-27 Сингапур Асахи Кемикал Энд Соулдер Индастриз Птэ. Лтд. Бессвинцовый припой
DE10135104C1 (de) * 2001-07-19 2002-09-12 Sata Farbspritztechnik Farbspritzpistole
CN1242869C (zh) 2001-07-25 2006-02-22 邓和升 无铅焊料
CN1346728A (zh) 2001-09-19 2002-05-01 大连理工大学 含稀土多合金组元无铅钎料合金
DE10319888A1 (de) 2003-04-25 2004-11-25 Siemens Ag Lotmaterial auf SnAgCu-Basis
JP2005286274A (ja) * 2004-03-31 2005-10-13 Uchihashi Estec Co Ltd はんだ付け方法
WO2006122240A2 (en) 2005-05-11 2006-11-16 American Iron & Metal Company, Inc. Tin alloy solder compositions
US20070071634A1 (en) * 2005-09-26 2007-03-29 Indium Corporation Of America Low melting temperature compliant solders
JP5142999B2 (ja) * 2006-07-05 2013-02-13 富士電機株式会社 クリームはんだ及び電子部品のはんだ付け方法
DE102006047764A1 (de) 2006-10-06 2008-04-10 W.C. Heraeus Gmbh Bleifreies Weichlot mit verbesserten Eigenschaften bei Temperaturen >150°C
JP4629016B2 (ja) * 2006-10-27 2011-02-09 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板およびヒートシンク付パワーモジュール用基板の製造方法並びにパワーモジュール
US9167704B2 (en) * 2006-12-13 2015-10-20 Halliburton Energy Services, Inc. Lead-free solder alloy for printed circuit board assemblies for high-temperature environments
KR100797161B1 (ko) * 2007-05-25 2008-01-23 한국생산기술연구원 주석-은-구리-인듐의 4원계 무연솔더 조성물
KR101243410B1 (ko) 2007-07-13 2013-03-13 센주긴조쿠고교 가부시키가이샤 차재 실장용 무납 땜납과 차재 전자 회로
US8888932B2 (en) 2007-07-18 2014-11-18 Senju Metal Industry Co., Ltd. Indium-containing lead-free solder for vehicle-mounted electronic circuits
CN101456103A (zh) 2008-11-18 2009-06-17 高新锡业（惠州）有限公司 一种无铅软钎焊料及其制造方法
WO2011151894A1 (ja) * 2010-06-01 2011-12-08 千住金属工業株式会社 鉛フリーソルダペースト
WO2012127642A1 (ja) * 2011-03-23 2012-09-27 千住金属工業株式会社 鉛フリーはんだ合金
KR20130014913A (ko) 2011-08-01 2013-02-12 금오공과대학교 산학협력단 5원계 저융점 무연 솔더 조성물
JP2013252548A (ja) * 2012-06-08 2013-12-19 Nihon Almit Co Ltd 微細部品接合用のソルダペースト
WO2014013632A1 (ja) 2012-07-19 2014-01-23 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
JP2014057974A (ja) * 2012-09-14 2014-04-03 Senju Metal Ind Co Ltd はんだ合金
JP6089564B2 (ja) * 2012-10-11 2017-03-08 株式会社富士通ゼネラル 空気調和機
JP2015077601A (ja) * 2013-04-02 2015-04-23 千住金属工業株式会社 鉛フリーはんだ合金
CN106163732B (zh) 2014-04-02 2019-03-05 千住金属工业株式会社 Led用软钎料合金及led组件
US20160279741A1 (en) * 2015-03-24 2016-09-29 Tamura Corporation Lead-free solder alloy, electronic circuit board, and electronic control device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024034689A1 (ja) 2022-08-12 2024-02-15 千住金属工業株式会社 はんだ合金、はんだペースト及びはんだ継手
KR20250041178A (ko) 2022-08-12 2025-03-25 센주긴조쿠고교 가부시키가이샤 땜납 합금, 땜납 페이스트 및 땜납 조인트
US12583061B2 (en) 2022-08-12 2026-03-24 Senju Metal Industry Co., Ltd. Solder alloy, solder paste, and solder joint

Also Published As

Publication number Publication date
MY205097A (en) 2024-10-01
US12090579B2 (en) 2024-09-17
KR102685941B1 (ko) 2024-07-17
KR102447392B1 (ko) 2022-09-27
US20250001530A1 (en) 2025-01-02
KR20180006928A (ko) 2018-01-19
US20160325384A1 (en) 2016-11-10
US11229979B2 (en) 2022-01-25
JP2018518368A (ja) 2018-07-12
WO2016179358A1 (en) 2016-11-10
US20200094353A1 (en) 2020-03-26
US20220331913A1 (en) 2022-10-20
MY186064A (en) 2021-06-18
KR20220135252A (ko) 2022-10-06
US11413709B2 (en) 2022-08-16

Similar Documents

Publication Publication Date Title
JP6730999B2 (ja) 過酷な環境での電子機器用途のための高信頼性無鉛はんだ合金
CN107635716B (zh) 用于严苛环境电子器件应用的高可靠性无铅焊料合金
CN106660153A (zh) 用于焊接的低温高可靠性锡合金
KR102667732B1 (ko) 고 신뢰성 응용을 위한 표준 sac 합금에 대한 저은 주석계 대안 땜납 합금
WO2015083661A1 (ja) はんだ材料および接合構造体
EP3707286B1 (en) High reliability lead-free solder alloy for electronic applications in extreme environments
JP7273049B2 (ja) 電子用途のコスト効率の良い鉛フリーはんだ合金
JP2018144082A (ja) はんだ合金およびそれを用いた接合構造体
JP6998557B2 (ja) はんだ合金およびそれを用いた接合構造体
JP6887183B1 (ja) はんだ合金および成形はんだ
JP4890221B2 (ja) ダイボンド材
TWI906106B (zh) 焊料合金、焊球、焊膏，及焊料接頭
JP5167068B2 (ja) ハンダボール及びハンダバンプを有する電子部材
JPH1177369A (ja) 電子部品用はんだ合金およびそれを用いた接合方法
Xiongfeng et al. Effects of Pb content on solidification behavior and microstructure on mixed solder alloy

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190418

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190418

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20191218

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200114

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200204

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200609

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200703

R150 Certificate of patent or registration of utility model

Ref document number: 6730999

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250