JP2018518368A5 - - Google Patents

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Publication number
JP2018518368A5
JP2018518368A5 JP2017557168A JP2017557168A JP2018518368A5 JP 2018518368 A5 JP2018518368 A5 JP 2018518368A5 JP 2017557168 A JP2017557168 A JP 2017557168A JP 2017557168 A JP2017557168 A JP 2017557168A JP 2018518368 A5 JP2018518368 A5 JP 2018518368A5
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Japan
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weight
residual
solder alloy
solder
optionally
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JP2017557168A
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JP6730999B2 (ja
JP2018518368A (ja
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Priority claimed from US15/147,137 external-priority patent/US11229979B2/en
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JP2017557168A 2015-05-05 2016-05-05 過酷な環境での電子機器用途のための高信頼性無鉛はんだ合金 Active JP6730999B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562157302P 2015-05-05 2015-05-05
US62/157,302 2015-05-05
US15/147,137 2016-05-05
US15/147,137 US11229979B2 (en) 2015-05-05 2016-05-05 High reliability lead-free solder alloys for harsh environment electronics applications
PCT/US2016/030915 WO2016179358A1 (en) 2015-05-05 2016-05-05 High reliability lead-free solder alloys for harsh environment electronics applications

Publications (3)

Publication Number Publication Date
JP2018518368A JP2018518368A (ja) 2018-07-12
JP2018518368A5 true JP2018518368A5 (https=) 2019-05-30
JP6730999B2 JP6730999B2 (ja) 2020-07-29

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JP2017557168A Active JP6730999B2 (ja) 2015-05-05 2016-05-05 過酷な環境での電子機器用途のための高信頼性無鉛はんだ合金

Country Status (5)

Country Link
US (4) US11229979B2 (https=)
JP (1) JP6730999B2 (https=)
KR (2) KR102685941B1 (https=)
MY (2) MY186064A (https=)
WO (1) WO2016179358A1 (https=)

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FR3061989B1 (fr) * 2017-01-18 2020-02-14 Safran Procede de fabrication d'un module electronique de puissance par fabrication additive, substrat et module associes
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KR20240019350A (ko) * 2021-06-11 2024-02-14 인듐 코포레이션 혼합 땜납 합금 분말을 갖는 고 신뢰성 무연 땜납 페이스트
JP7133739B1 (ja) 2021-11-30 2022-09-08 株式会社タムラ製作所 接合部、電子回路基板及び半導体パッケージ
JP7079889B1 (ja) * 2021-11-30 2022-06-02 株式会社タムラ製作所 はんだ合金、はんだ接合材、ソルダペースト及び半導体パッケージ
WO2024034689A1 (ja) 2022-08-12 2024-02-15 千住金属工業株式会社 はんだ合金、はんだペースト及びはんだ継手
KR20250041178A (ko) 2022-08-12 2025-03-25 센주긴조쿠고교 가부시키가이샤 땜납 합금, 땜납 페이스트 및 땜납 조인트
CN119095691A (zh) * 2022-11-07 2024-12-06 富士电机株式会社 焊料材料
WO2025131329A1 (en) 2023-12-20 2025-06-26 Alpha Assembly Solutions Inc. Solder joint comprising a tin alloy and an encapsulant comprising silica particles in an epoxy resin, and electronic device
JP7640921B1 (ja) * 2024-07-23 2025-03-06 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置
JP7810934B1 (ja) * 2025-07-25 2026-02-04 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、はんだボール、はんだプリフォーム、及びはんだ継手

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