WO2017200361A3 - 무연 솔더 합금 조성물 및 이의 제조방법 - Google Patents

무연 솔더 합금 조성물 및 이의 제조방법 Download PDF

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Publication number
WO2017200361A3
WO2017200361A3 PCT/KR2017/005294 KR2017005294W WO2017200361A3 WO 2017200361 A3 WO2017200361 A3 WO 2017200361A3 KR 2017005294 W KR2017005294 W KR 2017005294W WO 2017200361 A3 WO2017200361 A3 WO 2017200361A3
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WO
WIPO (PCT)
Prior art keywords
lead
preparation
method therefor
free solder
solder alloy
Prior art date
Application number
PCT/KR2017/005294
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English (en)
French (fr)
Other versions
WO2017200361A2 (ko
Inventor
정재필
정도현
임동욱
Original Assignee
서울시립대학교 산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 서울시립대학교 산학협력단 filed Critical 서울시립대학교 산학협력단
Priority claimed from KR1020170063042A external-priority patent/KR20170131280A/ko
Publication of WO2017200361A2 publication Critical patent/WO2017200361A2/ko
Publication of WO2017200361A3 publication Critical patent/WO2017200361A3/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/18—Metallic material, boron or silicon on other inorganic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

본 발명은 Sn-Ag-Cu 제1 합금, Sn-Bi 제2 합금; Sn-Ag 및 Sn-Cu 합금 중 선택된 1종 이상인 제3 합금 및 비구형을 포함하는 세라믹 나노 분말에 금속이 코팅된 첨가제를 포함하는 무연솔더 합금 조성물 및 이의 제조방법에 관한 것이다. 본 발명에 따르면, 독성이 없고, 납(Pb)의 독성에 의해 발생하는 환경 문제를 해결함으로써, 납 등과 같은 유해한 금속 원소가 환경에 주는 영향을 최소화할 수 있으며, 우수한 퍼짐성, 젖음성 및 기계적 특성을 갖는 무연솔더 합금 조성물 및 이의 제조방법을 제공할 수 있는 효과가 있다.
PCT/KR2017/005294 2016-05-20 2017-05-22 무연 솔더 합금 조성물 및 이의 제조방법 WO2017200361A2 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2016-0062396 2016-05-20
KR20160062396 2016-05-20
KR1020170063042A KR20170131280A (ko) 2016-05-20 2017-05-22 무연 솔더 합금 조성물 및 이의 제조방법
KR10-2017-0063042 2017-05-22

Publications (2)

Publication Number Publication Date
WO2017200361A2 WO2017200361A2 (ko) 2017-11-23
WO2017200361A3 true WO2017200361A3 (ko) 2018-01-04

Family

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Family Applications (1)

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PCT/KR2017/005294 WO2017200361A2 (ko) 2016-05-20 2017-05-22 무연 솔더 합금 조성물 및 이의 제조방법

Country Status (1)

Country Link
WO (1) WO2017200361A2 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110153587A (zh) * 2019-05-17 2019-08-23 北京康普锡威科技有限公司 一种Sn基焊料及其制备方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108526748A (zh) * 2018-03-28 2018-09-14 云南锡业锡材有限公司 一种SnBiAgSbIn低温无铅焊料合金
CN111715878A (zh) * 2020-07-01 2020-09-29 西安交通大学 一种高性能复合纳米键合材料及制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5512379A (en) * 1994-01-21 1996-04-30 Kawasumi Laboratories, Inc. Coated palladium fine powder and electroconductive paste
JP2005319470A (ja) * 2004-05-06 2005-11-17 Katsuaki Suganuma 鉛フリーはんだ材料、電子回路基板およびそれらの製造方法
KR20090084559A (ko) * 2008-02-01 2009-08-05 (주)덕산테코피아 무연솔더 페이스트용 초미세 무연 솔더 분말의 제조방법과제조장치
KR101101243B1 (ko) * 2009-07-27 2012-01-04 한국수력원자력 주식회사 고속 기계적 밀링장치를 이용한 나노 세라믹 분산강화 합금/금속 분말의 제조방법 및 이에 따라 제조되는 나노 세라믹 분산강화 합금/금속 분말
KR20160021648A (ko) * 2014-08-18 2016-02-26 주식회사 경동원 무연 솔더 합금 조성물 및 무연 솔더 합금의 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5512379A (en) * 1994-01-21 1996-04-30 Kawasumi Laboratories, Inc. Coated palladium fine powder and electroconductive paste
JP2005319470A (ja) * 2004-05-06 2005-11-17 Katsuaki Suganuma 鉛フリーはんだ材料、電子回路基板およびそれらの製造方法
KR20090084559A (ko) * 2008-02-01 2009-08-05 (주)덕산테코피아 무연솔더 페이스트용 초미세 무연 솔더 분말의 제조방법과제조장치
KR101101243B1 (ko) * 2009-07-27 2012-01-04 한국수력원자력 주식회사 고속 기계적 밀링장치를 이용한 나노 세라믹 분산강화 합금/금속 분말의 제조방법 및 이에 따라 제조되는 나노 세라믹 분산강화 합금/금속 분말
KR20160021648A (ko) * 2014-08-18 2016-02-26 주식회사 경동원 무연 솔더 합금 조성물 및 무연 솔더 합금의 제조 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110153587A (zh) * 2019-05-17 2019-08-23 北京康普锡威科技有限公司 一种Sn基焊料及其制备方法
CN110153587B (zh) * 2019-05-17 2021-06-29 北京康普锡威科技有限公司 一种Sn基焊料及其制备方法

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Publication number Publication date
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