WO2017200361A3 - 무연 솔더 합금 조성물 및 이의 제조방법 - Google Patents
무연 솔더 합금 조성물 및 이의 제조방법 Download PDFInfo
- Publication number
- WO2017200361A3 WO2017200361A3 PCT/KR2017/005294 KR2017005294W WO2017200361A3 WO 2017200361 A3 WO2017200361 A3 WO 2017200361A3 KR 2017005294 W KR2017005294 W KR 2017005294W WO 2017200361 A3 WO2017200361 A3 WO 2017200361A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- lead
- preparation
- method therefor
- free solder
- solder alloy
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
본 발명은 Sn-Ag-Cu 제1 합금, Sn-Bi 제2 합금; Sn-Ag 및 Sn-Cu 합금 중 선택된 1종 이상인 제3 합금 및 비구형을 포함하는 세라믹 나노 분말에 금속이 코팅된 첨가제를 포함하는 무연솔더 합금 조성물 및 이의 제조방법에 관한 것이다. 본 발명에 따르면, 독성이 없고, 납(Pb)의 독성에 의해 발생하는 환경 문제를 해결함으로써, 납 등과 같은 유해한 금속 원소가 환경에 주는 영향을 최소화할 수 있으며, 우수한 퍼짐성, 젖음성 및 기계적 특성을 갖는 무연솔더 합금 조성물 및 이의 제조방법을 제공할 수 있는 효과가 있다.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2016-0062396 | 2016-05-20 | ||
KR20160062396 | 2016-05-20 | ||
KR1020170063042A KR20170131280A (ko) | 2016-05-20 | 2017-05-22 | 무연 솔더 합금 조성물 및 이의 제조방법 |
KR10-2017-0063042 | 2017-05-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2017200361A2 WO2017200361A2 (ko) | 2017-11-23 |
WO2017200361A3 true WO2017200361A3 (ko) | 2018-01-04 |
Family
ID=60326270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2017/005294 WO2017200361A2 (ko) | 2016-05-20 | 2017-05-22 | 무연 솔더 합금 조성물 및 이의 제조방법 |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2017200361A2 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110153587A (zh) * | 2019-05-17 | 2019-08-23 | 北京康普锡威科技有限公司 | 一种Sn基焊料及其制备方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108526748A (zh) * | 2018-03-28 | 2018-09-14 | 云南锡业锡材有限公司 | 一种SnBiAgSbIn低温无铅焊料合金 |
CN111715878A (zh) * | 2020-07-01 | 2020-09-29 | 西安交通大学 | 一种高性能复合纳米键合材料及制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5512379A (en) * | 1994-01-21 | 1996-04-30 | Kawasumi Laboratories, Inc. | Coated palladium fine powder and electroconductive paste |
JP2005319470A (ja) * | 2004-05-06 | 2005-11-17 | Katsuaki Suganuma | 鉛フリーはんだ材料、電子回路基板およびそれらの製造方法 |
KR20090084559A (ko) * | 2008-02-01 | 2009-08-05 | (주)덕산테코피아 | 무연솔더 페이스트용 초미세 무연 솔더 분말의 제조방법과제조장치 |
KR101101243B1 (ko) * | 2009-07-27 | 2012-01-04 | 한국수력원자력 주식회사 | 고속 기계적 밀링장치를 이용한 나노 세라믹 분산강화 합금/금속 분말의 제조방법 및 이에 따라 제조되는 나노 세라믹 분산강화 합금/금속 분말 |
KR20160021648A (ko) * | 2014-08-18 | 2016-02-26 | 주식회사 경동원 | 무연 솔더 합금 조성물 및 무연 솔더 합금의 제조 방법 |
-
2017
- 2017-05-22 WO PCT/KR2017/005294 patent/WO2017200361A2/ko active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5512379A (en) * | 1994-01-21 | 1996-04-30 | Kawasumi Laboratories, Inc. | Coated palladium fine powder and electroconductive paste |
JP2005319470A (ja) * | 2004-05-06 | 2005-11-17 | Katsuaki Suganuma | 鉛フリーはんだ材料、電子回路基板およびそれらの製造方法 |
KR20090084559A (ko) * | 2008-02-01 | 2009-08-05 | (주)덕산테코피아 | 무연솔더 페이스트용 초미세 무연 솔더 분말의 제조방법과제조장치 |
KR101101243B1 (ko) * | 2009-07-27 | 2012-01-04 | 한국수력원자력 주식회사 | 고속 기계적 밀링장치를 이용한 나노 세라믹 분산강화 합금/금속 분말의 제조방법 및 이에 따라 제조되는 나노 세라믹 분산강화 합금/금속 분말 |
KR20160021648A (ko) * | 2014-08-18 | 2016-02-26 | 주식회사 경동원 | 무연 솔더 합금 조성물 및 무연 솔더 합금의 제조 방법 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110153587A (zh) * | 2019-05-17 | 2019-08-23 | 北京康普锡威科技有限公司 | 一种Sn基焊料及其制备方法 |
CN110153587B (zh) * | 2019-05-17 | 2021-06-29 | 北京康普锡威科技有限公司 | 一种Sn基焊料及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2017200361A2 (ko) | 2017-11-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY186064A (en) | High reliability lead-free solder alloys for harsh environment electronics applications | |
WO2017200361A3 (ko) | 무연 솔더 합금 조성물 및 이의 제조방법 | |
CN114161023A (zh) | 无铅焊料合金 | |
EP3766631A3 (en) | Solder compositions | |
WO2013128416A3 (en) | Silver-based alloy powder for manufacturing of 3-dimensional metal objects | |
MX2018010712A (es) | Aleacion de soldadura, esfera de soldadura, soldadura en trozo, pasta de soldadura y unión soldada. | |
WO2015160311A3 (en) | Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying metal | |
JP2012183558A (ja) | 鉛フリーはんだ合金及びそれを用いたはんだ継手 | |
JP6548537B2 (ja) | はんだ合金及びはんだ組成物 | |
JP2012061491A (ja) | 鉛フリーはんだ合金 | |
MY187963A (en) | Flux, solder alloy, joined body, and method for producing joined body | |
MX2023011401A (es) | Aleacion de soldadura, bola de soldadura y junta de soldadura. | |
JP7216419B2 (ja) | 鉛フリーはんだ合金及びはんだ継手 | |
EP3760342A4 (en) | COPPER ALLOY POWDER WITH EXCELLENT LASER ABSORPTION | |
WO2019094241A3 (en) | Cost-effective lead-free solder alloy for electronic applications | |
MY195163A (en) | Solder Alloy, Solder Powder and Solder Joint | |
PH12020550954A1 (en) | Solder alloy and solder joint | |
RU2367553C1 (ru) | Припой на основе серебра | |
JP6234488B2 (ja) | 無鉛はんだ | |
HUE059839T2 (hu) | Nagy megbízhatóságú ólommentes forraszötvözet extrém környezetekben történõ elektronikai alkalmazásokhoz | |
XU et al. | Effect of Nd on properties and microstructure of Sn-0.3 Ag-0.7 Cu-xNd lead-free solder | |
MY195909A (en) | Solder Alloy, Solder Powder, Solder Paste, and Solder Joint Obtained Using These | |
Zhang et al. | Wettability of Sn-0.3 Ag-0.7 Cu-xSb lead-free solders | |
RU2335385C1 (ru) | Припой на основе серебра | |
WO2017187378A1 (en) | Active soft solder and method of soldering |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 17799718 Country of ref document: EP Kind code of ref document: A2 |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 17799718 Country of ref document: EP Kind code of ref document: A2 |