MX2018010712A - Aleacion de soldadura, esfera de soldadura, soldadura en trozo, pasta de soldadura y unión soldada. - Google Patents
Aleacion de soldadura, esfera de soldadura, soldadura en trozo, pasta de soldadura y unión soldada.Info
- Publication number
- MX2018010712A MX2018010712A MX2018010712A MX2018010712A MX2018010712A MX 2018010712 A MX2018010712 A MX 2018010712A MX 2018010712 A MX2018010712 A MX 2018010712A MX 2018010712 A MX2018010712 A MX 2018010712A MX 2018010712 A MX2018010712 A MX 2018010712A
- Authority
- MX
- Mexico
- Prior art keywords
- solder
- mass
- suppressed
- oxides
- chip
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 12
- 229910045601 alloy Inorganic materials 0.000 title abstract 4
- 239000000956 alloy Substances 0.000 title abstract 4
- 229910001887 tin oxide Inorganic materials 0.000 abstract 2
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 238000002845 discoloration Methods 0.000 abstract 1
- 238000004649 discoloration prevention Methods 0.000 abstract 1
- 230000004927 fusion Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
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- H—ELECTRICITY
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- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H—ELECTRICITY
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
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- H—ELECTRICITY
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- H05K3/3457—Solder materials or compositions; Methods of application thereof
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- H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
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- H01L2224/13111—Tin [Sn] as principal constituent
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- H01L2224/13294—Material of the matrix with a principal constituent of the material being a liquid not provided for in groups H01L2224/132 - H01L2224/13291
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- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Powder Metallurgy (AREA)
Abstract
El objetivo de la presente invención es proporcionar una aleación de soldadura, una esfera de soldadura, soldadura en trozo, pasta de soldadura y unión soldada en la cual se suprime la declaración y se suprime el crecimiento de una película de óxido, en un ambiente con alto contenido de humedad y a temperatura elevada. La aleación de soldadura contiene 0.005% en masa de 0.1% en masa de mn, 0.001% a 0.1% de Ge y aproximadamente de 0% en masa a 4% en masa de Ag, el componente principal del resto siendo Sn. Cuando se tiene la aleación de soldadura con Sn como componente principal con un contenido de 0.005% en masa a 0.1% en masa de Mn y 0.001% en masa a 0.1% en masa de Ge da como resultado óxidos de Ge distribuidos principalmente en el lado de la superficie mas externa de una película de óxido que contiene óxidos de Sn, óxidos de Mn y óxidos de Ge, que permiten obtener un efecto de prevención de la decoloración en un entorno de alta humedad. Además, Mn y O2 reaccionan, las reacciones entre Sn y O2 se suprimen, y se suprime la producción de óxidos de Sn, y por tanto se suprime un aumento en el espesor de la película de óxido y se mejoran las propiedades de fusión.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016044779A JP6374424B2 (ja) | 2016-03-08 | 2016-03-08 | はんだ合金、はんだボール、チップソルダ、はんだペースト及びはんだ継手 |
PCT/JP2017/009169 WO2017154957A1 (ja) | 2016-03-08 | 2017-03-08 | はんだ合金、はんだボール、チップソルダ、はんだペースト及びはんだ継手 |
Publications (1)
Publication Number | Publication Date |
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MX2018010712A true MX2018010712A (es) | 2019-01-24 |
Family
ID=59790546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2018010712A MX2018010712A (es) | 2016-03-08 | 2017-03-08 | Aleacion de soldadura, esfera de soldadura, soldadura en trozo, pasta de soldadura y unión soldada. |
Country Status (14)
Country | Link |
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US (1) | US10773345B2 (es) |
EP (1) | EP3427888B1 (es) |
JP (1) | JP6374424B2 (es) |
KR (1) | KR101976343B1 (es) |
CN (1) | CN108712940B (es) |
CA (1) | CA3017098C (es) |
FI (1) | FI3427888T3 (es) |
MA (1) | MA43810A (es) |
MX (1) | MX2018010712A (es) |
MY (1) | MY175560A (es) |
PH (1) | PH12018501922B1 (es) |
RU (1) | RU2688980C1 (es) |
TW (1) | TWI629364B (es) |
WO (1) | WO2017154957A1 (es) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6731034B2 (ja) * | 2018-12-25 | 2020-07-29 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、はんだ接合用材料、電子回路実装基板及び電子制御装置 |
CN110052603B (zh) * | 2019-05-20 | 2021-06-11 | 北京工业大学 | 一种从Mn5Ge3表面制备具有Sn@MnOx核壳结构的微/纳米线的方法 |
JP6680992B1 (ja) * | 2019-05-27 | 2020-04-15 | 千住金属工業株式会社 | はんだ合金、はんだ粉末、ソルダペースト、はんだボール、ソルダプリフォーム、およびはんだ継手 |
TWI762119B (zh) * | 2020-01-06 | 2022-04-21 | 昇貿科技股份有限公司 | 無鉛無銅錫合金與用於球柵陣列封裝的錫球 |
TWI714420B (zh) * | 2020-01-06 | 2020-12-21 | 昇貿科技股份有限公司 | 無鉛無銅錫合金與用於球柵陣列封裝的錫球 |
TWI789165B (zh) * | 2021-12-14 | 2023-01-01 | 昇貿科技股份有限公司 | 無鉛無銅錫合金與用於球柵陣列封裝的錫球 |
CN114248037A (zh) * | 2021-12-28 | 2022-03-29 | 昆山市天和焊锡制造有限公司 | 一种高抗氧化性无铅焊锡材料 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3874031B2 (ja) * | 1995-11-29 | 2007-01-31 | 内橋エステック株式会社 | 無鉛はんだ合金 |
JP3753168B2 (ja) | 1999-08-20 | 2006-03-08 | 千住金属工業株式会社 | 微小チップ部品接合用ソルダペースト |
JP2001129682A (ja) * | 1999-10-29 | 2001-05-15 | Topy Ind Ltd | 熱サイクル特性に優れたSn基Pbフリー半田 |
US6517602B2 (en) | 2000-03-14 | 2003-02-11 | Hitachi Metals, Ltd | Solder ball and method for producing same |
JP2002057177A (ja) * | 2000-08-09 | 2002-02-22 | Hitachi Metals Ltd | はんだボールおよびその製造方法 |
JP2002248596A (ja) | 2001-02-27 | 2002-09-03 | Toshiba Tungaloy Co Ltd | 耐酸化性に優れる鉛レス半田ボール |
JP2003001482A (ja) * | 2001-06-19 | 2003-01-08 | Tokyo Daiichi Shoko:Kk | 無鉛半田合金 |
US20030021718A1 (en) | 2001-06-28 | 2003-01-30 | Osamu Munekata | Lead-free solder alloy |
RU2219030C1 (ru) * | 2002-05-27 | 2003-12-20 | Открытое акционерное общество "ГАЗ" | Припой для низкотемпературной пайки |
US7029542B2 (en) * | 2002-07-09 | 2006-04-18 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
JP2004058085A (ja) * | 2002-07-26 | 2004-02-26 | Senju Metal Ind Co Ltd | 鉛フリーはんだ合金 |
JP4144415B2 (ja) * | 2003-01-07 | 2008-09-03 | 千住金属工業株式会社 | 鉛フリーはんだ |
US7282175B2 (en) * | 2003-04-17 | 2007-10-16 | Senju Metal Industry Co., Ltd. | Lead-free solder |
CN100509257C (zh) * | 2003-10-07 | 2009-07-08 | 千住金属工业株式会社 | 一种无铅焊球用于生产焊锡凸起的用途以及焊锡凸起 |
US20050100474A1 (en) | 2003-11-06 | 2005-05-12 | Benlih Huang | Anti-tombstoning lead free alloys for surface mount reflow soldering |
JP3827322B2 (ja) | 2004-07-29 | 2006-09-27 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
JP2005103645A (ja) | 2004-10-29 | 2005-04-21 | Hitachi Metals Ltd | はんだボールおよびその製造方法 |
JP4904953B2 (ja) | 2006-04-06 | 2012-03-28 | 日立電線株式会社 | 配線用導体及びその製造方法並びに端末接続部並びにPbフリーはんだ合金 |
JP5584427B2 (ja) | 2009-04-14 | 2014-09-03 | 新日鉄住金マテリアルズ株式会社 | 無鉛ハンダ合金、ハンダボール及びハンダバンプを有する電子部材 |
EP2747933B1 (en) | 2011-10-04 | 2018-05-02 | Indium Corporation | A mn doped sn-base solder alloy and solder joints thereof with superior drop shock reliability |
JP5893528B2 (ja) * | 2012-07-27 | 2016-03-23 | 新日鉄住金マテリアルズ株式会社 | 無鉛はんだバンプ接合構造 |
EP2937432B1 (en) * | 2012-12-18 | 2017-11-22 | Senju Metal Industry Co., Ltd | Lead-free solder alloy |
RU2541249C2 (ru) * | 2013-02-20 | 2015-02-10 | Открытое акционерное общество "АВТОВАЗ" | Способ изготовления припоя на основе олова |
ES2881222T3 (es) | 2013-09-11 | 2021-11-29 | Senju Metal Industry Co | Circuito semiconductor que incluye una soldadura sin plomo |
CN103480978A (zh) | 2013-09-29 | 2014-01-01 | 宁波市鄞州恒迅电子材料有限公司 | 环保无铅防电极溶出焊锡丝 |
JP5880766B1 (ja) | 2015-05-26 | 2016-03-09 | 千住金属工業株式会社 | はんだ合金、はんだボール、チップソルダ、はんだペースト及びはんだ継手 |
-
2016
- 2016-03-08 JP JP2016044779A patent/JP6374424B2/ja active Active
-
2017
- 2017-03-07 TW TW106107351A patent/TWI629364B/zh active
- 2017-03-08 CA CA3017098A patent/CA3017098C/en active Active
- 2017-03-08 WO PCT/JP2017/009169 patent/WO2017154957A1/ja active Application Filing
- 2017-03-08 CN CN201780016058.7A patent/CN108712940B/zh active Active
- 2017-03-08 KR KR1020187028445A patent/KR101976343B1/ko active IP Right Grant
- 2017-03-08 RU RU2018135087A patent/RU2688980C1/ru active
- 2017-03-08 MX MX2018010712A patent/MX2018010712A/es unknown
- 2017-03-08 MY MYPI2018001542A patent/MY175560A/en unknown
- 2017-03-08 US US16/083,225 patent/US10773345B2/en active Active
- 2017-03-08 FI FIEP17763297.3T patent/FI3427888T3/fi active
- 2017-03-08 MA MA043810A patent/MA43810A/fr unknown
- 2017-03-08 EP EP17763297.3A patent/EP3427888B1/en active Active
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2018
- 2018-09-07 PH PH12018501922A patent/PH12018501922B1/en unknown
Also Published As
Publication number | Publication date |
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KR20180114953A (ko) | 2018-10-19 |
MY175560A (en) | 2020-07-01 |
EP3427888B1 (en) | 2024-04-24 |
PH12018501922A1 (en) | 2019-06-17 |
TW201804001A (zh) | 2018-02-01 |
CN108712940A (zh) | 2018-10-26 |
CN108712940B (zh) | 2019-09-24 |
JP2017159314A (ja) | 2017-09-14 |
BR112018068106A2 (pt) | 2019-04-09 |
CA3017098A1 (en) | 2017-09-14 |
RU2688980C1 (ru) | 2019-05-23 |
EP3427888A4 (en) | 2019-09-25 |
US10773345B2 (en) | 2020-09-15 |
CA3017098C (en) | 2019-10-08 |
EP3427888A1 (en) | 2019-01-16 |
MA43810A (fr) | 2018-11-28 |
US20190070696A1 (en) | 2019-03-07 |
KR101976343B1 (ko) | 2019-05-07 |
JP6374424B2 (ja) | 2018-08-15 |
BR112018068106A8 (pt) | 2022-05-31 |
FI3427888T3 (fi) | 2024-06-18 |
TWI629364B (zh) | 2018-07-11 |
PH12018501922B1 (en) | 2019-06-17 |
WO2017154957A1 (ja) | 2017-09-14 |
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