KR102685941B1 - 전자장치 적용을 위한 무연 땜납 합금 - Google Patents

전자장치 적용을 위한 무연 땜납 합금 Download PDF

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Publication number
KR102685941B1
KR102685941B1 KR1020227032815A KR20227032815A KR102685941B1 KR 102685941 B1 KR102685941 B1 KR 102685941B1 KR 1020227032815 A KR1020227032815 A KR 1020227032815A KR 20227032815 A KR20227032815 A KR 20227032815A KR 102685941 B1 KR102685941 B1 KR 102685941B1
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KR
South Korea
Prior art keywords
solder
alloy
alloys
joints
solder joints
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KR1020227032815A
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English (en)
Korean (ko)
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KR20220135252A (ko
Inventor
웨이핑 리우
닝-청 리
Original Assignee
인듐 코포레이션
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Classifications

    • H01L24/13—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H01L23/4924—
    • H01L24/29—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H10W70/24—Conductive package substrates serving as an interconnection, e.g. metal plates characterised by materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H01L2224/13109—
    • H01L2224/13111—
    • H01L2224/13113—
    • H01L2224/1312—
    • H01L2224/13139—
    • H01L2224/13147—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01223—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in liquid form, e.g. by dispensing droplets or by screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
KR1020227032815A 2015-05-05 2016-05-05 전자장치 적용을 위한 무연 땜납 합금 Active KR102685941B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201562157302P 2015-05-05 2015-05-05
US62/157,302 2015-05-05
KR1020177033626A KR102447392B1 (ko) 2015-05-05 2016-05-05 전자장치 적용을 위한 무연 땜납 합금
US15/147,137 2016-05-05
US15/147,137 US11229979B2 (en) 2015-05-05 2016-05-05 High reliability lead-free solder alloys for harsh environment electronics applications
PCT/US2016/030915 WO2016179358A1 (en) 2015-05-05 2016-05-05 High reliability lead-free solder alloys for harsh environment electronics applications

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020177033626A Division KR102447392B1 (ko) 2015-05-05 2016-05-05 전자장치 적용을 위한 무연 땜납 합금

Publications (2)

Publication Number Publication Date
KR20220135252A KR20220135252A (ko) 2022-10-06
KR102685941B1 true KR102685941B1 (ko) 2024-07-17

Family

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KR1020227032815A Active KR102685941B1 (ko) 2015-05-05 2016-05-05 전자장치 적용을 위한 무연 땜납 합금
KR1020177033626A Active KR102447392B1 (ko) 2015-05-05 2016-05-05 전자장치 적용을 위한 무연 땜납 합금

Family Applications After (1)

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Country Status (5)

Country Link
US (4) US11229979B2 (https=)
JP (1) JP6730999B2 (https=)
KR (2) KR102685941B1 (https=)
MY (2) MY186064A (https=)
WO (1) WO2016179358A1 (https=)

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FR3061989B1 (fr) * 2017-01-18 2020-02-14 Safran Procede de fabrication d'un module electronique de puissance par fabrication additive, substrat et module associes
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JP6230737B1 (ja) * 2017-03-10 2017-11-15 株式会社タムラ製作所 鉛フリーはんだ合金、ソルダペースト及び電子回路基板
JP6810915B2 (ja) 2017-03-17 2021-01-13 富士電機株式会社 はんだ材
WO2018181873A1 (ja) * 2017-03-31 2018-10-04 千住金属工業株式会社 はんだ合金、ソルダペースト及びはんだ継手
KR102286739B1 (ko) * 2017-08-17 2021-08-05 현대자동차 주식회사 무연 솔더 조성물
US10456872B2 (en) 2017-09-08 2019-10-29 Tamura Corporation Lead-free solder alloy, electronic circuit substrate, and electronic device
MY199939A (en) * 2017-09-14 2023-11-30 Tamura Seisakusho Kk Lead-free solder alloy, electronic circuit substrate, and electronic control device
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JP6349615B1 (ja) 2017-10-03 2018-07-04 株式会社弘輝 はんだ合金、はんだ接合材料及び電子回路基板
JP6427752B1 (ja) * 2018-03-06 2018-11-28 株式会社弘輝 はんだ合金、はんだ接合材料及び電子回路基板
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JP6731034B2 (ja) 2018-12-25 2020-07-29 株式会社タムラ製作所 鉛フリーはんだ合金、はんだ接合用材料、電子回路実装基板及び電子制御装置
KR102187085B1 (ko) * 2019-01-24 2020-12-04 주식회사 경동엠텍 고온 및 진동환경에 적합한 무연솔더 합금 조성물 및 그 제조방법
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TWI814081B (zh) * 2019-09-02 2023-09-01 美商阿爾發金屬化工公司 高溫超高可靠性合金、其製造方法及其應用
KR20240019350A (ko) * 2021-06-11 2024-02-14 인듐 코포레이션 혼합 땜납 합금 분말을 갖는 고 신뢰성 무연 땜납 페이스트
JP7133739B1 (ja) 2021-11-30 2022-09-08 株式会社タムラ製作所 接合部、電子回路基板及び半導体パッケージ
JP7079889B1 (ja) * 2021-11-30 2022-06-02 株式会社タムラ製作所 はんだ合金、はんだ接合材、ソルダペースト及び半導体パッケージ
WO2024034689A1 (ja) 2022-08-12 2024-02-15 千住金属工業株式会社 はんだ合金、はんだペースト及びはんだ継手
KR20250041178A (ko) 2022-08-12 2025-03-25 센주긴조쿠고교 가부시키가이샤 땜납 합금, 땜납 페이스트 및 땜납 조인트
CN119095691A (zh) * 2022-11-07 2024-12-06 富士电机株式会社 焊料材料
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JP7640921B1 (ja) * 2024-07-23 2025-03-06 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置
JP7810934B1 (ja) * 2025-07-25 2026-02-04 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、はんだボール、はんだプリフォーム、及びはんだ継手

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Also Published As

Publication number Publication date
MY205097A (en) 2024-10-01
US12090579B2 (en) 2024-09-17
KR102447392B1 (ko) 2022-09-27
US20250001530A1 (en) 2025-01-02
KR20180006928A (ko) 2018-01-19
US20160325384A1 (en) 2016-11-10
JP6730999B2 (ja) 2020-07-29
US11229979B2 (en) 2022-01-25
JP2018518368A (ja) 2018-07-12
WO2016179358A1 (en) 2016-11-10
US20200094353A1 (en) 2020-03-26
US20220331913A1 (en) 2022-10-20
MY186064A (en) 2021-06-18
KR20220135252A (ko) 2022-10-06
US11413709B2 (en) 2022-08-16

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