JP6691175B2 - フィルム型ディスプレイ基板の製造方法およびフィルム型ディスプレイ基板製造用工程フィルム - Google Patents
フィルム型ディスプレイ基板の製造方法およびフィルム型ディスプレイ基板製造用工程フィルム Download PDFInfo
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Description
130 基材
150 フィルム型ディスプレイ基板
170 工程フィルム
171 第1ベースフィルム
172 第1粘着層
180 保護フィルム
190 粘着層保護フィルム
Claims (11)
- ガラス基板の上にフィルム型ディスプレイ基板用基材を設け、
前記基材上においてパッケージング作業を進めて相互に一定の間隔で離隔する複数のセルを製作し、
前記セルの製作が完了した後前記基材の表面を工程フィルムで覆い、
前記基材が前記工程フィルムに積層された状態において、前記ガラス基板から前記基材を剥離し、
前記基材が前記工程フィルムに積層された状態における前記基材を前記セルごとにカッティングし、複数のフィルム型ディスプレイ基板を形成することを含み、
前記工程フィルムは、
前記フィルム型ディスプレイ基板を製造する過程において基材に一定の強度および平坦度を付与するために設けるベースフィルムと、
前記ベースフィルムを前記フィルム型ディスプレイ基板用基材の上に積層できるように前記ベースフィルムの下面に設ける粘着層を含み、
前記ベースフィルムの全部及び前記フィルム型ディスプレイ基板に隣接した前記粘着層の一部のみをカッティングし、粘着テープを用いて前記フィルム型ディスプレイ基板から前記工程フィルムの一部を剥がすことを含む、
フィルム型ディスプレイ基板の製造方法。 - 前記ガラス基板から前記基材を剥離することの後に、
前記基材を保護するため前記基材の背面に仕上げ用バックフィルム(Back Film)を付着することをさらに含むことを特徴とする請求項1に記載の工程フィルムを用いたフィルム型ディスプレイ基板の製造方法。 - ガラス基板の上にフィルム型ディスプレイ基板用基材を設け、
前記基材上においてパッケージング作業を進めてセルを製作し、
前記セルの製作が完了した前記基材の表面を工程フィルムで覆い、
前記基材が前記工程フィルムに積層された状態における前記ガラス基板から前記基材を剥離し、
前記基材が前記工程フィルムに積層された状態における前記基材をカッティングし、フィルム型ディスプレイ基板を形成することを含み、
前記工程フィルムは、
前記フィルム型ディスプレイ基板を製造する過程において基材に一定の強度および平坦度を付与するために設けるベースフィルムと、
前記ベースフィルムを前記フィルム型ディスプレイ基板用基材の上に積層できるように前記ベースフィルムの下面に設ける粘着層を含み、
前記ベースフィルムの全部及び前記フィルム型ディスプレイ基板に隣接した前記粘着層の一部のみをカッティングし、粘着テープを用いて前記フィルム型ディスプレイ基板から前記工程フィルムの一部を剥がすことを含む、
フィルム型ディスプレイ基板の製造方法。 - 前記ベースフィルムは、25μm乃至210μmの厚さを有し、前記粘着層は、20μm乃至150μmの厚さを有することを特徴とする請求項1に記載の工程フィルムを用いたフィルム型ディスプレイ基板の製造方法。
- 前記ベースフィルムの上に設けられ、静電気の発生を防止する帯電防止コーティング層をさらに含むことを特徴とする請求項1に記載の工程フィルムを用いたフィルム型ディスプレイ基板の製造方法。
- 前記フィルム型ディスプレイ基板を製造する過程において、前記ベースフィルムを保護すると同時に前記ベースフィルムに一定の強度および平坦度を付与するために前記ベースフィルムの上に積層される保護フィルムをさらに含むことを特徴とする請求項1に記載の工程フィルムを用いたフィルム型ディスプレイ基板の製造方法。
- 前記保護フィルムは、
第2ベースフィルムと、
前記第2ベースフィルムの上に前記ベースフィルムを接着するために前記第2ベースフィルムの下面に設けられる第2粘着層を含むことを特徴とする請求項6に記載の工程フィルムを用いたフィルム型ディスプレイ基板の製造方法。 - 前記第2粘着層の粘着力は、前記粘着層の粘着力より小さいことを特徴とする請求項7に記載の工程フィルムを用いたフィルム型ディスプレイ基板の製造方法。
- 前記保護フィルムは、
前記第2ベースフィルムの上に設けられ、静電気の発生を防止する第2帯電防止コーティング層と、
前記第2ベースフィルムの下面に設けられ、静電気の発生を防止する第3帯電防止コーティング層をさらに含むことを特徴とする請求項7に記載の工程フィルムを用いたフィルム型ディスプレイ基板の製造方法。 - 前記ベースフィルムが前記基材に積層されるまで前記粘着層の汚染を防止するため前記粘着層の下に形成される粘着層保護フィルムをさらに含むことを特徴とする請求項1に記載の工程フィルムを用いたフィルム型ディスプレイ基板の製造方法。
- 前記粘着層保護フィルムは、
第3ベースフィルムと、
前記第3ベースフィルムの上に設けられ、静電気の発生を防止する第4帯電防止コーティング層と、
前記第3ベースフィルムの下に設けられ、静電気の発生を防止する第5帯電防止コーティング層を含むことを特徴とする請求項10に記載の工程フィルムを用いたフィルム型ディスプレイ基板の製造方法。
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DE102013106631B4 (de) * | 2013-06-25 | 2017-07-27 | Osram Oled Gmbh | Verfahren zum Bearbeiten eines elektronischen Bauelements und elektronische Bauelementeanordnung |
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US11084270B2 (en) | 2021-08-10 |
US20140318690A1 (en) | 2014-10-30 |
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