JP6633243B2 - メモリモジュールの電気的結合において電子バンドギャップ（ｅｂｇ）構造を提供する回路および方法 - Google Patents

メモリモジュールの電気的結合において電子バンドギャップ（ｅｂｇ）構造を提供する回路および方法 Download PDF

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JP6633243B2
JP6633243B2 JP2019504126A JP2019504126A JP6633243B2 JP 6633243 B2 JP6633243 B2 JP 6633243B2 JP 2019504126 A JP2019504126 A JP 2019504126A JP 2019504126 A JP2019504126 A JP 2019504126A JP 6633243 B2 JP6633243 B2 JP 6633243B2
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Prior art keywords
dimm
memory module
circuit board
ground plane
printed circuit
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JP2019504126A
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Japanese (ja)
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JP2019525472A5 (enExample
JP2019525472A (ja
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パスマナサン、プリヤサルシャン
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Qualcomm Inc
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Qualcomm Inc
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0236—Electromagnetic band-gap structures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • G06F13/4063—Device-to-bus coupling
    • G06F13/4068—Electrical coupling
    • G06F13/4086—Bus impedance matching, e.g. termination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Layout of the interconnection structure
    • H01L23/5286—Arrangements of power or ground buses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Structure Of Printed Boards (AREA)
JP2019504126A 2016-07-28 2017-07-26 メモリモジュールの電気的結合において電子バンドギャップ（ｅｂｇ）構造を提供する回路および方法 Active JP6633243B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662367836P 2016-07-28 2016-07-28
US62/367,836 2016-07-28
US15/659,187 2017-07-25
US15/659,187 US10349513B2 (en) 2016-07-28 2017-07-25 Circuits and methods providing electronic band gap (EBG) structures at memory module electrical coupling
PCT/US2017/043844 WO2018022687A1 (en) 2016-07-28 2017-07-26 Circuits and methods providing electronic band gap (ebg) structures at memory module electrical coupling

Publications (3)

Publication Number Publication Date
JP2019525472A JP2019525472A (ja) 2019-09-05
JP2019525472A5 JP2019525472A5 (enExample) 2019-10-17
JP6633243B2 true JP6633243B2 (ja) 2020-01-22

Family

ID=61010581

Family Applications (1)

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JP2019504126A Active JP6633243B2 (ja) 2016-07-28 2017-07-26 メモリモジュールの電気的結合において電子バンドギャップ（ｅｂｇ）構造を提供する回路および方法

Country Status (9)

Country Link
US (1) US10349513B2 (enExample)
EP (1) EP3491898B1 (enExample)
JP (1) JP6633243B2 (enExample)
KR (1) KR102078065B1 (enExample)
CN (1) CN109565925B (enExample)
AU (1) AU2017302566B9 (enExample)
BR (1) BR112019001333B1 (enExample)
TW (1) TWI695658B (enExample)
WO (1) WO2018022687A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11169940B2 (en) * 2019-02-20 2021-11-09 Qualcomm Incorporated Trace length on printed circuit board (PCB) based on input/output (I/O) operating speed
TWI795644B (zh) * 2020-06-02 2023-03-11 大陸商上海兆芯集成電路有限公司 電子總成
JP7529628B2 (ja) * 2021-07-26 2024-08-06 株式会社日立製作所 プリント配線板及び情報処理装置

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Also Published As

Publication number Publication date
AU2017302566B2 (en) 2020-08-27
TWI695658B (zh) 2020-06-01
BR112019001333B1 (pt) 2024-01-02
AU2017302566B9 (en) 2020-12-24
EP3491898C0 (en) 2024-09-25
TW201804885A (zh) 2018-02-01
US20180035533A1 (en) 2018-02-01
US10349513B2 (en) 2019-07-09
EP3491898A1 (en) 2019-06-05
AU2017302566A1 (en) 2019-01-17
JP2019525472A (ja) 2019-09-05
BR112019001333A2 (pt) 2019-05-07
WO2018022687A1 (en) 2018-02-01
CN109565925A (zh) 2019-04-02
CN109565925B (zh) 2022-01-18
EP3491898B1 (en) 2024-09-25
KR102078065B1 (ko) 2020-02-17
KR20190029613A (ko) 2019-03-20

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