AU2017302566B9 - Circuits and methods providing electronic band gap (EBG) structures at memory module electrical coupling - Google Patents

Circuits and methods providing electronic band gap (EBG) structures at memory module electrical coupling Download PDF

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Publication number
AU2017302566B9
AU2017302566B9 AU2017302566A AU2017302566A AU2017302566B9 AU 2017302566 B9 AU2017302566 B9 AU 2017302566B9 AU 2017302566 A AU2017302566 A AU 2017302566A AU 2017302566 A AU2017302566 A AU 2017302566A AU 2017302566 B9 AU2017302566 B9 AU 2017302566B9
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AU
Australia
Prior art keywords
dimm
memory module
circuit board
printed circuit
bus
Prior art date
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Active
Application number
AU2017302566A
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English (en)
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AU2017302566B2 (en
AU2017302566A1 (en
Inventor
Priyatharshan Pathmanathan
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Qualcomm Inc
Original Assignee
Qualcomm Inc
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Publication date
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Publication of AU2017302566A1 publication Critical patent/AU2017302566A1/en
Publication of AU2017302566B2 publication Critical patent/AU2017302566B2/en
Application granted granted Critical
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0236—Electromagnetic band-gap structures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • G06F13/4063—Device-to-bus coupling
    • G06F13/4068—Electrical coupling
    • G06F13/4086—Bus impedance matching, e.g. termination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Layout of the interconnection structure
    • H01L23/5286—Arrangements of power or ground buses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Structure Of Printed Boards (AREA)
AU2017302566A 2016-07-28 2017-07-26 Circuits and methods providing electronic band gap (EBG) structures at memory module electrical coupling Active AU2017302566B9 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662367836P 2016-07-28 2016-07-28
US62/367,836 2016-07-28
US15/659,187 2017-07-25
US15/659,187 US10349513B2 (en) 2016-07-28 2017-07-25 Circuits and methods providing electronic band gap (EBG) structures at memory module electrical coupling
PCT/US2017/043844 WO2018022687A1 (en) 2016-07-28 2017-07-26 Circuits and methods providing electronic band gap (ebg) structures at memory module electrical coupling

Publications (3)

Publication Number Publication Date
AU2017302566A1 AU2017302566A1 (en) 2019-01-17
AU2017302566B2 AU2017302566B2 (en) 2020-08-27
AU2017302566B9 true AU2017302566B9 (en) 2020-12-24

Family

ID=61010581

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2017302566A Active AU2017302566B9 (en) 2016-07-28 2017-07-26 Circuits and methods providing electronic band gap (EBG) structures at memory module electrical coupling

Country Status (9)

Country Link
US (1) US10349513B2 (enExample)
EP (1) EP3491898B1 (enExample)
JP (1) JP6633243B2 (enExample)
KR (1) KR102078065B1 (enExample)
CN (1) CN109565925B (enExample)
AU (1) AU2017302566B9 (enExample)
BR (1) BR112019001333B1 (enExample)
TW (1) TWI695658B (enExample)
WO (1) WO2018022687A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11169940B2 (en) * 2019-02-20 2021-11-09 Qualcomm Incorporated Trace length on printed circuit board (PCB) based on input/output (I/O) operating speed
TWI795644B (zh) * 2020-06-02 2023-03-11 大陸商上海兆芯集成電路有限公司 電子總成
JP7529628B2 (ja) * 2021-07-26 2024-08-06 株式会社日立製作所 プリント配線板及び情報処理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6184478B1 (en) * 1998-09-30 2001-02-06 Adtec Corporation Printed wiring device with base layer having a grid pattern
US20090037626A1 (en) * 2007-01-31 2009-02-05 Rambus, Inc. Multi-drop bus system
US20150342030A1 (en) * 2014-05-21 2015-11-26 Fujikura Ltd. Printed wiring board
US20160092351A1 (en) * 2013-06-20 2016-03-31 Hitachi, Ltd. Memory module having different types of memory mounted together thereon, and information processing device having memory module mounted therein

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WO2006052133A2 (en) * 2004-11-12 2006-05-18 Doorzand Airdrive B.V. Composition for cold preservation and perfusion of organs
KR20070062633A (ko) * 2005-12-13 2007-06-18 삼성전자주식회사 컴퓨터 시스템의 시스템 기판에 장착되는 인터페이스 소켓장치
JP2007228222A (ja) * 2006-02-23 2007-09-06 Mitsubishi Electric Corp Ｅｂｇマテリアル
KR101265245B1 (ko) 2006-11-01 2013-05-16 에이전시 포 사이언스, 테크놀로지 앤드 리서치 이중적층형 ｅｂｇ 구조체
ITRA20060064A1 (it) * 2006-11-03 2008-05-04 Fondazione Torino Wireless Dispositivo con costante dielettrica modulata per la propagazione di onde elettromagnetiche.
JP2008171834A (ja) * 2007-01-05 2008-07-24 Hitachi Ltd ガラスクロス配線基板
US7839654B2 (en) 2007-02-28 2010-11-23 International Business Machines Corporation Method for ultimate noise isolation in high-speed digital systems on packages and printed circuit boards (PCBS)
US8164006B2 (en) * 2008-03-19 2012-04-24 Samsung Electro-Mechanics Co., Ltd. Electromagnetic bandgap structure and printed circuit board
KR100956891B1 (ko) * 2008-03-19 2010-05-11 삼성전기주식회사 전자기 밴드갭 구조물 및 인쇄회로기판
KR101086856B1 (ko) * 2008-04-16 2011-11-25 주식회사 하이닉스반도체 반도체 집적 회로 모듈 및 이를 구비하는 ｐｃｂ 장치
KR101038236B1 (ko) * 2009-09-16 2011-06-01 삼성전기주식회사 전자기 밴드갭 구조를 구비하는 인쇄회로기판
JP2011108123A (ja) * 2009-11-20 2011-06-02 Elpida Memory Inc 終端基板、メモリシステム及びその反射波抑制方法
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JP2013232613A (ja) * 2012-04-05 2013-11-14 Sony Corp 配線基板及び電子機器
JP5694251B2 (ja) 2012-07-27 2015-04-01 株式会社東芝 Ｅｂｇ構造体および回路基板
JP5670392B2 (ja) * 2012-07-27 2015-02-18 株式会社東芝 回路基板
JP6125274B2 (ja) * 2013-02-27 2017-05-10 株式会社東芝 電子回路および電子機器
JP6168943B2 (ja) * 2013-09-20 2017-07-26 株式会社東芝 Ｅｂｇ構造体、半導体デバイスおよび回路基板
WO2017037957A1 (en) 2015-08-31 2017-03-09 Hitachi, Ltd. Information processing device, apparatus and connection wiring board

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
US6184478B1 (en) * 1998-09-30 2001-02-06 Adtec Corporation Printed wiring device with base layer having a grid pattern
US20090037626A1 (en) * 2007-01-31 2009-02-05 Rambus, Inc. Multi-drop bus system
US20160092351A1 (en) * 2013-06-20 2016-03-31 Hitachi, Ltd. Memory module having different types of memory mounted together thereon, and information processing device having memory module mounted therein
US20150342030A1 (en) * 2014-05-21 2015-11-26 Fujikura Ltd. Printed wiring board

Also Published As

Publication number Publication date
AU2017302566B2 (en) 2020-08-27
TWI695658B (zh) 2020-06-01
BR112019001333B1 (pt) 2024-01-02
EP3491898C0 (en) 2024-09-25
TW201804885A (zh) 2018-02-01
US20180035533A1 (en) 2018-02-01
US10349513B2 (en) 2019-07-09
JP6633243B2 (ja) 2020-01-22
EP3491898A1 (en) 2019-06-05
AU2017302566A1 (en) 2019-01-17
JP2019525472A (ja) 2019-09-05
BR112019001333A2 (pt) 2019-05-07
WO2018022687A1 (en) 2018-02-01
CN109565925A (zh) 2019-04-02
CN109565925B (zh) 2022-01-18
EP3491898B1 (en) 2024-09-25
KR102078065B1 (ko) 2020-02-17
KR20190029613A (ko) 2019-03-20

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