KR102078065B1 - 메모리 모듈 전기 커플링에서 전자 대역 갭(ebg) 구조들을 제공하는 회로들 및 방법들 - Google Patents

메모리 모듈 전기 커플링에서 전자 대역 갭(ebg) 구조들을 제공하는 회로들 및 방법들 Download PDF

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KR102078065B1
KR102078065B1 KR1020197002434A KR20197002434A KR102078065B1 KR 102078065 B1 KR102078065 B1 KR 102078065B1 KR 1020197002434 A KR1020197002434 A KR 1020197002434A KR 20197002434 A KR20197002434 A KR 20197002434A KR 102078065 B1 KR102078065 B1 KR 102078065B1
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South Korea
Prior art keywords
dimm
memory module
circuit board
printed circuit
ground plane
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KR20190029613A (ko
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프리야타르샨 파트마나탄
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퀄컴 인코포레이티드
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0236—Electromagnetic band-gap structures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • G06F13/4063—Device-to-bus coupling
    • G06F13/4068—Electrical coupling
    • G06F13/4086—Bus impedance matching, e.g. termination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Layout of the interconnection structure
    • H01L23/5286—Arrangements of power or ground buses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Structure Of Printed Boards (AREA)
KR1020197002434A 2016-07-28 2017-07-26 메모리 모듈 전기 커플링에서 전자 대역 갭(ebg) 구조들을 제공하는 회로들 및 방법들 Active KR102078065B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662367836P 2016-07-28 2016-07-28
US62/367,836 2016-07-28
US15/659,187 2017-07-25
US15/659,187 US10349513B2 (en) 2016-07-28 2017-07-25 Circuits and methods providing electronic band gap (EBG) structures at memory module electrical coupling
PCT/US2017/043844 WO2018022687A1 (en) 2016-07-28 2017-07-26 Circuits and methods providing electronic band gap (ebg) structures at memory module electrical coupling

Publications (2)

Publication Number Publication Date
KR20190029613A KR20190029613A (ko) 2019-03-20
KR102078065B1 true KR102078065B1 (ko) 2020-02-17

Family

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KR1020197002434A Active KR102078065B1 (ko) 2016-07-28 2017-07-26 메모리 모듈 전기 커플링에서 전자 대역 갭(ebg) 구조들을 제공하는 회로들 및 방법들

Country Status (9)

Country Link
US (1) US10349513B2 (enExample)
EP (1) EP3491898B1 (enExample)
JP (1) JP6633243B2 (enExample)
KR (1) KR102078065B1 (enExample)
CN (1) CN109565925B (enExample)
AU (1) AU2017302566B9 (enExample)
BR (1) BR112019001333B1 (enExample)
TW (1) TWI695658B (enExample)
WO (1) WO2018022687A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11169940B2 (en) * 2019-02-20 2021-11-09 Qualcomm Incorporated Trace length on printed circuit board (PCB) based on input/output (I/O) operating speed
TWI795644B (zh) * 2020-06-02 2023-03-11 大陸商上海兆芯集成電路有限公司 電子總成
JP7529628B2 (ja) * 2021-07-26 2024-08-06 株式会社日立製作所 プリント配線板及び情報処理装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080157901A1 (en) 2006-11-03 2008-07-03 Ladislau Matekovits Device for the propagation of electromagnetic waves with modulated dielectric constant
US20090236141A1 (en) 2008-03-19 2009-09-24 Samsung Electro-Mechanics Co., Ltd. Electromagnetic bandgap structure and printed circuit board
US20090260864A1 (en) 2008-04-16 2009-10-22 Hynix Semiconductor Inc. Circuit board and semiconductor integrated circuit module including the same
KR100956891B1 (ko) 2008-03-19 2010-05-11 삼성전기주식회사 전자기 밴드갭 구조물 및 인쇄회로기판
US20110061925A1 (en) 2009-09-16 2011-03-17 Samsung Electro-Mechanics Co., Ltd. Printed circuit board having electromagnetic bandgap structure
US20140104133A1 (en) 2010-08-12 2014-04-17 David Finn Antenna modules for dual interface smart cards, booster antenna configurations, and methods

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JP3307597B2 (ja) 1998-09-30 2002-07-24 株式会社 アドテック 印刷配線装置
JP4023166B2 (ja) 2002-01-25 2007-12-19 ソニー株式会社 高周波モジュール用基板及び高周波モジュール
WO2006052133A2 (en) * 2004-11-12 2006-05-18 Doorzand Airdrive B.V. Composition for cold preservation and perfusion of organs
KR20070062633A (ko) * 2005-12-13 2007-06-18 삼성전자주식회사 컴퓨터 시스템의 시스템 기판에 장착되는 인터페이스 소켓장치
JP2007228222A (ja) * 2006-02-23 2007-09-06 Mitsubishi Electric Corp Ｅｂｇマテリアル
KR101265245B1 (ko) 2006-11-01 2013-05-16 에이전시 포 사이언스, 테크놀로지 앤드 리서치 이중적층형 ｅｂｇ 구조체
JP2008171834A (ja) * 2007-01-05 2008-07-24 Hitachi Ltd ガラスクロス配線基板
US7768297B2 (en) 2007-01-31 2010-08-03 Rambus, Inc. Multi-drop bus system
US7839654B2 (en) 2007-02-28 2010-11-23 International Business Machines Corporation Method for ultimate noise isolation in high-speed digital systems on packages and printed circuit boards (PCBS)
JP2011108123A (ja) * 2009-11-20 2011-06-02 Elpida Memory Inc 終端基板、メモリシステム及びその反射波抑制方法
EP2574155B1 (en) * 2010-12-03 2015-07-29 Murata Manufacturing Co., Ltd. High-frequency signal line
JP2013232613A (ja) * 2012-04-05 2013-11-14 Sony Corp 配線基板及び電子機器
JP5694251B2 (ja) 2012-07-27 2015-04-01 株式会社東芝 Ｅｂｇ構造体および回路基板
JP5670392B2 (ja) * 2012-07-27 2015-02-18 株式会社東芝 回路基板
JP6125274B2 (ja) * 2013-02-27 2017-05-10 株式会社東芝 電子回路および電子機器
US9858181B2 (en) * 2013-06-20 2018-01-02 Hitachi, Ltd. Memory module having different types of memory mounted together thereon, and information processing device having memory module mounted therein
JP6168943B2 (ja) * 2013-09-20 2017-07-26 株式会社東芝 Ｅｂｇ構造体、半導体デバイスおよび回路基板
JP5690428B1 (ja) * 2014-05-21 2015-03-25 株式会社フジクラ プリント配線板
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080157901A1 (en) 2006-11-03 2008-07-03 Ladislau Matekovits Device for the propagation of electromagnetic waves with modulated dielectric constant
US20090236141A1 (en) 2008-03-19 2009-09-24 Samsung Electro-Mechanics Co., Ltd. Electromagnetic bandgap structure and printed circuit board
KR100956891B1 (ko) 2008-03-19 2010-05-11 삼성전기주식회사 전자기 밴드갭 구조물 및 인쇄회로기판
US20090260864A1 (en) 2008-04-16 2009-10-22 Hynix Semiconductor Inc. Circuit board and semiconductor integrated circuit module including the same
US20110061925A1 (en) 2009-09-16 2011-03-17 Samsung Electro-Mechanics Co., Ltd. Printed circuit board having electromagnetic bandgap structure
US20140104133A1 (en) 2010-08-12 2014-04-17 David Finn Antenna modules for dual interface smart cards, booster antenna configurations, and methods

Also Published As

Publication number Publication date
AU2017302566B2 (en) 2020-08-27
TWI695658B (zh) 2020-06-01
BR112019001333B1 (pt) 2024-01-02
AU2017302566B9 (en) 2020-12-24
EP3491898C0 (en) 2024-09-25
TW201804885A (zh) 2018-02-01
US20180035533A1 (en) 2018-02-01
US10349513B2 (en) 2019-07-09
JP6633243B2 (ja) 2020-01-22
EP3491898A1 (en) 2019-06-05
AU2017302566A1 (en) 2019-01-17
JP2019525472A (ja) 2019-09-05
BR112019001333A2 (pt) 2019-05-07
WO2018022687A1 (en) 2018-02-01
CN109565925A (zh) 2019-04-02
CN109565925B (zh) 2022-01-18
EP3491898B1 (en) 2024-09-25
KR20190029613A (ko) 2019-03-20

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