JP2019525472A5 - - Google Patents
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- Publication number
- JP2019525472A5 JP2019525472A5 JP2019504126A JP2019504126A JP2019525472A5 JP 2019525472 A5 JP2019525472 A5 JP 2019525472A5 JP 2019504126 A JP2019504126 A JP 2019504126A JP 2019504126 A JP2019504126 A JP 2019504126A JP 2019525472 A5 JP2019525472 A5 JP 2019525472A5
- Authority
- JP
- Japan
- Prior art keywords
- dimm
- memory module
- circuit board
- bus
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000009977 dual effect Effects 0.000 claims 3
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662367836P | 2016-07-28 | 2016-07-28 | |
| US62/367,836 | 2016-07-28 | ||
| US15/659,187 | 2017-07-25 | ||
| US15/659,187 US10349513B2 (en) | 2016-07-28 | 2017-07-25 | Circuits and methods providing electronic band gap (EBG) structures at memory module electrical coupling |
| PCT/US2017/043844 WO2018022687A1 (en) | 2016-07-28 | 2017-07-26 | Circuits and methods providing electronic band gap (ebg) structures at memory module electrical coupling |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019525472A JP2019525472A (ja) | 2019-09-05 |
| JP2019525472A5 true JP2019525472A5 (enExample) | 2019-10-17 |
| JP6633243B2 JP6633243B2 (ja) | 2020-01-22 |
Family
ID=61010581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019504126A Active JP6633243B2 (ja) | 2016-07-28 | 2017-07-26 | メモリモジュールの電気的結合において電子バンドギャップ（ｅｂｇ）構造を提供する回路および方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US10349513B2 (enExample) |
| EP (1) | EP3491898B1 (enExample) |
| JP (1) | JP6633243B2 (enExample) |
| KR (1) | KR102078065B1 (enExample) |
| CN (1) | CN109565925B (enExample) |
| AU (1) | AU2017302566B9 (enExample) |
| BR (1) | BR112019001333B1 (enExample) |
| TW (1) | TWI695658B (enExample) |
| WO (1) | WO2018022687A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11169940B2 (en) * | 2019-02-20 | 2021-11-09 | Qualcomm Incorporated | Trace length on printed circuit board (PCB) based on input/output (I/O) operating speed |
| TWI795644B (zh) * | 2020-06-02 | 2023-03-11 | 大陸商上海兆芯集成電路有限公司 | 電子總成 |
| JP7529628B2 (ja) * | 2021-07-26 | 2024-08-06 | 株式会社日立製作所 | プリント配線板及び情報処理装置 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3876964A (en) | 1973-08-23 | 1975-04-08 | Amp Inc | Flat flexible transmission cable |
| JP3307597B2 (ja) | 1998-09-30 | 2002-07-24 | 株式会社 アドテック | 印刷配線装置 |
| JP4023166B2 (ja) | 2002-01-25 | 2007-12-19 | ソニー株式会社 | 高周波モジュール用基板及び高周波モジュール |
| WO2006052133A2 (en) * | 2004-11-12 | 2006-05-18 | Doorzand Airdrive B.V. | Composition for cold preservation and perfusion of organs |
| KR20070062633A (ko) * | 2005-12-13 | 2007-06-18 | 삼성전자주식회사 | 컴퓨터 시스템의 시스템 기판에 장착되는 인터페이스 소켓장치 |
| JP2007228222A (ja) * | 2006-02-23 | 2007-09-06 | Mitsubishi Electric Corp | Ｅｂｇマテリアル |
| KR101265245B1 (ko) | 2006-11-01 | 2013-05-16 | 에이전시 포 사이언스, 테크놀로지 앤드 리서치 | 이중적층형 ｅｂｇ 구조체 |
| ITRA20060064A1 (it) * | 2006-11-03 | 2008-05-04 | Fondazione Torino Wireless | Dispositivo con costante dielettrica modulata per la propagazione di onde elettromagnetiche. |
| JP2008171834A (ja) * | 2007-01-05 | 2008-07-24 | Hitachi Ltd | ガラスクロス配線基板 |
| US7768297B2 (en) | 2007-01-31 | 2010-08-03 | Rambus, Inc. | Multi-drop bus system |
| US7839654B2 (en) | 2007-02-28 | 2010-11-23 | International Business Machines Corporation | Method for ultimate noise isolation in high-speed digital systems on packages and printed circuit boards (PCBS) |
| US8164006B2 (en) * | 2008-03-19 | 2012-04-24 | Samsung Electro-Mechanics Co., Ltd. | Electromagnetic bandgap structure and printed circuit board |
| KR100956891B1 (ko) * | 2008-03-19 | 2010-05-11 | 삼성전기주식회사 | 전자기 밴드갭 구조물 및 인쇄회로기판 |
| KR101086856B1 (ko) * | 2008-04-16 | 2011-11-25 | 주식회사 하이닉스반도체 | 반도체 집적 회로 모듈 및 이를 구비하는 ｐｃｂ 장치 |
| KR101038236B1 (ko) * | 2009-09-16 | 2011-06-01 | 삼성전기주식회사 | 전자기 밴드갭 구조를 구비하는 인쇄회로기판 |
| JP2011108123A (ja) * | 2009-11-20 | 2011-06-02 | Elpida Memory Inc | 終端基板、メモリシステム及びその反射波抑制方法 |
| US9112272B2 (en) * | 2010-08-12 | 2015-08-18 | Feinics Amatech Teoranta | Antenna modules for dual interface smart cards, booster antenna configurations, and methods |
| EP2574155B1 (en) * | 2010-12-03 | 2015-07-29 | Murata Manufacturing Co., Ltd. | High-frequency signal line |
| JP2013232613A (ja) * | 2012-04-05 | 2013-11-14 | Sony Corp | 配線基板及び電子機器 |
| JP5694251B2 (ja) | 2012-07-27 | 2015-04-01 | 株式会社東芝 | Ｅｂｇ構造体および回路基板 |
| JP5670392B2 (ja) * | 2012-07-27 | 2015-02-18 | 株式会社東芝 | 回路基板 |
| JP6125274B2 (ja) * | 2013-02-27 | 2017-05-10 | 株式会社東芝 | 電子回路および電子機器 |
| US9858181B2 (en) * | 2013-06-20 | 2018-01-02 | Hitachi, Ltd. | Memory module having different types of memory mounted together thereon, and information processing device having memory module mounted therein |
| JP6168943B2 (ja) * | 2013-09-20 | 2017-07-26 | 株式会社東芝 | Ｅｂｇ構造体、半導体デバイスおよび回路基板 |
| JP5690428B1 (ja) * | 2014-05-21 | 2015-03-25 | 株式会社フジクラ | プリント配線板 |
| WO2017037957A1 (en) | 2015-08-31 | 2017-03-09 | Hitachi, Ltd. | Information processing device, apparatus and connection wiring board |
-
2017
- 2017-07-25 US US15/659,187 patent/US10349513B2/en active Active
- 2017-07-26 BR BR112019001333-4A patent/BR112019001333B1/pt active IP Right Grant
- 2017-07-26 KR KR1020197002434A patent/KR102078065B1/ko active Active
- 2017-07-26 CN CN201780046093.3A patent/CN109565925B/zh active Active
- 2017-07-26 JP JP2019504126A patent/JP6633243B2/ja active Active
- 2017-07-26 AU AU2017302566A patent/AU2017302566B9/en active Active
- 2017-07-26 EP EP17754863.3A patent/EP3491898B1/en active Active
- 2017-07-26 WO PCT/US2017/043844 patent/WO2018022687A1/en not_active Ceased
- 2017-07-27 TW TW106125251A patent/TWI695658B/zh active
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