TWI441579B - 印刷電路板 - Google Patents
印刷電路板 Download PDFInfo
- Publication number
- TWI441579B TWI441579B TW099143866A TW99143866A TWI441579B TW I441579 B TWI441579 B TW I441579B TW 099143866 A TW099143866 A TW 099143866A TW 99143866 A TW99143866 A TW 99143866A TW I441579 B TWI441579 B TW I441579B
- Authority
- TW
- Taiwan
- Prior art keywords
- memory
- circuit board
- printed circuit
- slot
- connector
- Prior art date
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 15
- 239000010931 gold Substances 0.000 claims description 15
- 229910052737 gold Inorganic materials 0.000 claims description 15
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10159—Memory
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
本發明涉及一種印刷電路板。
輕、薄、短、小已成為新一代消費性電子產品的設計指標。以筆記型電腦的記憶體為例,過去薄型化產品厚度的作法之一,就是將記憶體晶片直接焊在主機板上,雖然有達到降低厚度的效果,不過也犧牲了記憶體可擴充的需求。另外一種方法就是採用水平式記憶體插槽,然,其仍然高出主機板一定的高度。
鑒於以上內容,有必要提供一種可使得插上記憶體之後整個印刷電路板的厚度基本不變。
一種印刷電路板,包括一頂層,該頂層上設置有一記憶體控制器,其中該印刷電路板開設一缺口,該缺口處設置有與該記憶體控制器電連接的複數金手指,該缺口處的金手指用於與一連接器的第一插槽相連,該連接器的第二插槽用於與一記憶體的複數金手指相連,該連接器第一插槽與第二插槽的端子對應電性相連,該記憶體的板體與該印刷電路板的板體平行。
上述印刷電路板可使得插上記憶體之後整個印刷電路板的厚度基本不變,且還可以根據需要安裝不同容量的記憶體。
10‧‧‧主機板
11‧‧‧頂層
12‧‧‧記憶體控制器
15‧‧‧缺口
16‧‧‧記憶體
17、18‧‧‧金手指
19‧‧‧連接器
190‧‧‧第一記憶體插槽
192‧‧‧第二記憶體插槽
圖1為本發明印刷電路板的較佳實施方式的示意圖。
圖2為圖1中連接器的示意圖。
請參閱圖1,本發明印刷電路板的較佳實施方式包括一頂層11(其他層圖中未示),該頂層11上設置有一記憶體控制器12。當然,諸如顯卡插槽、中央處理器插槽等元件亦設置於頂層11上,圖1中並未示出。本實施方式中,該印刷電路板為一主機板10。
該主機板10包括一缺口15,該缺口15的長度與一記憶體16的長度相當。該印刷電路板10於缺口15處設置有複數金手指18,該等金手指18透過跡線與記憶體控制器12電連接。
請一併參閱圖2,一連接器19的第一插槽用於容納缺口15處的複數金手指18,第二插槽用於容納記憶體16的複數金手指17。本實施方式中,該連接器19可利用兩個習知的記憶體插槽190及192連接而成,其中第一記憶體插槽190用於容納缺口15處的複數金手指18,第二記憶體插槽192則用於容納記憶體16的複數金手指17。由於兩記憶體插槽190及192電連接,故記憶體控制器12即可透過缺口15處的金手指18以及連接器19與記憶體16之間互相通訊。且當記憶體16插入到第二記憶體插槽192時,該記憶體16的板體與該主機板10的板體平行。
如此一來即可使得主機板10在插上記憶體16後厚度基本不變,且還可以根據需要安裝不同容量的記憶體。
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟
,以上所述者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,在爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。
10‧‧‧主機板
11‧‧‧頂層
12‧‧‧記憶體控制器
15‧‧‧缺口
17、18‧‧‧金手指
19‧‧‧連接器
16‧‧‧記憶體
Claims (2)
- 一種印刷電路板,包括一頂層,該頂層上設置有一記憶體控制器,其中該印刷電路板開設一缺口,該缺口處設置有與該記憶體控制器電連接的複數金手指,該缺口處的金手指用於插入一連接器的第一插槽內,該連接器的第二插槽用於與一記憶體的複數金手指相連,該連接器第一插槽與第二插槽的端子對應電性相連,該記憶體的板體與該印刷電路板的板體平行。
- 如申請專利範圍第1項所述之印刷電路板,其中該缺口的長度與該記憶體的長度相當。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW099143866A TWI441579B (zh) | 2010-12-15 | 2010-12-15 | 印刷電路板 |
US12/981,480 US20120152602A1 (en) | 2010-12-15 | 2010-12-30 | Printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW099143866A TWI441579B (zh) | 2010-12-15 | 2010-12-15 | 印刷電路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201225763A TW201225763A (en) | 2012-06-16 |
TWI441579B true TWI441579B (zh) | 2014-06-11 |
Family
ID=46232894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099143866A TWI441579B (zh) | 2010-12-15 | 2010-12-15 | 印刷電路板 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20120152602A1 (zh) |
TW (1) | TWI441579B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111724831A (zh) * | 2019-03-20 | 2020-09-29 | 东芝存储器株式会社 | 存储器件以及信息处理装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4400049A (en) * | 1981-08-12 | 1983-08-23 | Ncr Corporation | Connector for interconnecting circuit boards |
JPS6243479U (zh) * | 1985-09-02 | 1987-03-16 | ||
US5123848A (en) * | 1990-07-20 | 1992-06-23 | Cray Research, Inc. | Computer signal interconnect apparatus |
US6215727B1 (en) * | 2000-04-04 | 2001-04-10 | Intel Corporation | Method and apparatus for utilizing parallel memory in a serial memory system |
US6406332B1 (en) * | 2000-10-17 | 2002-06-18 | Dell Products, L.P. | Translating lockable card edge to card edge connector |
US7416452B1 (en) * | 2007-03-15 | 2008-08-26 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector |
-
2010
- 2010-12-15 TW TW099143866A patent/TWI441579B/zh not_active IP Right Cessation
- 2010-12-30 US US12/981,480 patent/US20120152602A1/en not_active Abandoned
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111724831A (zh) * | 2019-03-20 | 2020-09-29 | 东芝存储器株式会社 | 存储器件以及信息处理装置 |
TWI803683B (zh) * | 2019-03-20 | 2023-06-01 | 日商鎧俠股份有限公司 | 儲存裝置及資訊處理裝置 |
CN111724831B (zh) * | 2019-03-20 | 2024-05-14 | 铠侠股份有限公司 | 存储器件以及信息处理装置 |
Also Published As
Publication number | Publication date |
---|---|
US20120152602A1 (en) | 2012-06-21 |
TW201225763A (en) | 2012-06-16 |
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Legal Events
Date | Code | Title | Description |
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MM4A | Annulment or lapse of patent due to non-payment of fees |