JP6624825B2 - 熱剥離型粘着シート - Google Patents

熱剥離型粘着シート Download PDF

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Publication number
JP6624825B2
JP6624825B2 JP2015137142A JP2015137142A JP6624825B2 JP 6624825 B2 JP6624825 B2 JP 6624825B2 JP 2015137142 A JP2015137142 A JP 2015137142A JP 2015137142 A JP2015137142 A JP 2015137142A JP 6624825 B2 JP6624825 B2 JP 6624825B2
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JP
Japan
Prior art keywords
sensitive adhesive
pressure
heat
cation
adhesive sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015137142A
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English (en)
Japanese (ja)
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JP2016065209A (ja
Inventor
和樹 副島
和樹 副島
淳仁 福原
淳仁 福原
高正 平山
高正 平山
有満 幸生
幸生 有満
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to TW104130340A priority Critical patent/TWI667324B/zh
Priority to TW108121818A priority patent/TWI789534B/zh
Priority to KR1020150133547A priority patent/KR102323155B1/ko
Priority to CN202010652442.XA priority patent/CN111808541A/zh
Priority to CN201510624809.6A priority patent/CN105462511A/zh
Publication of JP2016065209A publication Critical patent/JP2016065209A/ja
Priority to JP2019183268A priority patent/JP6914304B2/ja
Application granted granted Critical
Publication of JP6624825B2 publication Critical patent/JP6624825B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2015137142A 2014-09-25 2015-07-08 熱剥離型粘着シート Active JP6624825B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
TW104130340A TWI667324B (zh) 2014-09-25 2015-09-14 Thermal peeling adhesive sheet
TW108121818A TWI789534B (zh) 2014-09-25 2015-09-14 熱剝離型黏著片
KR1020150133547A KR102323155B1 (ko) 2014-09-25 2015-09-22 열 박리형 점착 시트
CN202010652442.XA CN111808541A (zh) 2014-09-25 2015-09-25 热剥离型粘合片
CN201510624809.6A CN105462511A (zh) 2014-09-25 2015-09-25 热剥离型粘合片
JP2019183268A JP6914304B2 (ja) 2014-09-25 2019-10-03 熱剥離型粘着シート

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014195218 2014-09-25
JP2014195218 2014-09-25

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019183268A Division JP6914304B2 (ja) 2014-09-25 2019-10-03 熱剥離型粘着シート

Publications (2)

Publication Number Publication Date
JP2016065209A JP2016065209A (ja) 2016-04-28
JP6624825B2 true JP6624825B2 (ja) 2019-12-25

Family

ID=55805097

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015137142A Active JP6624825B2 (ja) 2014-09-25 2015-07-08 熱剥離型粘着シート
JP2019183268A Active JP6914304B2 (ja) 2014-09-25 2019-10-03 熱剥離型粘着シート

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2019183268A Active JP6914304B2 (ja) 2014-09-25 2019-10-03 熱剥離型粘着シート

Country Status (3)

Country Link
JP (2) JP6624825B2 (ko)
KR (1) KR102323155B1 (ko)
TW (2) TWI789534B (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6974823B2 (ja) * 2016-05-31 2021-12-01 国立大学法人神戸大学 マイクロ波解体用接着組成物、及び、接着物の解体方法
JP6712916B2 (ja) * 2016-07-11 2020-06-24 日東電工株式会社 粘着シート
JP6783570B2 (ja) * 2016-07-11 2020-11-11 日東電工株式会社 粘着シート
KR20200034963A (ko) * 2017-07-24 2020-04-01 도레이 카부시키가이샤 필름
KR20200039858A (ko) * 2018-10-05 2020-04-17 삼성디스플레이 주식회사 접착 부재 및 이를 포함한 표시 장치
KR102187264B1 (ko) * 2019-09-23 2020-12-04 주식회사 아이에스시 검사용 소켓의 이물질 세정시트
FR3105590B1 (fr) * 2019-12-23 2022-12-23 Michelin & Cie Materiaux composites piezoelectriques ayant des proprietes piezoelectriques ameliorees
JP7380241B2 (ja) 2020-01-21 2023-11-15 株式会社デンソー 車両用ブレーキ装置
WO2022024510A1 (ja) * 2020-07-30 2022-02-03 古河電気工業株式会社 接着剤用組成物及びフィルム状接着剤、並びに、フィルム状接着剤を用いた半導体パッケージ及びその製造方法
JP2023001742A (ja) * 2021-06-21 2023-01-06 日東電工株式会社 半導体素子加工用粘着シート
WO2023054478A1 (ja) * 2021-09-30 2023-04-06 日東電工株式会社 粘着剤組成物、粘着シート、及び接合体
WO2023054480A1 (ja) * 2021-09-30 2023-04-06 日東電工株式会社 粘着剤組成物、粘着シート、及び接合体
WO2023054484A1 (ja) * 2021-09-30 2023-04-06 日東電工株式会社 粘着剤組成物、粘着シート、及び接合体

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3907331B2 (ja) * 1998-12-21 2007-04-18 電気化学工業株式会社 半導体ウエハ固定用シート
JP2001323228A (ja) * 2000-05-15 2001-11-22 Nitto Denko Corp 加熱剥離型粘着シート
JP4703833B2 (ja) 2000-10-18 2011-06-15 日東電工株式会社 エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
JP4229817B2 (ja) * 2003-11-27 2009-02-25 電気化学工業株式会社 電子部材固定用シート
JP6004511B2 (ja) * 2010-01-26 2016-10-12 日東電工株式会社 粘着型光学フィルムおよび画像表示装置
US20120291944A1 (en) * 2010-08-06 2012-11-22 Nitto Denko Corporation Method of producing electronic component
JP2012193317A (ja) * 2011-03-17 2012-10-11 Nitto Denko Corp 電子部品仮固定用粘着テープ
MY168337A (en) * 2011-12-02 2018-10-31 Denka Company Ltd Pressure-sensitive adhesive sheet and method of manufacturing electronic component using the same
JP2013147541A (ja) * 2012-01-17 2013-08-01 Nitto Denko Corp 粘着剤用ポリマー、粘着剤組成物及び熱剥離性粘着シート
JP5977110B2 (ja) * 2012-07-27 2016-08-24 日東電工株式会社 粘着シート
CN202936360U (zh) * 2012-11-30 2013-05-15 苏州斯迪克新材料科技股份有限公司 用于电子元器件的易剥离保护贴膜

Also Published As

Publication number Publication date
TW201936842A (zh) 2019-09-16
KR102323155B1 (ko) 2021-11-08
TWI789534B (zh) 2023-01-11
JP2016065209A (ja) 2016-04-28
KR20160036497A (ko) 2016-04-04
TW201619319A (zh) 2016-06-01
JP6914304B2 (ja) 2021-08-04
JP2020007568A (ja) 2020-01-16
TWI667324B (zh) 2019-08-01

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