JP6606331B2 - 電子装置 - Google Patents
電子装置 Download PDFInfo
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- JP6606331B2 JP6606331B2 JP2015027620A JP2015027620A JP6606331B2 JP 6606331 B2 JP6606331 B2 JP 6606331B2 JP 2015027620 A JP2015027620 A JP 2015027620A JP 2015027620 A JP2015027620 A JP 2015027620A JP 6606331 B2 JP6606331 B2 JP 6606331B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/147—Semiconductor insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
- H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
- H01L2924/15156—Side view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0162—Silicon containing polymer, e.g. silicone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
Description
1 基板
111 主面
112 裏面
14 素子配置用凹部
142 素子配置用凹部底面
141 素子配置用凹部側面
2 絶縁層
21 凹部内面絶縁部
22 主面側絶縁部
24 裏面側絶縁部
3 導電層
31 シード層
32 メッキ層
33 素子配置用凹部パッド
331 はんだ
381 主面側連絡部
382 凹部側面連絡部
71 電子素子
4 柱状導電体
41 柱状導電体主面
51 電極パッド
6 封止樹脂部
63 封止樹脂部主面
64 貫通孔
67 レジスト層
68 貫通孔
Claims (22)
- 厚さ方向において互いに反対側を向く主面および裏面を有し、半導体材料よりなる基板と、
前記基板に配置された電子素子と、
前記電子素子に導通する導電層と、を備え、
前記基板には、前記厚さ方向において前記主面側を向く素子配置用凹部底面を有し且つ前記主面から凹む素子配置用凹部が形成されており、
前記素子配置用凹部底面には、前記電子素子が配置されており、
前記導電層は、前記主面に形成された主面側連絡部を含んでおり、
前記素子配置用凹部の少なくとも一部を埋めるとともに、前記主面の少なくとも一部を覆う封止樹脂部を備えており、
前記導電層の前記主面側連絡部に導通し、且つ前記封止樹脂部から前記主面が向く側に露出する柱状導電体を備え、
前記封止樹脂部は、前記電子素子のすべてを覆っており、
前記電子素子は、前記主面よりも前記主面が向く側に突出する部位を有しており、
前記柱状導電体は、前記厚さ方向視において、前記電子素子を避けた位置に設けられていることを特徴とする、電子装置。 - 前記柱状導電体は、前記封止樹脂部から露出し、且つ前記主面と同じ側を向く柱状導電体主面を有する、請求項1に記載の電子装置。
- 前記封止樹脂部は、前記主面と同じ側を向く封止樹脂部主面を有しており、
前記柱状導電体主面と前記封止樹脂部主面とは、面一である、請求項2に記載の電子装置。 - 前記封止樹脂部は、前記素子配置用凹部のすべてを埋めている、請求項3に記載の電子装置。
- 前記封止樹脂部は、前記主面の前記厚さ方向視外縁のすべてに到達している、請求項4に記載の電子装置。
- 前記柱状導電体は、金属からなる、請求項1ないし5のいずれかに記載の電子装置。
- 前記柱状導電体は、Cuからなる、請求項6に記載の電子装置。
- 前記柱状導電体は、メッキにより形成されている、請求項6または7に記載の電子装置。
- 前記柱状導電体に対して前記主面とは反対側から接する電極パッドを備える、請求項1ないし8のいずれかに記載の電子装置。
- 前記電極パッドは、前記厚さ方向視において前記柱状導電体および前記封止樹脂部の少なくとも一部ずつに重なる、請求項9に記載の電子装置。
- 前記電極パッドは、前記厚さ方向視において、前記柱状導電体のすべてを内包している、請求項10に記載の電子装置。
- 前記導電層は、前記素子配置用凹部底面に形成され、且つ前記電子素子の配置に用いられる素子配置用凹部パッドを含む、請求項1ないし11のいずれかに記載の電子装置。
- 前記素子配置用凹部は、前記素子配置用凹部底面から起立する素子配置用凹部側面を有する、請求項12に記載の電子装置。
- 前記導電層は、前記素子配置用凹部側面に形成された凹部側面連絡部を含む、請求項13に記載の電子装置。
- 前記素子配置用凹部側面は、前記素子配置用凹部底面に繋がっている、請求項14に記載の電子装置。
- 前記素子配置用凹部側面は、前記主面に繋がっている、請求項15に記載の電子装置。
- 前記凹部側面連絡部と前記主面側連絡部とは、互いに繋がっている、請求項16に記載の電子装置。
- 前記基板は、半導体材料の単結晶よりなる、請求項13ないし17のいずれかに記載の電子装置。
- 前記半導体材料は、Siである、請求項18に記載の電子装置。
- 前記主面および前記裏面は、前記基板の厚さ方向に直交し、且つ、平坦である、請求項19に記載の電子装置。
- 前記主面は、(100)面である、請求項20に記載の電子装置。
- 前記素子配置用凹部底面に対する前記素子配置用凹部側面の角度は、55度である、請求項21に記載の電子装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015027620A JP6606331B2 (ja) | 2015-02-16 | 2015-02-16 | 電子装置 |
US15/015,870 US9585254B2 (en) | 2015-02-16 | 2016-02-04 | Electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015027620A JP6606331B2 (ja) | 2015-02-16 | 2015-02-16 | 電子装置 |
Publications (2)
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JP2016152260A JP2016152260A (ja) | 2016-08-22 |
JP6606331B2 true JP6606331B2 (ja) | 2019-11-13 |
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JP2015027620A Active JP6606331B2 (ja) | 2015-02-16 | 2015-02-16 | 電子装置 |
Country Status (2)
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US (1) | US9585254B2 (ja) |
JP (1) | JP6606331B2 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014209091A (ja) * | 2013-03-25 | 2014-11-06 | ローム株式会社 | 半導体装置 |
JP6628031B2 (ja) * | 2015-11-04 | 2020-01-08 | ローム株式会社 | 電子部品 |
JP2017199803A (ja) * | 2016-04-27 | 2017-11-02 | 日立マクセル株式会社 | 三次元成形回路部品 |
US11355427B2 (en) * | 2016-07-01 | 2022-06-07 | Intel Corporation | Device, method and system for providing recessed interconnect structures of a substrate |
JP6813314B2 (ja) * | 2016-09-15 | 2021-01-13 | ローム株式会社 | 半導体装置およびその製造方法 |
JP6825874B2 (ja) * | 2016-10-20 | 2021-02-03 | ローム株式会社 | 側面型光半導体装置 |
JP7001445B2 (ja) * | 2017-11-30 | 2022-01-19 | ローム株式会社 | 半導体装置およびその製造方法 |
KR102477357B1 (ko) * | 2017-12-14 | 2022-12-15 | 삼성전자주식회사 | 발광 소자 패키지 |
US11315844B2 (en) * | 2018-04-26 | 2022-04-26 | Kyocera Corporation | Electronic device mounting board, electronic package, and electronic module |
JP7267767B2 (ja) * | 2019-02-20 | 2023-05-02 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11289023A (ja) * | 1998-04-02 | 1999-10-19 | Oki Electric Ind Co Ltd | 半導体装置及びその製造方法 |
US6396143B1 (en) * | 1999-04-30 | 2002-05-28 | Mitsubishi Gas Chemical Company, Inc. | Ball grid array type printed wiring board having exellent heat diffusibility and printed wiring board |
JP3772066B2 (ja) * | 2000-03-09 | 2006-05-10 | 沖電気工業株式会社 | 半導体装置 |
CN1551720A (zh) * | 2000-06-27 | 2004-12-01 | ���µ�����ҵ��ʽ���� | 陶瓷叠层器件 |
US8044412B2 (en) * | 2006-01-20 | 2011-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd | Package for a light emitting element |
JP4828248B2 (ja) * | 2006-02-16 | 2011-11-30 | 新光電気工業株式会社 | 発光装置及びその製造方法 |
JP5042591B2 (ja) * | 2006-10-27 | 2012-10-03 | 新光電気工業株式会社 | 半導体パッケージおよび積層型半導体パッケージ |
KR100999699B1 (ko) * | 2008-09-01 | 2010-12-08 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
JP5779748B2 (ja) | 2010-11-02 | 2015-09-16 | リコー電子デバイス株式会社 | 半導体パッケージ及び電子部品実装体 |
US9698563B2 (en) * | 2010-11-03 | 2017-07-04 | 3M Innovative Properties Company | Flexible LED device and method of making |
JP2012129318A (ja) * | 2010-12-14 | 2012-07-05 | Fujikura Ltd | 半導体装置および半導体装置の製造方法 |
JP2014209091A (ja) * | 2013-03-25 | 2014-11-06 | ローム株式会社 | 半導体装置 |
-
2015
- 2015-02-16 JP JP2015027620A patent/JP6606331B2/ja active Active
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2016
- 2016-02-04 US US15/015,870 patent/US9585254B2/en active Active
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US9585254B2 (en) | 2017-02-28 |
US20160242292A1 (en) | 2016-08-18 |
JP2016152260A (ja) | 2016-08-22 |
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