JP6489309B2 - インプリント方法およびインプリント装置 - Google Patents

インプリント方法およびインプリント装置 Download PDF

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Publication number
JP6489309B2
JP6489309B2 JP2015098654A JP2015098654A JP6489309B2 JP 6489309 B2 JP6489309 B2 JP 6489309B2 JP 2015098654 A JP2015098654 A JP 2015098654A JP 2015098654 A JP2015098654 A JP 2015098654A JP 6489309 B2 JP6489309 B2 JP 6489309B2
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JP
Japan
Prior art keywords
substrate
mold
light
adhesive sheet
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2015098654A
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English (en)
Japanese (ja)
Other versions
JP2016213423A (ja
JP2016213423A5 (enExample
Inventor
鉄平 岩瀬
鉄平 岩瀬
石川　明弘
明弘 石川
和田　紀彦
紀彦 和田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to JP2015098654A priority Critical patent/JP6489309B2/ja
Priority to TW104143137A priority patent/TWI687301B/zh
Priority to US14/997,535 priority patent/US10105874B2/en
Priority to CN201610064225.2A priority patent/CN106142528B/zh
Priority to KR1020160012347A priority patent/KR20160134466A/ko
Publication of JP2016213423A publication Critical patent/JP2016213423A/ja
Publication of JP2016213423A5 publication Critical patent/JP2016213423A5/ja
Application granted granted Critical
Publication of JP6489309B2 publication Critical patent/JP6489309B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/021—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of profiled articles, e.g. hollow or tubular articles, beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003—Discharging moulded articles from the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • General Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing & Machinery (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2015098654A 2015-05-14 2015-05-14 インプリント方法およびインプリント装置 Expired - Fee Related JP6489309B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015098654A JP6489309B2 (ja) 2015-05-14 2015-05-14 インプリント方法およびインプリント装置
TW104143137A TWI687301B (zh) 2015-05-14 2015-12-22 壓印方法及壓印裝置
US14/997,535 US10105874B2 (en) 2015-05-14 2016-01-17 Imprinting method and imprinting device
CN201610064225.2A CN106142528B (zh) 2015-05-14 2016-01-29 压印方法以及压印装置
KR1020160012347A KR20160134466A (ko) 2015-05-14 2016-02-01 임프린트 방법 및 임프린트 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015098654A JP6489309B2 (ja) 2015-05-14 2015-05-14 インプリント方法およびインプリント装置

Publications (3)

Publication Number Publication Date
JP2016213423A JP2016213423A (ja) 2016-12-15
JP2016213423A5 JP2016213423A5 (enExample) 2017-10-26
JP6489309B2 true JP6489309B2 (ja) 2019-03-27

Family

ID=57276543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015098654A Expired - Fee Related JP6489309B2 (ja) 2015-05-14 2015-05-14 インプリント方法およびインプリント装置

Country Status (5)

Country Link
US (1) US10105874B2 (enExample)
JP (1) JP6489309B2 (enExample)
KR (1) KR20160134466A (enExample)
CN (1) CN106142528B (enExample)
TW (1) TWI687301B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI672212B (zh) * 2016-08-25 2019-09-21 國立成功大學 奈米壓印組合體及其壓印方法
US11571862B2 (en) 2016-11-03 2023-02-07 Sram, Llc Surface feature transfer media and methods of use
KR102730502B1 (ko) * 2017-01-23 2024-11-14 에스케이하이닉스 주식회사 임프린트 패턴 형성 방법
KR102574036B1 (ko) * 2018-02-28 2023-09-04 삼성디스플레이 주식회사 임프린팅 장치 및 이를 이용한 임프린팅 방법
JP7182036B2 (ja) * 2018-06-28 2022-12-02 パナソニックＩｐマネジメント株式会社 部品圧着装置、シート設置ユニットおよびシート設置ユニットの取付け方法
JP6538252B1 (ja) * 2018-09-19 2019-07-03 デクセリアルズ株式会社 画像表示装置の製造方法
FI128257B (en) * 2018-12-14 2020-01-31 Teknologian Tutkimuskeskus Vtt Oy Procedure for roll to roll printing of components
JP7245973B2 (ja) * 2019-02-04 2023-03-27 パナソニックＩｐマネジメント株式会社 パターンの形成方法および装置
JP7178600B2 (ja) * 2019-03-11 2022-11-28 パナソニックＩｐマネジメント株式会社 フィルム構造体の製造方法及び製造装置
KR102218676B1 (ko) * 2019-07-19 2021-02-22 한국기계연구원 이형막의 선택적 형성을 통한 임프린트 방법
JP7374666B2 (ja) * 2019-08-29 2023-11-07 キヤノン株式会社 インプリント方法、前処理装置、インプリント用基板、および基板の製造方法
WO2021182532A1 (ja) * 2020-03-11 2021-09-16 Ｓｃｉｖａｘ株式会社 インプリント装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
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JPS6334108A (ja) 1986-07-30 1988-02-13 Hitachi Ltd 光デイスク用基板の製造方法および装置
JP2002202535A (ja) 2000-12-28 2002-07-19 Canon Inc 表示装置
EP1362682A1 (en) * 2002-05-13 2003-11-19 ZBD Displays Ltd, Method and apparatus for liquid crystal alignment
KR100568581B1 (ko) * 2003-04-14 2006-04-07 주식회사 미뉴타텍 미세패턴 형성 몰드용 조성물 및 이로부터 제작된 몰드
TWI261308B (en) * 2005-03-02 2006-09-01 Ind Tech Res Inst Micro-nanometer transfer printer
JP4789039B2 (ja) 2005-06-10 2011-10-05 独立行政法人産業技術総合研究所 ナノインプリント装置
JP4902229B2 (ja) 2006-03-07 2012-03-21 ソニーケミカル＆インフォメーションデバイス株式会社 実装方法
GB0809062D0 (en) * 2008-05-19 2008-06-25 Zbd Displays Ltd Method for patterning a surface using selective adhesion
JP2010067796A (ja) 2008-09-11 2010-03-25 Canon Inc インプリント装置
JP5329666B2 (ja) * 2009-08-07 2013-10-30 ニッタ株式会社 モールド固定用粘着シートおよびモールド固定用粘着テープ、並びに微細構造の製造方法
EP2287666B1 (de) * 2009-08-22 2012-06-27 EV Group E. Thallner GmbH Vorrichtung zum Prägen von Substraten
JP2011161832A (ja) * 2010-02-10 2011-08-25 Canon Inc インプリント装置及び物品の製造方法
JP5559574B2 (ja) 2010-03-08 2014-07-23 東芝機械株式会社 転写方法
JP5585138B2 (ja) 2010-03-17 2014-09-10 オムロン株式会社 流路チップ及び治具
JP2010250940A (ja) * 2010-07-14 2010-11-04 Toshiba Corp インプリント装置
JP5351913B2 (ja) * 2011-02-10 2013-11-27 株式会社日立ハイテクノロジーズ 微細構造転写装置及び微細構造転写方法
CN103826829B (zh) 2011-07-11 2015-12-23 Scivax股份有限公司 具有用于加压部的固定工具的流体压印装置
TW201334948A (zh) * 2012-02-21 2013-09-01 Coretronic Corp 壓印設備及壓印方法
JP6200135B2 (ja) * 2012-07-24 2017-09-20 キヤノン株式会社 インプリント装置、インプリント方法、および、物品製造方法
JP5944800B2 (ja) 2012-09-11 2016-07-05 東芝機械株式会社 転写装置
JP6083565B2 (ja) * 2013-04-09 2017-02-22 パナソニックＩｐマネジメント株式会社 微細構造体の製造方法

Also Published As

Publication number Publication date
TWI687301B (zh) 2020-03-11
CN106142528A (zh) 2016-11-23
US20160332341A1 (en) 2016-11-17
JP2016213423A (ja) 2016-12-15
TW201639689A (zh) 2016-11-16
KR20160134466A (ko) 2016-11-23
US10105874B2 (en) 2018-10-23
CN106142528B (zh) 2019-08-02

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