CN106142528B - 压印方法以及压印装置 - Google Patents

压印方法以及压印装置 Download PDF

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Publication number
CN106142528B
CN106142528B CN201610064225.2A CN201610064225A CN106142528B CN 106142528 B CN106142528 B CN 106142528B CN 201610064225 A CN201610064225 A CN 201610064225A CN 106142528 B CN106142528 B CN 106142528B
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CN
China
Prior art keywords
substrate
mold
photocurable resin
light
adhesive sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201610064225.2A
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English (en)
Chinese (zh)
Other versions
CN106142528A (zh
Inventor
岩濑铁平
石川明弘
和田纪彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of CN106142528A publication Critical patent/CN106142528A/zh
Application granted granted Critical
Publication of CN106142528B publication Critical patent/CN106142528B/zh
Expired - Fee Related legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/021—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of profiled articles, e.g. hollow or tubular articles, beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003—Discharging moulded articles from the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • General Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing & Machinery (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
CN201610064225.2A 2015-05-14 2016-01-29 压印方法以及压印装置 Expired - Fee Related CN106142528B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015098654A JP6489309B2 (ja) 2015-05-14 2015-05-14 インプリント方法およびインプリント装置
JP2015-098654 2015-05-14

Publications (2)

Publication Number Publication Date
CN106142528A CN106142528A (zh) 2016-11-23
CN106142528B true CN106142528B (zh) 2019-08-02

Family

ID=57276543

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610064225.2A Expired - Fee Related CN106142528B (zh) 2015-05-14 2016-01-29 压印方法以及压印装置

Country Status (5)

Country Link
US (1) US10105874B2 (enExample)
JP (1) JP6489309B2 (enExample)
KR (1) KR20160134466A (enExample)
CN (1) CN106142528B (enExample)
TW (1) TWI687301B (enExample)

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TWI672212B (zh) * 2016-08-25 2019-09-21 國立成功大學 奈米壓印組合體及其壓印方法
US11571862B2 (en) 2016-11-03 2023-02-07 Sram, Llc Surface feature transfer media and methods of use
KR102730502B1 (ko) * 2017-01-23 2024-11-14 에스케이하이닉스 주식회사 임프린트 패턴 형성 방법
KR102574036B1 (ko) * 2018-02-28 2023-09-04 삼성디스플레이 주식회사 임프린팅 장치 및 이를 이용한 임프린팅 방법
JP7182036B2 (ja) * 2018-06-28 2022-12-02 パナソニックＩｐマネジメント株式会社 部品圧着装置、シート設置ユニットおよびシート設置ユニットの取付け方法
JP6538252B1 (ja) * 2018-09-19 2019-07-03 デクセリアルズ株式会社 画像表示装置の製造方法
FI128257B (en) * 2018-12-14 2020-01-31 Teknologian Tutkimuskeskus Vtt Oy Procedure for roll to roll printing of components
JP7245973B2 (ja) * 2019-02-04 2023-03-27 パナソニックＩｐマネジメント株式会社 パターンの形成方法および装置
JP7178600B2 (ja) * 2019-03-11 2022-11-28 パナソニックＩｐマネジメント株式会社 フィルム構造体の製造方法及び製造装置
KR102218676B1 (ko) * 2019-07-19 2021-02-22 한국기계연구원 이형막의 선택적 형성을 통한 임프린트 방법
JP7374666B2 (ja) * 2019-08-29 2023-11-07 キヤノン株式会社 インプリント方法、前処理装置、インプリント用基板、および基板の製造方法
WO2021182532A1 (ja) * 2020-03-11 2021-09-16 Ｓｃｉｖａｘ株式会社 インプリント装置

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CN1668440A (zh) * 2002-05-13 2005-09-14 Zbd显示器有限公司 浮雕形成方法和设备
CN1774672A (zh) * 2003-04-14 2006-05-17 米纽塔技术株式会社 用于形成微型图案的模具的树脂组合物及由其制备有机模具的方法
CN103257524A (zh) * 2012-02-21 2013-08-21 中强光电股份有限公司 压印设备及压印方法
JP2014204068A (ja) * 2013-04-09 2014-10-27 パナソニック株式会社 微細構造体、その製造方法、及び微細構造金型

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JP2002202535A (ja) 2000-12-28 2002-07-19 Canon Inc 表示装置
TWI261308B (en) * 2005-03-02 2006-09-01 Ind Tech Res Inst Micro-nanometer transfer printer
JP4789039B2 (ja) 2005-06-10 2011-10-05 独立行政法人産業技術総合研究所 ナノインプリント装置
JP4902229B2 (ja) 2006-03-07 2012-03-21 ソニーケミカル＆インフォメーションデバイス株式会社 実装方法
GB0809062D0 (en) * 2008-05-19 2008-06-25 Zbd Displays Ltd Method for patterning a surface using selective adhesion
JP2010067796A (ja) 2008-09-11 2010-03-25 Canon Inc インプリント装置
JP5329666B2 (ja) * 2009-08-07 2013-10-30 ニッタ株式会社 モールド固定用粘着シートおよびモールド固定用粘着テープ、並びに微細構造の製造方法
EP2287666B1 (de) * 2009-08-22 2012-06-27 EV Group E. Thallner GmbH Vorrichtung zum Prägen von Substraten
JP2011161832A (ja) * 2010-02-10 2011-08-25 Canon Inc インプリント装置及び物品の製造方法
JP5559574B2 (ja) 2010-03-08 2014-07-23 東芝機械株式会社 転写方法
JP5585138B2 (ja) 2010-03-17 2014-09-10 オムロン株式会社 流路チップ及び治具
JP2010250940A (ja) * 2010-07-14 2010-11-04 Toshiba Corp インプリント装置
JP5351913B2 (ja) * 2011-02-10 2013-11-27 株式会社日立ハイテクノロジーズ 微細構造転写装置及び微細構造転写方法
CN103826829B (zh) 2011-07-11 2015-12-23 Scivax股份有限公司 具有用于加压部的固定工具的流体压印装置
JP6200135B2 (ja) * 2012-07-24 2017-09-20 キヤノン株式会社 インプリント装置、インプリント方法、および、物品製造方法
JP5944800B2 (ja) 2012-09-11 2016-07-05 東芝機械株式会社 転写装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
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CN1668440A (zh) * 2002-05-13 2005-09-14 Zbd显示器有限公司 浮雕形成方法和设备
CN1774672A (zh) * 2003-04-14 2006-05-17 米纽塔技术株式会社 用于形成微型图案的模具的树脂组合物及由其制备有机模具的方法
CN103257524A (zh) * 2012-02-21 2013-08-21 中强光电股份有限公司 压印设备及压印方法
JP2014204068A (ja) * 2013-04-09 2014-10-27 パナソニック株式会社 微細構造体、その製造方法、及び微細構造金型

Also Published As

Publication number Publication date
TWI687301B (zh) 2020-03-11
CN106142528A (zh) 2016-11-23
US20160332341A1 (en) 2016-11-17
JP2016213423A (ja) 2016-12-15
TW201639689A (zh) 2016-11-16
KR20160134466A (ko) 2016-11-23
JP6489309B2 (ja) 2019-03-27
US10105874B2 (en) 2018-10-23

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