TWI687301B - 壓印方法及壓印裝置 - Google Patents

壓印方法及壓印裝置 Download PDF

Info

Publication number
TWI687301B
TWI687301B TW104143137A TW104143137A TWI687301B TW I687301 B TWI687301 B TW I687301B TW 104143137 A TW104143137 A TW 104143137A TW 104143137 A TW104143137 A TW 104143137A TW I687301 B TWI687301 B TW I687301B
Authority
TW
Taiwan
Prior art keywords
substrate
mold
resin
adhesive sheet
curable resin
Prior art date
Application number
TW104143137A
Other languages
English (en)
Chinese (zh)
Other versions
TW201639689A (zh
Inventor
岩瀨鐵平
石川明弘
和田紀彥
Original Assignee
日商松下知識產權經營股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商松下知識產權經營股份有限公司 filed Critical 日商松下知識產權經營股份有限公司
Publication of TW201639689A publication Critical patent/TW201639689A/zh
Application granted granted Critical
Publication of TWI687301B publication Critical patent/TWI687301B/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/021—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of profiled articles, e.g. hollow or tubular articles, beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003—Discharging moulded articles from the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • General Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing & Machinery (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
TW104143137A 2015-05-14 2015-12-22 壓印方法及壓印裝置 TWI687301B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015098654A JP6489309B2 (ja) 2015-05-14 2015-05-14 インプリント方法およびインプリント装置
JP2015-098654 2015-05-14

Publications (2)

Publication Number Publication Date
TW201639689A TW201639689A (zh) 2016-11-16
TWI687301B true TWI687301B (zh) 2020-03-11

Family

ID=57276543

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104143137A TWI687301B (zh) 2015-05-14 2015-12-22 壓印方法及壓印裝置

Country Status (5)

Country Link
US (1) US10105874B2 (enExample)
JP (1) JP6489309B2 (enExample)
KR (1) KR20160134466A (enExample)
CN (1) CN106142528B (enExample)
TW (1) TWI687301B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI672212B (zh) * 2016-08-25 2019-09-21 國立成功大學 奈米壓印組合體及其壓印方法
US11571862B2 (en) 2016-11-03 2023-02-07 Sram, Llc Surface feature transfer media and methods of use
KR102730502B1 (ko) * 2017-01-23 2024-11-14 에스케이하이닉스 주식회사 임프린트 패턴 형성 방법
KR102574036B1 (ko) * 2018-02-28 2023-09-04 삼성디스플레이 주식회사 임프린팅 장치 및 이를 이용한 임프린팅 방법
JP7182036B2 (ja) * 2018-06-28 2022-12-02 パナソニックＩｐマネジメント株式会社 部品圧着装置、シート設置ユニットおよびシート設置ユニットの取付け方法
JP6538252B1 (ja) * 2018-09-19 2019-07-03 デクセリアルズ株式会社 画像表示装置の製造方法
FI128257B (en) * 2018-12-14 2020-01-31 Teknologian Tutkimuskeskus Vtt Oy Procedure for roll to roll printing of components
JP7245973B2 (ja) * 2019-02-04 2023-03-27 パナソニックＩｐマネジメント株式会社 パターンの形成方法および装置
JP7178600B2 (ja) * 2019-03-11 2022-11-28 パナソニックＩｐマネジメント株式会社 フィルム構造体の製造方法及び製造装置
KR102218676B1 (ko) * 2019-07-19 2021-02-22 한국기계연구원 이형막의 선택적 형성을 통한 임프린트 방법
JP7374666B2 (ja) * 2019-08-29 2023-11-07 キヤノン株式会社 インプリント方法、前処理装置、インプリント用基板、および基板の製造方法
WO2021182532A1 (ja) * 2020-03-11 2021-09-16 Ｓｃｉｖａｘ株式会社 インプリント装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011016148A1 (ja) * 2009-08-07 2011-02-10 ニッタ株式会社 モールド固定用粘着シートおよびモールド固定用粘着テープ、並びに微細構造の製造方法
US8770965B2 (en) * 2011-02-10 2014-07-08 Hitachi High-Technologies Corporation Device and method for transferring micro structure

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6334108A (ja) 1986-07-30 1988-02-13 Hitachi Ltd 光デイスク用基板の製造方法および装置
JP2002202535A (ja) 2000-12-28 2002-07-19 Canon Inc 表示装置
EP1362682A1 (en) * 2002-05-13 2003-11-19 ZBD Displays Ltd, Method and apparatus for liquid crystal alignment
KR100568581B1 (ko) * 2003-04-14 2006-04-07 주식회사 미뉴타텍 미세패턴 형성 몰드용 조성물 및 이로부터 제작된 몰드
TWI261308B (en) * 2005-03-02 2006-09-01 Ind Tech Res Inst Micro-nanometer transfer printer
JP4789039B2 (ja) 2005-06-10 2011-10-05 独立行政法人産業技術総合研究所 ナノインプリント装置
JP4902229B2 (ja) 2006-03-07 2012-03-21 ソニーケミカル＆インフォメーションデバイス株式会社 実装方法
GB0809062D0 (en) * 2008-05-19 2008-06-25 Zbd Displays Ltd Method for patterning a surface using selective adhesion
JP2010067796A (ja) 2008-09-11 2010-03-25 Canon Inc インプリント装置
EP2287666B1 (de) * 2009-08-22 2012-06-27 EV Group E. Thallner GmbH Vorrichtung zum Prägen von Substraten
JP2011161832A (ja) * 2010-02-10 2011-08-25 Canon Inc インプリント装置及び物品の製造方法
JP5559574B2 (ja) 2010-03-08 2014-07-23 東芝機械株式会社 転写方法
JP5585138B2 (ja) 2010-03-17 2014-09-10 オムロン株式会社 流路チップ及び治具
JP2010250940A (ja) * 2010-07-14 2010-11-04 Toshiba Corp インプリント装置
CN103826829B (zh) 2011-07-11 2015-12-23 Scivax股份有限公司 具有用于加压部的固定工具的流体压印装置
TW201334948A (zh) * 2012-02-21 2013-09-01 Coretronic Corp 壓印設備及壓印方法
JP6200135B2 (ja) * 2012-07-24 2017-09-20 キヤノン株式会社 インプリント装置、インプリント方法、および、物品製造方法
JP5944800B2 (ja) 2012-09-11 2016-07-05 東芝機械株式会社 転写装置
JP6083565B2 (ja) * 2013-04-09 2017-02-22 パナソニックＩｐマネジメント株式会社 微細構造体の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011016148A1 (ja) * 2009-08-07 2011-02-10 ニッタ株式会社 モールド固定用粘着シートおよびモールド固定用粘着テープ、並びに微細構造の製造方法
US8770965B2 (en) * 2011-02-10 2014-07-08 Hitachi High-Technologies Corporation Device and method for transferring micro structure

Also Published As

Publication number Publication date
CN106142528A (zh) 2016-11-23
US20160332341A1 (en) 2016-11-17
JP2016213423A (ja) 2016-12-15
TW201639689A (zh) 2016-11-16
KR20160134466A (ko) 2016-11-23
JP6489309B2 (ja) 2019-03-27
US10105874B2 (en) 2018-10-23
CN106142528B (zh) 2019-08-02

Similar Documents

Publication Publication Date Title
TWI687301B (zh) 壓印方法及壓印裝置
US8946093B2 (en) Imprint method, imprint apparatus, and method of manufacturing semiconductor device
US10052798B2 (en) Light-transmitting imprinting mold and method for manufacturing large-area mold
JP5499668B2 (ja) インプリント用モールドおよび該モールドを用いたパターン形成方法
TWI668098B (zh) Imprinting device
JP2010240928A (ja) 微細構造転写スタンパ及び微細構造転写装置
JP5982996B2 (ja) 異物除去方法
JP2016213423A5 (enExample)
WO2016051928A1 (ja) インプリント用テンプレート及びその製造方法
JP6671010B2 (ja) インプリント方法およびインプリント装置
TWI772789B (zh) 用於凸印一奈米結構之方法及裝置
KR100931603B1 (ko) 임프린트 공정 시스템 및 패턴형성방법
JP5502592B2 (ja) インプリント加工装置、インプリント加工方法およびインプリント加工物
KR20090020102A (ko) 롤가압 및 연속수지도포가 가능한 대면적 임프린트장치
KR102201321B1 (ko) 임프린트 공정을 이용하여 패턴형성영역에 정렬된 패턴을 형성하는 방법
WO2014013563A1 (ja) インプリント装置
JP4569185B2 (ja) フィルム構造体の形成方法及びフィルム構造体
CN107112210A (zh) 压印用模具
CN100594137C (zh) 图案形成方法和图案形成装置
KR101551772B1 (ko) Scil 공정용 레플리카 스탬프 및 이의 제조방법
JP2013172127A (ja) 封止材付きテンプレート、テンプレートの保管方法、テンプレート封止装置及びテンプレート開封装置
JP6036865B2 (ja) インプリント用モールド
KR101334120B1 (ko) 임프린트 리소그래피용 스탬프 및 제작방법
JP5790798B2 (ja) インプリント用モールドおよび該モールドを用いたパターン形成方法
CN108292592A (zh) 压印装置及方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees