JP6483787B2 - 電子部品 - Google Patents
電子部品 Download PDFInfo
- Publication number
- JP6483787B2 JP6483787B2 JP2017214710A JP2017214710A JP6483787B2 JP 6483787 B2 JP6483787 B2 JP 6483787B2 JP 2017214710 A JP2017214710 A JP 2017214710A JP 2017214710 A JP2017214710 A JP 2017214710A JP 6483787 B2 JP6483787 B2 JP 6483787B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- external electrode
- component according
- particles
- connection layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002245 particle Substances 0.000 claims description 34
- 229910000679 solder Inorganic materials 0.000 claims description 25
- 239000002003 electrode paste Substances 0.000 claims description 15
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 229910000765 intermetallic Inorganic materials 0.000 claims description 7
- 229910017980 Ag—Sn Inorganic materials 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 230000006855 networking Effects 0.000 claims description 4
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 claims description 3
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- -1 Cu—Sn compound Chemical class 0.000 claims description 2
- 229910017755 Cu-Sn Inorganic materials 0.000 claims 1
- 229910017927 Cu—Sn Inorganic materials 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 description 15
- 239000010949 copper Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 10
- 229910000859 α-Fe Inorganic materials 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 230000035939 shock Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 4
- 239000000696 magnetic material Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000805 composite resin Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/012—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials adapted for magnetic entropy change by magnetocaloric effect, e.g. used as magnetic refrigerating material
- H01F1/017—Compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/40—Structural association with built-in electric component, e.g. fuse
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Conductive Materials (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Description
1 内部電極
2 外部電極
3 本体
4 支持部材
5 連結層
Claims (14)
- 内部電極と、
前記内部電極と電気的に連結される外部電極と、を含み、
前記外部電極は、多孔質構造を有する導電性ベースと、前記多孔質構造内の空き空間に充填される樹脂と、を含み、
前記外部電極と前記内部電極との間に連結層が配置されており、
前記外部電極は、Ag粒子及び半田粒子を含む外部電極ペーストから形成されており、前記Ag粒子の含量は、前記外部電極ペースト内のAg粒子及び半田粒子の総重量を基準として55wt%以上70wt%以下である、
電子部品。 - 前記連結層はCu−Sn化合物で構成される、請求項1に記載の電子部品。
- 前記連結層は、前記外部電極と隣接した第1連結層と、前記内部電極と隣接した第2連結層と、を含む二重層で構成される、請求項2に記載の電子部品。
- 前記第1連結層はCu6Sn5合金で構成される、請求項3に記載の電子部品。
- 前記第2連結層はCu3Sn合金で構成される、請求項3に記載の電子部品。
- 前記第1連結層及び前記第2連結層の少なくとも1つは不連続的に配置される、請求項3に記載の電子部品。
- 前記連結層の平均厚さは1μm以上10μm以下である、請求項1から6のいずれか一項に記載の電子部品。
- 前記導電性ベースはAg−Sn系合金を含む、請求項1から7のいずれか一項に記載の電子部品。
- 前記Ag−Sn系合金はAg3Snである、請求項8に記載の電子部品。
- 前記導電性ベースは前記外部電極の内側面から外側面まで延長される連続的なネットワーキング(networking)構造で形成される、請求項1から9の何れか1項に記載の電子部品。
- 前記樹脂は熱硬化性樹脂である、請求項1から10のいずれか一項に記載の電子部品。
- 前記導電性ベースの境界面上の少なくとも一部領域上にBi粒子が配置されている、請求項1から11のいずれか一項に記載の電子部品。
- 前記導電性ベースのAg3Sn内に含まれるAg粒子は前記外部電極内で不規則的に分散されている、請求項8に記載の電子部品。
- 前記連結層は金属間化合物(intermetallic compound)を含む、請求項1から13のいずれか一項に記載の電子部品。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2017-0027157 | 2017-03-02 | ||
KR1020170027157A KR101892849B1 (ko) | 2017-03-02 | 2017-03-02 | 전자 부품 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019024396A Division JP6798093B2 (ja) | 2017-03-02 | 2019-02-14 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018148199A JP2018148199A (ja) | 2018-09-20 |
JP6483787B2 true JP6483787B2 (ja) | 2019-03-13 |
Family
ID=63355174
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017214710A Active JP6483787B2 (ja) | 2017-03-02 | 2017-11-07 | 電子部品 |
JP2019024396A Active JP6798093B2 (ja) | 2017-03-02 | 2019-02-14 | 電子部品 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019024396A Active JP6798093B2 (ja) | 2017-03-02 | 2019-02-14 | 電子部品 |
Country Status (4)
Country | Link |
---|---|
US (2) | US11183325B2 (ja) |
JP (2) | JP6483787B2 (ja) |
KR (1) | KR101892849B1 (ja) |
CN (1) | CN108538555B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7053095B2 (ja) * | 2018-11-29 | 2022-04-12 | サムソン エレクトロ-メカニックス カンパニーリミテッド. | 積層セラミックキャパシタ |
US11183331B2 (en) * | 2019-02-21 | 2021-11-23 | Samsung Electro-Mechanics Co., Ltd. | MLCC module and method of manufacturing the same |
KR102211744B1 (ko) | 2019-02-21 | 2021-02-04 | 삼성전기주식회사 | 적층형 커패시터 |
JP7081575B2 (ja) * | 2019-09-30 | 2022-06-07 | 株式会社村田製作所 | コイル部品 |
JP2021057455A (ja) * | 2019-09-30 | 2021-04-08 | 太陽誘電株式会社 | コイル部品、回路基板及び電子機器 |
JP7173080B2 (ja) * | 2020-04-07 | 2022-11-16 | 株式会社村田製作所 | インダクタ |
JP7480012B2 (ja) * | 2020-10-02 | 2024-05-09 | Tdk株式会社 | 積層コイル部品 |
KR20230080883A (ko) * | 2021-11-30 | 2023-06-07 | 삼성전기주식회사 | 적층형 전자부품 |
KR20230082259A (ko) * | 2021-12-01 | 2023-06-08 | 삼성전기주식회사 | 적층형 커패시터 |
CN116741534A (zh) * | 2023-07-26 | 2023-09-12 | 广东微容电子科技有限公司 | 一种片式多层陶瓷电容器及其制备方法 |
Family Cites Families (27)
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JP3267067B2 (ja) * | 1994-10-06 | 2002-03-18 | 株式会社村田製作所 | セラミック電子部品 |
JP3500319B2 (ja) * | 1998-01-08 | 2004-02-23 | 太陽誘電株式会社 | 電子部品 |
JPH11350190A (ja) | 1998-06-03 | 1999-12-21 | Furukawa Electric Co Ltd:The | 電気・電子部品用材料とその製造方法、その材料を用いた電気・電子部品 |
JP3650546B2 (ja) * | 1998-08-28 | 2005-05-18 | 松下電器産業株式会社 | 導電性ペースト、およびそれを用いた導電性構造、セラミック電子部品、電子部品、実装体、回路基板、電気的接続方法、回路基板の製造方法、及びセラミック電子部品の製造方法 |
WO2000013190A1 (fr) | 1998-08-28 | 2000-03-09 | Matsushita Electric Industrial Co., Ltd. | Colle electroconductrice, structure electroconductrice utilisant cette colle, piece electrique, module et carte a circuit, connexion electrique, fabrication de carte a circuit et de piece electronique ceramique |
JP2000164455A (ja) * | 1998-11-27 | 2000-06-16 | Taiyo Yuden Co Ltd | チップ状電子部品とその製造方法 |
JP2000182883A (ja) | 1998-12-15 | 2000-06-30 | Matsushita Electric Ind Co Ltd | 積層セラミック電子部品の製造方法 |
JP2001244116A (ja) * | 2000-02-29 | 2001-09-07 | Taiyo Yuden Co Ltd | 電子部品及びその製造方法 |
US7751174B2 (en) | 2002-12-09 | 2010-07-06 | Matsushita Electric Industrial Co., Ltd. | Electronic part with external electrode |
EP1783790B1 (en) | 2004-08-27 | 2010-07-07 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor and method for controlling equivalent series resistance |
JP2008091433A (ja) * | 2006-09-29 | 2008-04-17 | Tdk Corp | 積層型電子部品及びその製造方法 |
CN101246777A (zh) | 2007-02-14 | 2008-08-20 | 华新科技股份有限公司 | 积层陶瓷电容器 |
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WO2017130719A1 (ja) * | 2016-01-28 | 2017-08-03 | 株式会社村田製作所 | 表面実装型コイル部品及びその製造方法、並びにdc-dcコンバータ |
US10580567B2 (en) * | 2016-07-26 | 2020-03-03 | Samsung Electro-Mechanics Co., Ltd. | Coil component and method of manufacturing the same |
-
2017
- 2017-03-02 KR KR1020170027157A patent/KR101892849B1/ko active IP Right Grant
- 2017-11-07 JP JP2017214710A patent/JP6483787B2/ja active Active
- 2017-11-08 US US15/807,001 patent/US11183325B2/en active Active
-
2018
- 2018-01-15 CN CN201810034354.6A patent/CN108538555B/zh active Active
-
2019
- 2019-02-14 JP JP2019024396A patent/JP6798093B2/ja active Active
-
2021
- 2021-10-29 US US17/514,292 patent/US11817251B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US11183325B2 (en) | 2021-11-23 |
KR101892849B1 (ko) | 2018-08-28 |
JP6798093B2 (ja) | 2020-12-09 |
US11817251B2 (en) | 2023-11-14 |
JP2018148199A (ja) | 2018-09-20 |
US20180254138A1 (en) | 2018-09-06 |
US20220051843A1 (en) | 2022-02-17 |
CN108538555B (zh) | 2021-02-05 |
JP2019091927A (ja) | 2019-06-13 |
CN108538555A (zh) | 2018-09-14 |
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