JP6104863B2 - チップ電子部品及びその製造方法 - Google Patents
チップ電子部品及びその製造方法 Download PDFInfo
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- JP6104863B2 JP6104863B2 JP2014177796A JP2014177796A JP6104863B2 JP 6104863 B2 JP6104863 B2 JP 6104863B2 JP 2014177796 A JP2014177796 A JP 2014177796A JP 2014177796 A JP2014177796 A JP 2014177796A JP 6104863 B2 JP6104863 B2 JP 6104863B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 94
- 239000002184 metal Substances 0.000 claims description 94
- 239000006249 magnetic particle Substances 0.000 claims description 89
- 239000010410 layer Substances 0.000 claims description 61
- 239000012792 core layer Substances 0.000 claims description 52
- 230000035699 permeability Effects 0.000 claims description 47
- 239000002245 particle Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 13
- 238000010030 laminating Methods 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 description 48
- 239000000758 substrate Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000000696 magnetic material Substances 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000000462 isostatic pressing Methods 0.000 description 2
- 239000006247 magnetic powder Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/255—Magnetic cores made from particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
- H01F3/10—Composite arrangements of magnetic circuits
- H01F2003/106—Magnetic circuits using combinations of different magnetic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0066—Printed inductances with a magnetic layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49075—Electromagnet, transformer or inductor including permanent magnet or core
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Description
以下では、本発明の一実施形態によるチップ電子部品を、特に、薄膜型インダクタで説明するが、必ずしもこれに限定されるものではない。
図6は本発明の一実施形態のチップ電子部品の製造工程を示す工程図であり、図7a〜図7dは本発明の一実施形態によるチップ電子部品の製造工程を説明する図面である。
11、12、13 第1、2、3金属磁性粒子
20 絶縁基板
42、44 内部コイル部
46 ビア電極
50 磁性体本体
51 コア層
52、53 上部及び下部カバー層
80 外部電極
Claims (8)
- 内部コイル部が埋設された磁性体本体を含むチップ電子部品であって、
前記磁性体本体は、前記内部コイル部を含むコア層と、前記磁性体本体の上部及び下部に配置された上部及び下部カバー層と、を含んで前記チップ電子部品の外観を成し、
前記コア層は、前記上部及び下部カバー層のうち少なくとも一つと金属磁性粒子の充填率を異ならせてこれより大きい透磁率を有し、
前記コア層は、第1金属磁性粒子と前記第1金属磁性粒子より平均粒径の小さい第2金属磁性粒子が混合され、
前記上部及び下部カバー層のうち前記コア層より透磁率の小さい少なくとも一つは、前記第1金属磁性粒子より平均粒径の小さい第3金属磁性粒子を含む、チップ電子部品。 - 前記コア層と、前記上部または下部カバー層との透磁率の差は10〜40H・mである、請求項1に記載のチップ電子部品。
- 前記第1金属磁性粒子の粒径は11μm〜53μmで、前記第2金属磁性粒子の粒径は0.5μm〜6μmであり、
前記第3金属磁性粒子の粒径が0.5μm〜6μmである、請求項1に記載のチップ電子部品。 - 前記コア層の金属磁性粒子の充填率は70%〜85%であり、前記上部または下部カバー層の金属磁性粒子の充填率は55%〜70%である、請求項1に記載のチップ電子部品。
- 前記コア層の厚さは、前記上部または下部カバー層の厚さの0.5倍〜10倍である、請求項1に記載のチップ電子部品。
- 内部コイル部が埋設された磁性体本体が外観を成すチップ電子部品の製造方法であって、
金属磁性粒子の充填率を異ならせて透磁率の相違する第1磁性体シート及び第2磁性体シートを用意する段階と、
内部コイル部の上部及び下部に前記第1磁性体シート及び第2磁性体シートを積層して磁性体本体を形成する段階と、を含み、
前記磁性体本体を形成する段階は、
前記内部コイル部の上部及び下部に前記第1磁性体シートを積層してコア層を形成し、前記コア層の上部及び下部の少なくとも一つに前記第2磁性体シートを積層して前記コア層より透磁率の低い上部または下部カバー層を形成し、
前記第1磁性体シートは、第1金属磁性粒子と前記第1金属磁性粒子より平均粒径の小さい第2金属磁性粒子が混合され、
前記第2磁性体シートは、前記第1金属磁性粒子より平均粒径の小さい第3金属磁性粒子を含む、チップ電子部品の製造方法。 - 前記第1金属磁性粒子の粒径は11μm〜53μmで、前記第2金属磁性粒子の粒径は0.5μm〜6μmであり、
前記第3金属磁性粒子の粒径が0.5μm〜6μmである、請求項6に記載のチップ電子部品の製造方法。 - 前記コア層の厚さは、前記上部または下部カバー層の厚さの0.5倍〜10倍を満たすように前記第1磁性体シート及び第2磁性体シートを積層する、請求項6に記載のチップ電子部品の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR10-2014-0077155 | 2014-06-24 | ||
KR1020140077155A KR101580399B1 (ko) | 2014-06-24 | 2014-06-24 | 칩 전자부품 및 그 제조방법 |
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JP2016009858A JP2016009858A (ja) | 2016-01-18 |
JP6104863B2 true JP6104863B2 (ja) | 2017-03-29 |
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Country Status (4)
Country | Link |
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US (1) | US9536660B2 (ja) |
JP (1) | JP6104863B2 (ja) |
KR (1) | KR101580399B1 (ja) |
CN (1) | CN105225802B (ja) |
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JP6330692B2 (ja) * | 2015-02-25 | 2018-05-30 | 株式会社村田製作所 | 電子部品 |
KR101659216B1 (ko) * | 2015-03-09 | 2016-09-22 | 삼성전기주식회사 | 코일 전자부품 및 그 제조방법 |
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JP5048155B1 (ja) * | 2011-08-05 | 2012-10-17 | 太陽誘電株式会社 | 積層インダクタ |
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JP5853508B2 (ja) * | 2011-09-05 | 2016-02-09 | 株式会社村田製作所 | 積層インダクタ |
JP5960971B2 (ja) * | 2011-11-17 | 2016-08-02 | 太陽誘電株式会社 | 積層インダクタ |
KR101548777B1 (ko) * | 2011-12-19 | 2015-09-01 | 삼성전기주식회사 | 노이즈 제거 필터 |
JP5929401B2 (ja) | 2012-03-26 | 2016-06-08 | Tdk株式会社 | 平面コイル素子 |
KR20140003056A (ko) * | 2012-06-29 | 2014-01-09 | 삼성전기주식회사 | 파워 인덕터 및 그 제조방법 |
KR101983136B1 (ko) * | 2012-12-28 | 2019-09-10 | 삼성전기주식회사 | 파워 인덕터 및 그 제조방법 |
KR101922871B1 (ko) * | 2013-11-29 | 2018-11-28 | 삼성전기 주식회사 | 적층형 전자부품, 그 제조방법 및 그 실장기판 |
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