JP6844812B2 - コイル電子部品 - Google Patents
コイル電子部品 Download PDFInfo
- Publication number
- JP6844812B2 JP6844812B2 JP2019162398A JP2019162398A JP6844812B2 JP 6844812 B2 JP6844812 B2 JP 6844812B2 JP 2019162398 A JP2019162398 A JP 2019162398A JP 2019162398 A JP2019162398 A JP 2019162398A JP 6844812 B2 JP6844812 B2 JP 6844812B2
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- core portion
- sheet
- electronic component
- coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000006249 magnetic particle Substances 0.000 claims description 25
- 239000000696 magnetic material Substances 0.000 claims description 21
- 239000002245 particle Substances 0.000 claims description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 7
- 238000009826 distribution Methods 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 230000005415 magnetization Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 12
- 238000010030 laminating Methods 0.000 description 10
- 238000013461 design Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 239000010949 copper Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000003475 lamination Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/255—Magnetic cores made from particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
- H01F3/10—Composite arrangements of magnetic circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
- H01F3/10—Composite arrangements of magnetic circuits
- H01F2003/106—Magnetic circuits using combinations of different magnetic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0066—Printed inductances with a magnetic layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
Description
以下、本発明の一実施形態によるコイル電子部品を説明するにあたり、特に薄膜型インダクタについて説明するが、必ずしもこれに制限されるものではない。
本発明の一実施形態によるコイル電子部品の製造方法は、先ず、磁性粒子を含む第1、第2、第3磁性体シートを設ける。
20 絶縁基板
41a コア部
42b カバー部
42、44 第1及び第2内部コイル部
46 ビア
50 本体
51 第1磁性体シート
52 第2磁性体シート
53 第3磁性体シート
54 磁性粒子
81、82 第1及び第2外部電極
Claims (7)
- 磁性粒子及び絶縁樹脂を含む本体と、
前記本体の内部に配置されたコイル部と、を含み、
前記本体は、前記コイル部をカバーし、厚さが互いに異なる3種以上の第1磁性体シート、第2磁性体シート、及び第3磁性体シートが積層されたコア部、及び前記コア部をカバーし、第4磁性体シートを含むカバー部を含む多層構造であり、
前記コア部に含まれる磁性粒子は、D50が3.5μm以下の粒度分布を有し、前記第1磁性体シートは、前記コア部の厚さ方向への中心部に配置され、前記第1磁性体シート及び前記第4磁性体シートのそれぞれの厚さは、前記第2磁性体シート及び前記第3磁性体シートのそれぞれの厚さより薄い、コイル電子部品。 - 前記コア部と前記カバー部は不連続な界面を形成する、請求項1に記載のコイル電子部品。
- 前記カバー部に含まれる磁性粒子はD50が3.5μm以下である、請求項1または2に記載のコイル電子部品。
- 前記第1磁性体シート、第2磁性体シート、及び第3磁性体シートのそれぞれの厚さは10μm以上80μm以下である、請求項1から3のいずれか一項に記載のコイル電子部品。
- 前記第4磁性体シートの厚さは10μm以上80μm以下である、請求項1から4のいずれか一項に記載のコイル電子部品。
- 前記コア部に含まれる磁性Ms(saturation magnetization)値が200emu/g以上である、請求項1から5のいずれか一項に記載のコイル電子部品。
- 前記コア部に含まれる磁性粒子はCIP(carbonyl iron powder)である、請求項1から6のいずれか一項に記載のコイル電子部品。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180133371A KR102122925B1 (ko) | 2018-11-02 | 2018-11-02 | 코일 전자부품 |
KR10-2018-0133371 | 2018-11-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020072260A JP2020072260A (ja) | 2020-05-07 |
JP6844812B2 true JP6844812B2 (ja) | 2021-03-17 |
Family
ID=70459300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019162398A Active JP6844812B2 (ja) | 2018-11-02 | 2019-09-05 | コイル電子部品 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11830643B2 (ja) |
JP (1) | JP6844812B2 (ja) |
KR (1) | KR102122925B1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102244565B1 (ko) | 2019-07-24 | 2021-04-26 | 삼성전기주식회사 | 코일 전자 부품 |
CN112086261A (zh) * | 2020-09-08 | 2020-12-15 | 奇力新电子股份有限公司 | 薄膜电感及其制造方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3776281B2 (ja) * | 1999-04-13 | 2006-05-17 | アルプス電気株式会社 | インダクティブ素子 |
CN101589444B (zh) * | 2007-12-26 | 2013-03-27 | 株式会社村田制作所 | 层叠型电子器件及包括该器件的电子器件模块 |
KR101503104B1 (ko) * | 2011-08-01 | 2015-03-16 | 삼성전기주식회사 | 금속 자성 분말, 상기 금속 자성 분말을 포함하는 자성층 재료, 및 자성층 재료를 이용한 자성층을 포함하는 적층형 칩 부품 |
JP5935309B2 (ja) * | 2011-12-15 | 2016-06-15 | スミダコーポレーション株式会社 | コイル部品 |
KR20130104807A (ko) * | 2012-03-15 | 2013-09-25 | 삼성전기주식회사 | 금속 자성 분말과 이의 제조방법, 및 이를 자성층으로 포함하는 적층형 칩 소자 |
KR101792281B1 (ko) * | 2012-12-14 | 2017-11-01 | 삼성전기주식회사 | 파워 인덕터 및 그 제조 방법 |
JP6270509B2 (ja) * | 2014-01-30 | 2018-01-31 | 太陽誘電株式会社 | 積層型コイル部品 |
JP6486614B2 (ja) * | 2014-06-05 | 2019-03-20 | 国立大学法人信州大学 | インダクタ |
KR101681200B1 (ko) * | 2014-08-07 | 2016-12-01 | 주식회사 모다이노칩 | 파워 인덕터 |
KR20160076840A (ko) * | 2014-12-23 | 2016-07-01 | 삼성전기주식회사 | 칩 전자부품 및 그 제조방법 |
KR101681405B1 (ko) | 2015-03-18 | 2016-11-30 | 삼성전기주식회사 | 파워 인덕터 |
KR102217286B1 (ko) * | 2015-04-01 | 2021-02-19 | 삼성전기주식회사 | 하이브리드 인덕터 및 그 제조방법 |
KR20160140153A (ko) | 2015-05-29 | 2016-12-07 | 삼성전기주식회사 | 코일 전자부품 및 그 제조방법 |
KR101900879B1 (ko) * | 2015-10-16 | 2018-09-21 | 주식회사 모다이노칩 | 파워 인덕터 |
JP6546074B2 (ja) * | 2015-11-17 | 2019-07-17 | 太陽誘電株式会社 | 積層インダクタ |
JP6613998B2 (ja) * | 2016-04-06 | 2019-12-04 | 株式会社村田製作所 | コイル部品 |
KR20170120779A (ko) * | 2016-04-22 | 2017-11-01 | 삼성전기주식회사 | 인덕터 및 그 제조 방법 |
KR101830329B1 (ko) | 2016-07-19 | 2018-02-21 | 주식회사 모다이노칩 | 파워 인덕터 |
JP2018019062A (ja) * | 2016-07-27 | 2018-02-01 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | インダクタ |
US10790159B2 (en) * | 2018-03-14 | 2020-09-29 | Intel Corporation | Semiconductor package substrate with through-hole magnetic core inductor using conductive paste |
-
2018
- 2018-11-02 KR KR1020180133371A patent/KR102122925B1/ko active IP Right Grant
-
2019
- 2019-09-05 JP JP2019162398A patent/JP6844812B2/ja active Active
- 2019-09-06 US US16/562,826 patent/US11830643B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2020072260A (ja) | 2020-05-07 |
KR102122925B1 (ko) | 2020-06-15 |
US20200143972A1 (en) | 2020-05-07 |
KR20200050593A (ko) | 2020-05-12 |
US11830643B2 (en) | 2023-11-28 |
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