JP7053095B2 - 積層セラミックキャパシタ - Google Patents
積層セラミックキャパシタ Download PDFInfo
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- JP7053095B2 JP7053095B2 JP2019078228A JP2019078228A JP7053095B2 JP 7053095 B2 JP7053095 B2 JP 7053095B2 JP 2019078228 A JP2019078228 A JP 2019078228A JP 2019078228 A JP2019078228 A JP 2019078228A JP 7053095 B2 JP7053095 B2 JP 7053095B2
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- 239000003985 ceramic capacitor Substances 0.000 title claims description 39
- 229910000765 intermetallic Inorganic materials 0.000 claims description 116
- 229920005989 resin Polymers 0.000 claims description 84
- 239000011347 resin Substances 0.000 claims description 84
- 229910052751 metal Inorganic materials 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 35
- 239000002923 metal particle Substances 0.000 claims description 32
- 238000002844 melting Methods 0.000 claims description 31
- 230000008018 melting Effects 0.000 claims description 31
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 claims description 18
- 230000035699 permeability Effects 0.000 claims description 11
- 229910052718 tin Inorganic materials 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000010949 copper Substances 0.000 description 41
- 238000007747 plating Methods 0.000 description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 17
- 239000000843 powder Substances 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 14
- 229920001187 thermosetting polymer Polymers 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 230000035882 stress Effects 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 6
- 239000011148 porous material Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- 150000002736 metal compounds Chemical class 0.000 description 4
- 238000010304 firing Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 229910017980 Ag—Sn Inorganic materials 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
- 229910017927 Cu—Sn Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000516 effect on sexuality Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
110 本体
111 誘電体層
121、122 第1及び第2内部電極
130、140 第1及び第2外部電極
131、141 電極層
132、142 第1金属間化合物層
133、143 第2金属間化合物層
134、144 導電性樹脂層
135、145 第1めっき層
136、146 第2めっき層
134a 金属粒子
134b 導電性金属
134c ベース樹脂
Claims (12)
- 誘電体層及び内部電極を含む本体と、前記本体の一面に配置される外部電極と、を含み、
前記外部電極は、
前記内部電極と接触する電極層と、
前記電極層上に配置され、第1金属間化合物のCu3Snからなる第1金属間化合物層と、
前記第1金属間化合物層上に配置され、第2金属間化合物のCu6Sn5からなる第2金属間化合物層と、
前記第2金属間化合物層上に配置され、複数の金属粒子、ベース樹脂、及び前記ベース樹脂の硬化温度よりも低い融点を有する導電性金属を含む導電性樹脂層と、
を含み、
前記第1金属間化合物層は、前記電極層の一面に形成される、
積層セラミックキャパシタ。 - 前記複数の金属粒子は銀(Ag)であり、
前記ベース樹脂の硬化温度よりも低い融点を有する導電性金属はスズ(Sn)である、
請求項1に記載の積層セラミックキャパシタ。 - 前記第2金属間化合物層の厚さに対する前記第1金属間化合物層の厚さの比は0.1~1.0である、
請求項1又は2に記載の積層セラミックキャパシタ。 - 前記複数の金属粒子のサイズは0.5~3.0μmである、
請求項1~3の何れか一項に記載の積層セラミックキャパシタ。 - 前記ベース樹脂の硬化温度よりも低い融点を有する導電性金属の含有量は10wt%以上33wt%未満である、
請求項1~4の何れか一項に記載の積層セラミックキャパシタ。 - 前記第1金属間化合物層内のボイド(void)の数に対する前記第2金属間化合物層内のボイド(void)の数の比は1.0未満である、
請求項1~5の何れか一項に記載の積層セラミックキャパシタ。 - 誘電体層及び内部電極を含む本体と、
前記本体の一面に配置される外部電極と、
を含み、
前記外部電極は、
前記内部電極と接触する電極層と、
前記電極層上に配置され、第1金属間化合物からなる第1金属間化合物層と、
前記第1金属間化合物層上に配置され、第2金属間化合物からなる第2金属間化合物層と、
前記第2金属間化合物層上に配置され、複数の金属粒子、ベース樹脂、及び前記ベース樹脂の硬化温度よりも低い融点を有する導電性金属を含む導電性樹脂層と、
を含み、
前記第2金属間化合物層内のボイド(void)の数は、前記第1金属間化合物層内のボイド(void)の数よりも少なく、
前記第1金属間化合物層は、前記電極層の一面に形成され、
第1金属間化合物はCu 3 Snであり、
第2金属間化合物はCu 6 Sn 5 である、
積層セラミックキャパシタ。 - 前記複数の金属粒子は銀(Ag)であり、
前記ベース樹脂の硬化温度よりも低い融点を有する導電性金属はスズ(Sn)である、
請求項7に記載の積層セラミックキャパシタ。 - 前記第2金属間化合物層の厚さに対する前記第1金属間化合物層の厚さの比は0.1~1.0である、
請求項7又は8に記載の積層セラミックキャパシタ。 - 前記複数の金属粒子のサイズは0.5~3.0μmである、
請求項7から9の何れか一項に記載の積層セラミックキャパシタ。 - 前記ベース樹脂の硬化温度よりも低い融点を有する導電性金属の含有量は10wt%以上33wt%未満である、
請求項7から10の何れか一項に記載の積層セラミックキャパシタ。 - 前記第1金属間化合物層の透湿率に対する前記第2金属間化合物層の透湿率の比は0.5以下である、
請求項7から11の何れか一項に記載の積層セラミックキャパシタ。
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JP2021202783A JP7302900B2 (ja) | 2018-11-29 | 2021-12-14 | 積層セラミックキャパシタ |
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KR10-2018-0150773 | 2018-11-29 | ||
KR20180150773 | 2018-11-29 | ||
KR1020190018478A KR20200064860A (ko) | 2018-11-29 | 2019-02-18 | 적층 세라믹 커패시터 |
KR10-2019-0018478 | 2019-02-18 |
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JP2021202783A Division JP7302900B2 (ja) | 2018-11-29 | 2021-12-14 | 積層セラミックキャパシタ |
Publications (2)
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JP2020088372A JP2020088372A (ja) | 2020-06-04 |
JP7053095B2 true JP7053095B2 (ja) | 2022-04-12 |
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JP2019078228A Active JP7053095B2 (ja) | 2018-11-29 | 2019-04-17 | 積層セラミックキャパシタ |
JP2021202783A Active JP7302900B2 (ja) | 2018-11-29 | 2021-12-14 | 積層セラミックキャパシタ |
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Country Status (3)
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US (2) | US10903010B2 (ja) |
JP (2) | JP7053095B2 (ja) |
CN (1) | CN111243864B (ja) |
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KR20210149355A (ko) * | 2020-06-02 | 2021-12-09 | 삼성전기주식회사 | 전자 부품 및 그 제조방법 |
KR20220070922A (ko) * | 2020-11-23 | 2022-05-31 | 삼성전기주식회사 | 적층형 전자 부품 |
KR20220090988A (ko) * | 2020-12-23 | 2022-06-30 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 이의 실장 기판 |
KR20230064236A (ko) * | 2021-11-03 | 2023-05-10 | 삼성전기주식회사 | 적층형 커패시터 |
Citations (5)
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JP2009141292A (ja) | 2007-12-11 | 2009-06-25 | Taiyo Kagaku Kogyo Kk | 外部端子電極具備電子部品、その搭載電子用品及び外部端子電極具備電子部品の製造方法 |
WO2014097823A1 (ja) | 2012-12-18 | 2014-06-26 | 株式会社村田製作所 | 積層セラミック電子部品 |
JP2016136557A (ja) | 2015-01-23 | 2016-07-28 | Tdk株式会社 | 積層型セラミック電子部品 |
JP2017011145A (ja) | 2015-06-24 | 2017-01-12 | 株式会社村田製作所 | 積層セラミックコンデンサ |
JP2018098475A (ja) | 2016-12-09 | 2018-06-21 | 株式会社村田製作所 | 積層セラミックコンデンサ |
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JP2007281400A (ja) * | 2006-04-04 | 2007-10-25 | Taiyo Yuden Co Ltd | 表面実装型セラミック電子部品 |
JP5293506B2 (ja) | 2009-08-31 | 2013-09-18 | Tdk株式会社 | セラミック電子部品及びセラミック電子部品の製造方法 |
KR101532114B1 (ko) * | 2011-11-11 | 2015-06-29 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
JP5799948B2 (ja) * | 2012-02-03 | 2015-10-28 | 株式会社村田製作所 | セラミック電子部品及びその製造方法 |
KR102004769B1 (ko) * | 2013-09-30 | 2019-07-29 | 삼성전기주식회사 | 적층 세라믹 커패시터, 그 제조방법 및 적층 세라믹 커패시터 실장 기판 |
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KR102105345B1 (ko) | 2016-12-09 | 2020-04-28 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층 세라믹 콘덴서 |
KR101892849B1 (ko) * | 2017-03-02 | 2018-08-28 | 삼성전기주식회사 | 전자 부품 |
JP6841121B2 (ja) * | 2017-03-29 | 2021-03-10 | Tdk株式会社 | 貫通コンデンサ |
KR101922879B1 (ko) * | 2017-04-04 | 2018-11-29 | 삼성전기 주식회사 | 적층형 커패시터 |
-
2019
- 2019-04-17 JP JP2019078228A patent/JP7053095B2/ja active Active
- 2019-04-18 US US16/387,984 patent/US10903010B2/en active Active
- 2019-06-25 CN CN201910552697.6A patent/CN111243864B/zh active Active
-
2020
- 2020-12-24 US US17/133,851 patent/US11393628B2/en active Active
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2021
- 2021-12-14 JP JP2021202783A patent/JP7302900B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009141292A (ja) | 2007-12-11 | 2009-06-25 | Taiyo Kagaku Kogyo Kk | 外部端子電極具備電子部品、その搭載電子用品及び外部端子電極具備電子部品の製造方法 |
WO2014097823A1 (ja) | 2012-12-18 | 2014-06-26 | 株式会社村田製作所 | 積層セラミック電子部品 |
JP2016136557A (ja) | 2015-01-23 | 2016-07-28 | Tdk株式会社 | 積層型セラミック電子部品 |
JP2017011145A (ja) | 2015-06-24 | 2017-01-12 | 株式会社村田製作所 | 積層セラミックコンデンサ |
JP2018098475A (ja) | 2016-12-09 | 2018-06-21 | 株式会社村田製作所 | 積層セラミックコンデンサ |
Also Published As
Publication number | Publication date |
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US20200176189A1 (en) | 2020-06-04 |
JP7302900B2 (ja) | 2023-07-04 |
US20210118616A1 (en) | 2021-04-22 |
JP2022031927A (ja) | 2022-02-22 |
CN111243864A (zh) | 2020-06-05 |
US10903010B2 (en) | 2021-01-26 |
US11393628B2 (en) | 2022-07-19 |
CN111243864B (zh) | 2022-09-09 |
JP2020088372A (ja) | 2020-06-04 |
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