JP6385370B2 - 安定な熱ラジカル硬化性シリコーン粘着剤組成物 - Google Patents
安定な熱ラジカル硬化性シリコーン粘着剤組成物 Download PDFInfo
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- JP6385370B2 JP6385370B2 JP2015557161A JP2015557161A JP6385370B2 JP 6385370 B2 JP6385370 B2 JP 6385370B2 JP 2015557161 A JP2015557161 A JP 2015557161A JP 2015557161 A JP2015557161 A JP 2015557161A JP 6385370 B2 JP6385370 B2 JP 6385370B2
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- 230000001590 oxidative effect Effects 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- GSQOBCQZNDZUQP-UHFFFAOYSA-N oxolan-2-ylmethyl 2-methylprop-2-enoate;oxolan-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CCCO1.CC(=C)C(=O)OCC1CCCO1 GSQOBCQZNDZUQP-UHFFFAOYSA-N 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- LGOPTUPXVVNJFH-UHFFFAOYSA-N pentadecanethioic s-acid Chemical compound CCCCCCCCCCCCCCC(O)=S LGOPTUPXVVNJFH-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- YKGCCFHSXQHWIG-UHFFFAOYSA-N phenothiazin-3-one Chemical compound C1=CC=C2SC3=CC(=O)C=CC3=NC2=C1 YKGCCFHSXQHWIG-UHFFFAOYSA-N 0.000 description 1
- 150000002990 phenothiazines Chemical class 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 1
- 229920000438 poly[methyl(3,3,3-trifluoropropyl)siloxane] polymer Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920005651 polypropylene glycol dimethacrylate Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- QTECDUFMBMSHKR-UHFFFAOYSA-N prop-2-enyl prop-2-enoate Chemical compound C=CCOC(=O)C=C QTECDUFMBMSHKR-UHFFFAOYSA-N 0.000 description 1
- JTQPTNQXCUMDRK-UHFFFAOYSA-N propan-2-olate;titanium(2+) Chemical compound CC(C)O[Ti]OC(C)C JTQPTNQXCUMDRK-UHFFFAOYSA-N 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- WYVAMUWZEOHJOQ-UHFFFAOYSA-N propionic anhydride Chemical compound CCC(=O)OC(=O)CC WYVAMUWZEOHJOQ-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 1
- 125000002568 propynyl group Chemical group [*]C#CC([H])([H])[H] 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- JEXVQSWXXUJEMA-UHFFFAOYSA-N pyrazol-3-one Chemical compound O=C1C=CN=N1 JEXVQSWXXUJEMA-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000012966 redox initiator Substances 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052990 silicon hydride Inorganic materials 0.000 description 1
- ZMKCPQNROFSGKH-UHFFFAOYSA-J silicon(4+);tetrabenzoate Chemical compound [Si+4].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 ZMKCPQNROFSGKH-UHFFFAOYSA-J 0.000 description 1
- XUIMIQQOPSSXEZ-OUBTZVSYSA-N silicon-29 atom Chemical compound [29Si] XUIMIQQOPSSXEZ-OUBTZVSYSA-N 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000004447 silicone coating Substances 0.000 description 1
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 150000003900 succinic acid esters Chemical class 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- YBBRCQOCSYXUOC-UHFFFAOYSA-N sulfuryl dichloride Chemical class ClS(Cl)(=O)=O YBBRCQOCSYXUOC-UHFFFAOYSA-N 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- CZDYPVPMEAXLPK-UHFFFAOYSA-N tetramethylsilane Chemical compound C[Si](C)(C)C CZDYPVPMEAXLPK-UHFFFAOYSA-N 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- 150000003608 titanium Chemical class 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- YUPAWYWJNZDARM-UHFFFAOYSA-N tri(butan-2-yl)borane Chemical compound CCC(C)B(C(C)CC)C(C)CC YUPAWYWJNZDARM-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- CMHHITPYCHHOGT-UHFFFAOYSA-N tributylborane Chemical compound CCCCB(CCCC)CCCC CMHHITPYCHHOGT-UHFFFAOYSA-N 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
- MZHULIWXRDLGRR-UHFFFAOYSA-N tridecyl 3-(3-oxo-3-tridecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCC MZHULIWXRDLGRR-UHFFFAOYSA-N 0.000 description 1
- XOALFFJGWSCQEO-UHFFFAOYSA-N tridecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C=C XOALFFJGWSCQEO-UHFFFAOYSA-N 0.000 description 1
- VYDLWQPLCBCJGV-UHFFFAOYSA-N tridodecylborane Chemical compound CCCCCCCCCCCCB(CCCCCCCCCCCC)CCCCCCCCCCCC VYDLWQPLCBCJGV-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- FZMJEGJVKFTGMU-UHFFFAOYSA-N triethoxy(octadecyl)silane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OCC)(OCC)OCC FZMJEGJVKFTGMU-UHFFFAOYSA-N 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- ROWWCTUMLAVVQB-UHFFFAOYSA-N triethoxysilylmethanamine Chemical compound CCO[Si](CN)(OCC)OCC ROWWCTUMLAVVQB-UHFFFAOYSA-N 0.000 description 1
- ANELUDATZNYOPH-UHFFFAOYSA-N triethylsilyl propanoate Chemical compound CCC(=O)O[Si](CC)(CC)CC ANELUDATZNYOPH-UHFFFAOYSA-N 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- XYJRNCYWTVGEEG-UHFFFAOYSA-N trimethoxy(2-methylpropyl)silane Chemical compound CO[Si](OC)(OC)CC(C)C XYJRNCYWTVGEEG-UHFFFAOYSA-N 0.000 description 1
- UBMUZYGBAGFCDF-UHFFFAOYSA-N trimethoxy(2-phenylethyl)silane Chemical compound CO[Si](OC)(OC)CCC1=CC=CC=C1 UBMUZYGBAGFCDF-UHFFFAOYSA-N 0.000 description 1
- XVZMLSWFBPLMEA-UHFFFAOYSA-N trimethoxy(2-pyridin-2-ylethyl)silane Chemical compound CO[Si](OC)(OC)CCC1=CC=CC=N1 XVZMLSWFBPLMEA-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- AXNJHBYHBDPTQF-UHFFFAOYSA-N trimethoxy(tetradecyl)silane Chemical compound CCCCCCCCCCCCCC[Si](OC)(OC)OC AXNJHBYHBDPTQF-UHFFFAOYSA-N 0.000 description 1
- ASEGJSMHCHEQSA-UHFFFAOYSA-N trimethoxy(undec-10-enyl)silane Chemical compound CO[Si](OC)(OC)CCCCCCCCCC=C ASEGJSMHCHEQSA-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- ARKBFSWVHXKMSD-UHFFFAOYSA-N trimethoxysilylmethanamine Chemical compound CO[Si](CN)(OC)OC ARKBFSWVHXKMSD-UHFFFAOYSA-N 0.000 description 1
- JNRUXZIXAXHXTN-UHFFFAOYSA-N trimethyl(2-methylbut-3-yn-2-yloxy)silane Chemical compound C#CC(C)(C)O[Si](C)(C)C JNRUXZIXAXHXTN-UHFFFAOYSA-N 0.000 description 1
- GBXQPDCOMJJCMJ-UHFFFAOYSA-M trimethyl-[6-(trimethylazaniumyl)hexyl]azanium;bromide Chemical compound [Br-].C[N+](C)(C)CCCCCC[N+](C)(C)C GBXQPDCOMJJCMJ-UHFFFAOYSA-M 0.000 description 1
- WXRGABKACDFXMG-UHFFFAOYSA-N trimethylborane Chemical compound CB(C)C WXRGABKACDFXMG-UHFFFAOYSA-N 0.000 description 1
- VIYXXANHGYSBLY-UHFFFAOYSA-N trimethylsilyl 2,2,2-trifluoroacetate Chemical compound C[Si](C)(C)OC(=O)C(F)(F)F VIYXXANHGYSBLY-UHFFFAOYSA-N 0.000 description 1
- QHUNJMXHQHHWQP-UHFFFAOYSA-N trimethylsilyl acetate Chemical compound CC(=O)O[Si](C)(C)C QHUNJMXHQHHWQP-UHFFFAOYSA-N 0.000 description 1
- VFFKJOXNCSJSAQ-UHFFFAOYSA-N trimethylsilyl benzoate Chemical compound C[Si](C)(C)OC(=O)C1=CC=CC=C1 VFFKJOXNCSJSAQ-UHFFFAOYSA-N 0.000 description 1
- KBPSATXXRVXAAJ-UHFFFAOYSA-N trimethylsilyl formate Chemical compound C[Si](C)(C)OC=O KBPSATXXRVXAAJ-UHFFFAOYSA-N 0.000 description 1
- OGJDNTCMTVTFAS-UHFFFAOYSA-N trioctylborane Chemical compound CCCCCCCCB(CCCCCCCC)CCCCCCCC OGJDNTCMTVTFAS-UHFFFAOYSA-N 0.000 description 1
- AZSKHRTUXHLAHS-UHFFFAOYSA-N tris(2,4-di-tert-butylphenyl) phosphate Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(=O)(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C AZSKHRTUXHLAHS-UHFFFAOYSA-N 0.000 description 1
- 229940057402 undecyl alcohol Drugs 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
- B05D3/0272—After-treatment with ovens
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/14—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C—CHEMISTRY; METALLURGY
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- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
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- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
(a)式(R7O)3−zR6 zSi−Q−(R25 2SiO2/2)y−Q−SiR6 z(OR7)3−zのオルガノポリシロキサンポリマー
[式中、各R25は、独立して、1〜6個の炭素原子を有する一価の炭化水素基であり、各R6は、独立して、1〜6個の炭素原子を有する一価の炭化水素基であり、各R7は、独立して、アルキル基及びアルコキシアルキル基からなる群から選択され、Qは二価の結合ラジカルであり、添字zは値0、1、又は2を有し、かつ添字yは値60〜1000を有する]及び
(i)R26 3SiO1/2単位及びSiO4/2単位を含むアルケニル官能性シロキサン樹脂
[式中、R26は、独立して、1〜6個の炭素原子を有する一価の炭化水素基であり、但し、少なくとも1つのR26はアルケニルラジカルであり、
R26 3SiO1/2単位のSiO4/2単位に対するモル比は値0.5/1〜1.5/1を有する]、
(ii)分子末端にケイ素結合水素を少なくとも1個有するアルコキシシラン官能性オルガノシロキサン化合物、
(iii)末端保護剤、
の、(iv)ヒドロシリル化触媒の存在下での反応による反応生成物を含む、アルコキシ官能性オルガノポリシロキサン樹脂、を含む。
a)1分子当たり平均して少なくとも2つの脂肪族不飽和有機基を有するポリオルガノシロキサン、
b)1分子当たり平均して4〜15個のケイ素原子を有するポリオルガノ水素シロキサン、及び
c)1分子当たり、少なくとも1つの脂肪族不飽和有機基、及び1つ以上のラジカル硬化性基を有する反応性種、を含む成分の、
(d)ヒドロシリル化触媒の存在下での反応による反応生成物として形成され得る。
1)
a)1分子当たり平均して少なくとも2つの脂肪族不飽和有機基を有するポリオルガノシロキサン、
b)1分子当たり、平均して4〜15個のSi原子、及び成分a)中の脂肪族不飽和有機基当たり少なくとも4個のケイ素結合水素原子を有する、ポリオルガノ水素シロキサン、及び
c)1分子当たり、少なくとも1つの脂肪族不飽和有機基、及びアクリレート基及びメタクリレート基から選択される1つ以上のラジカル硬化性基を有する反応性種、を含む成分を、
(d)ヒドロシリル化触媒の存在下での反応による反応生成物として形成され得る。
I)
a)1分子当たり平均して少なくとも2つの脂肪族不飽和有機基を有するポリオルガノシロキサン、
b)1分子当たり、平均して4〜15個のSi原子、及び成分a)中の脂肪族不飽和有機基当たり少なくとも4個のケイ素結合水素原子を有する、ポリオルガノ水素シロキサン、を、
d)ヒドロシリル化触媒の存在下で同時に反応させること、及びその後、
II)工程I)の生成物を、
c)1分子当たり、少なくとも1つの脂肪族不飽和有機基、及びアクリレート基及びメタクリレート基から選択される1つ以上のラジカル硬化性基を有する反応性種と、
[但し、工程I)及び/又は工程II)における成分は、f)充填材、g)非反応性シリコーン樹脂、又はこれらの組み合わせを更に含み、但し、工程I)及び工程II)間に中間体精製工程は実施されず、但し、SiHb/Via比は4/1〜20/1の範囲であり、かつこのプロセスにより調製される生成物は、成分a)のポリオルガノシロキサンの各分子末端に、平均して2つ以上の硬化性基を有する]。
(式中、下付き文字q’は、1,500以下の値を有する)。その他の充填材処理剤としては、モノ末端封鎖アルコキシ官能性ポリジオルガノシロキサン、すなわち、一端にアルコキシ基を有するポリジオルガノシロキサンが挙げられる。このような充填材処理剤の例は、式R25R26 2SiO(R26 2SiO)u’Si(OR27)3であり、式中、添字u’は値0〜100、あるいは1〜50、あるいは1〜10、及びあるいは3〜6を有する。各R25は、独立して、メチル、エチル、プロピル、ブチル、ヘキシル、及びオクチルなどのアルキル基、並びにビニル、アリル、ブテニル、及びヘキセニルなどのアルケニル基から選択される。各R26は、独立して、メチル、エチル、プロピル、ブチル、ヘキシル及びオクチルといったアルキル基である。各R27は、独立して、メチル、エチル、プロピル及びブチルといったアルキル基である。あるいは、各R25、各R26、及び各R27はメチルである。あるいは、各R25はビニルである。あるいは、各R26及び各R27はメチルである。
(a)式(OR7)3−zR6 zSi−Q−(R25 2SiO2/2)y−Q−SiR6 z(OR7)3−zのオルガノポリシロキサンポリマー
[式中、各R25は、独立して、1〜6個の炭素原子を有する一価の炭化水素基であり、各R6は、独立して、1〜6個の炭素原子を有する一価の炭化水素基であり、各R7は、独立して、アルキル基及びアルコキシアルキル基からなる群から選択され、Qは二価の結合ラジカルであり、添字zは値0、1、又は2を有し、かつ添字yは値60〜1000を有する]及び
(b)
(i)R26 3SiO1/2単位及びSiO4/2単位を含むアルケニル官能性シロキサン樹脂、
[式中、R26は、独立して、1〜6個の炭素原子を有する一価の炭化水素基であり、但し、少なくとも1つのR26はアルケニルラジカルであり、
R26 3SiO1/2単位のSiO4/2単位に対するモル比は値0.5/1〜1.5/1を有する]、
(ii)分子末端にケイ素結合水素を少なくとも1個有するアルコキシシラン官能性オルガノシロキサン化合物、
(iii)末端保護剤、
の、(iv)ヒドロシリル化触媒の存在下での反応による反応生成物を含む、アルコキシ官能性オルガノポリシロキサン樹脂、を含む。
A.T(Oz)及びD(Oz)単位の生成に対する異性体還元剤の添加量の変動
乾いた三つ口フラスコに、100g DOW CORNING(登録商標)SFD−119(ジメチルビニル末端化ジメチルシロキサン)、6.2g環状メチル水素シロキサン、14gアリルメタクリレート(AMA)、0.2gブチル化ヒドロキシトルエン(BHT)及び様々な量の異性体還元剤(Dow Corning社(Midland,Michigan)から利用可能なOFS−1579、又はDBAP(2,6−ジ−tert−ブチル−4−(ジメチルアミノメチル)フェノールのいずれか)を入れ、窒素雰囲気下で混合した。0.12gの白金触媒(DOW CORNING(登録商標)2−0707)を添加し、この混合物を更に5分間混合した。次に、混合物を1時間60℃に加熱した。IR分光法を用い、2173cm−1におけるSiHピークの減少により反応をモニターした。混合物を室温に冷却し、マレイン酸ジアリル(DAM)を添加した。T(Oz)及びD(Oz)ユニットの存在について、29Si NMRにより反応混合物を分析した。以下表1及び表2に結果を要約し、配合物(OFS−1579又はDBAPのいずれか)に少なくとも100ppmの異性体還元剤を導入することで、T(Oz)及びD(Oz)単位のレベルが少なくとも10%低減すること(これは、メチル水素シロキサンのSiH基のアリルメタクリレートへのβ付加の少なくとも10%の低減に相当する)を示す。
10L Turelloミキサーに、5000gのDOW CORNING(登録商標)SFD117、196.34gの環状メチル水素シロキサン、467.76gのAMA及び1.13gのBHTを入れ、15分間混合した。5.45gの白金触媒を添加し、混合物を室温で更に15分間混合した。混合物を80℃で1時間加熱した。SIHシグナルの消失についてIRでサンプルを評価した。1時間の時点で混合物を45℃未満に冷却し、11.33gのDAMを添加した。減圧を7.3kPa(55mmHg)に設定し、温度は80℃に上昇させ、混合物を30分間抽出した。得られた組成物(サンプル1)をパッケージング前に30°未満に冷却した。
A.メタクリレートクラスタ化シリコーンポリマー添加(MCP−1)及び非添加(MCP)異性体還元剤の調製
50LのTurelloミキサーに、12kgのシリコーンポリマーマスターバッチ(MB2030)(SFD−128/シリカブレンド)、6.77kgのSFD120ポリマー、1.12kgのOS20 silicone fluid [Dow Corning社(Midland,MI)から入手可能なメチルシロキサン液]及び20.45gのOFS−1579異性体還元剤を充填した。窒素雰囲気(2%酸素)を利用して混合物を不活性化し、15分間撹拌した。この均質化された混合物に6gのBHT、409.7gの環状メチル水素シロキサン、及び965.3gのAMAを添加した。得られた混合物を室温で更に20分間撹拌し、26.62gの白金触媒を添加し、混合した。混合物を更に10分間撹拌した後、温度を60℃に設定した。温度を30分間60℃に保持した後、40℃超に冷却し、26.62gのDAMを加えた。次に、混合物を35℃未満に冷却し、182.8gのメチルトリメトキシシラン(MTM)を添加した。次に混合物を60℃に加熱して30分間保持した後、温度を80℃に上昇させ、7.3kPa(55mm Hg)で40分間減圧した。得られるポリマーを以下MCP−1と呼ぶ。
10kg Turelloミキサーに樹脂ポリマーブレンド(RPB)と酸化マグネシウム及び鉄顔料BA33を添加し、窒素雰囲気下で15分間混練した。このミキサーに、メチルトリメトキシシラン(DOW CORNING(登録商標)−Z6070)及びヘキサメチルジシラザン(DOW CORNING(登録商標)4−2839)の混合物を添加した。混合物を15分間混練した後、材料を60〜80℃に蒸気加熱した。温度を30分間60℃に保持した。温度を120℃に上昇させ、7kPa(50torr)未満で60分間十分に減圧した。混合物を40℃未満に冷却した後、アルコキシル化剤(ETMポリマー−DOW CORNING(登録商標)XCF3−6105)及び末端保護剤(Bis H DOW CORNING(登録商標)2−5161)を添加した。15分間混合した後、白金触媒を添加して更に15分間混合し、この混合物を75〜90℃の温度に加熱した。20分以内に反応が完了するまで、SiH/CH3比をIRによりモニターした。7.3kPa(55mm Hg)の十分な減圧下で、30分間125℃に加熱して材料を液化した。
以下表4に掲載の通り、異性体還元剤(すなわち、MCP−1及びMCP、それぞれ)を添加した及び非添加のメタクリレートクラスタ化シリコーンポリマーと、ARPB−1並びに追加の促進剤パッケージ(promoter packages)及びラジカル開始剤とを冷却しながら混練し、粘着剤組成物を調製した。次に、表5に掲載の通り、得られた粘着剤組成物の粘度を1、7、及び14日の時点で評価した。
1 Dow Corning社(Midland,Michigan)から利用可能なT触媒
2 Dow CorningH社(Midland,Michigan)から利用可能なメタクリルオキシプロピルトリメトキシシラン
3 トリアリルイソシアヌレート(日本化成株式会社から利用可能)
4 Silquestから利用可能なエポキシ官能性シラン
5 Silquestから利用可能なγ−アミノプロピルトリエトキシシラン
6 DuPont(商標)から利用可能なn−ブチルチタン酸塩
7 Sigma−Aldrichから利用可能
8 Dow Corning社(Midland,Michigan)から利用可能なイソブチルトリメトキシシラン
9 Dow Corning社(Midland,Michigan)から利用可能なビニルジメチルクロロシラン
10 2,5−チオフェンジイルビス(5−tert−ブチル−1,3−ベンゾオキサゾール)(Cibaから市販)
次に、粘着剤MCP−1を、商業的に利用可能であり、様々な金属及びプラスチック支持体の両方に対して優れた粘着性を有することが公知である様々な粘着剤組成物(DOW CORNING(登録商標)866、3−6265、3−6265 HP、及び7091)と比較した。工業用プロセスで使用される現在の一液型シリコーン粘着剤は、一般に、2種の硬化プロセスのうちの1つを使用するものである。水素化シリコーン系架橋剤とシリコーンビニルポリマーを利用する、熱活性化した白金触媒による付加反応は、DOW CORNING(登録商標)866、3−6265、及び3−6265HPにより利用される。DOW CORNING(登録商標)7091は縮合硬化を利用し、この縮合硬化では、アルコキシシリコーンポリマーは、雰囲気中の水分に暴露することによりトリガーされるARPBで利用されるものと等価のものである。
11Alcladアルミニウム、Type AD Q−パネル2024T3[Q−Lab Corporation(800.,Cleveland,OH 44145 USA)]
123105 PBT:ポリブチレンテレフタラートCelanex(登録商標)3105[Ticona North America(Florence,KY 41042)から入手可能]
13LCP:液晶ポリマー、Xydar(登録商標)[Solvay Chemicals(Houston,Texas 77098 USA)から入手可能]
14PA66:ポリアミドUltramid(登録商標)[BASF Corporation(Florham Park,NJ 07932 USA)から入手可能]
15PC:ポリカーボネートLexan(登録商標)[SABIC Innovative Plastics Pittsfield(MA 01201,USA)から入手可能]
16PE:ポリエチレン中高密度PE(PEX)[Lowes,Mooresville(NC 28117 USA)から入手可能]
17FR−4:エポキシガラスファイバー積層体[Norplex−Micarta(Postville,Iowa,USA)から入手可能]
E.別のラジカル開始剤によるクラスタ化官能性ポリオルガノシロキサンの評価
RBM−9020変性剤、ジクロロベンゾイル過酸化物系開始剤を、Perkadox L−50−PS及び高温ベンゾイルペルオキシド系開始剤(表6を参照されたい)に置き換えたこと以外上記プロセスを用い、異なる硬化条件下で、異なる4種の支持体、(ポリブチルテレフタラート(PBT)、ポリフェニルスルホン(PPS)、Alclad(商標)アルミニウム支持体(AL)、及びアルミニウムダイキャスト金属(ADC))に対し高温硬化材料を評価した。
次に、分配性について熱ラジカル硬化性シリコーン組成物を評価した。
12 AP3−DOW CORNING(登録商標)3−1717−トリメトキシシリルエチル)テトラメチルジシロキサン末端化ポリジメチルシロキサン(DOW CORNING(登録商標)SFD−117)、約2000cps。
Claims (20)
- 安定な熱ラジカル硬化性シリコーン粘着剤組成物であって、
(I)アクリレート基及びメタクリレート基から選択される少なくとも1つのラジカル硬化性基を有するクラスタ化官能性ポリオルガノシロキサン、
(II)反応性樹脂及びポリマーであって、
(a)式(R7O)3−zR6 zSi−Q−(R25 2SiO2/2)y−Q−SiR6 z(OR7)3−zのオルガノポリシロキサンポリマー
[式中、各R25は、独立して、1〜6個の炭素原子を有する一価の炭化水素基であり、各R6は、独立して、1〜6個の炭素原子を有する一価の炭化水素基であり、各R7は、独立して、アルキル基及びアルコキシアルキル基からなる群から選択され、Qは2価の連結基であり、添字zは値0、1、又は2を有し、かつ添字yは値60〜1000を有する]及び
(b)
(i)R26 3SiO1/2単位及びSiO4/2単位を含むアルケニル官能性シロキサン樹脂
[式中、R26は、独立して、1〜6個の炭素原子を有する一価の炭化水素基であり、但し、少なくとも1つのR26はアルケニル基であり、
R26 3SiO1/2単位のSiO4/2単位に対するモル比は、値0.5/1〜1.5/1を有する]、
(ii)分子末端にケイ素結合水素を少なくとも1個有するアルコキシシラン官能性オルガノシロキサン化合物、及び
(iii)式R17 3SiO−(R17 2SiO)s−SiR17 2H又はR18 3SiO−(R18 2SiO)t−(HR18SiO)−SiR18 3の末端封止剤又はこれらの組み合わせ[式中、各R17及びR18は、独立して一価の炭化水素基であり、添字s及びtは独立して、0〜10の範囲の値を有する]、の、
(iv)ヒドロシリル化触媒の存在下での、反応による反応生成物を含む、アルコキシ官能性オルガノポリシロキサン樹脂、
を含む反応性樹脂及びポリマー、
(III)ラジカル開始剤、
(IV)水分硬化開始剤、並びに
(V)架橋剤、を含む、安定な熱ラジカル硬化性シリコーン粘着剤組成物。 - 前記クラスタ化官能性ポリオルガノシロキサン(I)が、
a)1分子当たり平均して少なくとも2つの脂肪族不飽和有機基を有するポリオルガノシロキサン、
b)1分子当たり、平均して4〜15個のケイ素原子、及び成分a)中の脂肪族不飽和有機基当たり少なくとも4個のケイ素結合水素原子を有する、ポリオルガノ水素シロキサン、並びに
c)1分子当たり、少なくとも1つの脂肪族不飽和有機基、及び、アクリレート基及びメタクリレート基から選択される1つ以上の硬化性基を有する反応性種の、
d)ヒドロシリル化触媒及びe)異性体低減剤の存在下での反応による反応生成物を含む、請求項1に記載の粘着剤組成物。 - 前記クラスタ化官能性ポリオルガノシロキサン(I)が、
a)1分子当たり平均して少なくとも2つの脂肪族不飽和有機基を有するポリオルガノシロキサン、
b)1分子当たり、平均して4〜15個のケイ素原子、及び成分a)中の脂肪族不飽和有機基当たり少なくとも4個のケイ素結合水素原子を有する、ポリオルガノ水素シロキサン、並びに
c)1分子当たり、少なくとも1つの脂肪族不飽和有機基、及び、アクリレート基及びメタクリレート基から選択される1つ以上の硬化性基を有する反応性種の、
d)ヒドロシリル化触媒の存在下での反応による反応生成物を含む、請求項1に記載の粘着剤組成物。 - ポリオルガノ水素シロキサンb)におけるケイ素結合水素原子の重量%をポリオルガノシロキサンa)中の脂肪族不飽和有機基の重量%で除算すると(SiHb/Via比)、値が4/1〜20/1の範囲になり、前記プロセスにより調製された前記クラスタ化官能性ポリオルガノシロキサン(I)が、成分a)のポリオルガノシロキサンの各分子末端に2つ以上の硬化性基を有する、請求項2又は3に記載の粘着剤組成物。
- 前記オルガノポリシロキサンポリマー(a)の前記アルコキシ官能性オルガノポリシロキサン樹脂(b)に対する重量比が、75/25〜35/65の範囲である、請求項1に記載の粘着剤組成物。
- 式中、Qが二価の炭化水素基、二価のシロキサン基、及びこれらの組み合わせから選択される二価の連結基であり、前記炭化水素基における炭素原子数が2〜12の範囲であり、前記二価のシロキサン基中のシロキサン繰り返し単位の数が0〜20の範囲である、請求項1に記載の粘着剤組成物。
- 前記末端封止剤(iii)が、Me3Si−O−Si(Me)H−OSiMe3、又はMe3Si−O−Si(Me)2−OSiHMe2を含み、式中、Meがメチルを意味する、請求項1に記載の粘着剤組成物。
- 前記アルコキシシラン官能性オルガノシロキサン化合物(ii)が、式HSi(R27)2OSi(R27)2CH2CH2SiR27 zz(OR27)3−zzのものであり、式中、各R27は、独立して、1〜6個の炭素原子を有する一価の炭化水素であり、添字zzが0又は1である、請求項1に記載の粘着剤組成物。
- 前記反応性樹脂及びポリマー(II)が、前記粘着剤組成物の合計重量の5〜50重量%を構成する、請求項1に記載の粘着剤組成物。
- アルケニル官能性シロキサン樹脂(i)が、アルケニル官能性シロキサン樹脂(i)の合計重量に対し、0.5〜4重量%のアルケニル官能基を含む、請求項1に記載の粘着剤組成物。
- 前記ラジカル開始剤(III)が、前記粘着剤組成物の合計重量の0.01〜15重量%を構成する、請求項1に記載の粘着剤組成物。
- 前記水分硬化開始剤(IV)が、前記反応性樹脂及びポリマー(II)の合計重量の0.001〜5重量%を構成する、請求項1に記載の粘着剤組成物。
- 前記架橋剤(V)が、トリアルコキシシラン、アセトキシシラン、ケトキシミノシラン、アルキルオルトシリケート、メチルビニルビス(n−メチルアセトアミド)シラン、及びこれらの組み合わせからなる群から選択される縮合反応架橋剤である、請求項1に記載の粘着剤組成物。
- 酸化鉄顔料を更に含む、請求項1に記載の粘着剤組成物。
- 硬化シリコーン粘着剤組成物を支持体上に形成する方法であって、
(a)
(I)アクリレート基及びメタクリレート基から選択される少なくとも1つのラジカル硬化性基を有するクラスタ化官能性ポリオルガノシロキサン、
(II)反応性樹脂及びポリマーであって、
(a)式(OR7)3−zR6 zSi−Q−(R25 2SiO2/2)y−Q−SiR6 z(OR7)3−zのオルガノポリシロキサンポリマー、
[式中、各R25は、独立して、1〜6個の炭素原子を有する一価の炭化水素基であり、各R6は、独立して、1〜6個の炭素原子を有する一価炭化水素基であり、各R7は、
独立して、アルキル基及びアルコキシアルキル基からなる群から選択され、Qは2価の連結基、添字z値0、1、又は2であり、かつ添字yは60〜1000の値を有する]、
(b)
(i)R26 3SiO1/2単位及びSiO4/2単位を含むアルケニル官能性シロキサン樹脂、
[式中、R26は、独立して、1〜6個の炭素原子を有する一価の炭化水素基であり、但し、少なくとも1つのR26はアルケニル基であり、
R26 3SiO1/2単位のSiO4/2単位に対するモル比は値0.5/1〜1.5/1を有する]、
(ii)分子末端にケイ素結合水素を少なくとも1個有するアルコキシシラン官能性オルガノシロキサン化合物、及び
(iii)式R17 3SiO−(R17 2SiO)s−SiR17 2H又はR18 3SiO−(R18 2SiO)t−(HR18SiO)−SiR18 3の末端封止剤又はこれらの組み合わせ[式中、各R17及びR18は、独立して一価の炭化水素基であり、添字s及びtは独立して、0〜10の範囲の値を有する]、の、
(iv)ヒドロシリル化触媒の存在下での反応による反応生成物を含む、アルコキシ官能性オルガノポリシロキサン樹脂、
を含む反応性樹脂及びポリマー、
(III)ラジカル開始剤、
(IV)水分硬化開始剤、並びに
(V)架橋剤を含む、安定な熱ラジカル硬化性シリコーン粘着剤組成物を形成することと、
(b)前記安定な熱ラジカル硬化性シリコーン粘着剤組成物を前記支持体に塗布することと、
(c)前記塗布した安定な熱ラジカル硬化性シリコーン粘着剤組成物を硬化させて、前記支持体上に前記硬化シリコーン粘着剤組成物を形成することと、を含む、硬化シリコーン粘着剤組成物を支持体上に形成する方法。 - 前記アクリレート基及びメタクリレート基から選択される少なくとも1つのラジカル硬化性基を有するクラスタ化官能性ポリオルガノシロキサン(I)が、
a)1分子当たり平均して少なくとも2つの脂肪族不飽和有機基を有するポリオルガノシロキサン、
b)1分子当たり、平均して4〜15個のケイ素原子、及び成分a)中の脂肪族不飽和有機基当たり少なくとも4個のケイ素結合水素原子を有する、ポリオルガノ水素シロキサン、並びに
c)1分子当たり、少なくとも1つの脂肪族不飽和有機基、及びアクリレート基及びメタクリレート基から選択される1つ以上の硬化性基を有する反応性種の、
d)ヒドロシリル化触媒及びe)異性体低減剤の存在下での反応による反応生成物を含む、請求項15に記載の方法。 - 前記アクリレート基及びメタクリレート基から選択される少なくとも1つのラジカル硬化性基を有するクラスタ化官能性ポリオルガノシロキサン(I)が、
a)1分子当たり平均して少なくとも2つの脂肪族不飽和有機基を有するポリオルガノシロキサン、
b)1分子当たり、平均して4〜15個のケイ素原子、及び成分a)中の脂肪族不飽和有機基当たり少なくとも4個のケイ素結合水素原子を有する、ポリオルガノ水素シロキサン、並びに
c)1分子当たり、少なくとも1つの脂肪族不飽和有機基、及びアクリレート基及びメタクリレート基から選択される1つ以上の硬化性基を有する反応性種の、
d)ヒドロシリル化触媒の存在下での反応による反応生成物を含む、請求項15に記載
の方法。 - (c)前記支持体に対して塗布した安定な熱ラジカル硬化性シリコーン粘着剤組成物を硬化させることが、前記支持体に塗布した安定な熱ラジカル硬化性シリコーン粘着剤組成物を熱硬化させることを含む、請求項15〜17のいずれか一項に記載の方法。
- 請求項15〜18のいずれか一項に記載の方法により形成された、支持体にのっている硬化シリコーン粘着剤組成物。
- エレクトロニクス用途における、請求項1又は2のいずれか一項に記載の安定な熱ラジカル硬化性シリコーン粘着剤組成物の使用。
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