JP6306813B2 - モジュール式半導体処理システム - Google Patents

モジュール式半導体処理システム Download PDF

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Publication number
JP6306813B2
JP6306813B2 JP2012208203A JP2012208203A JP6306813B2 JP 6306813 B2 JP6306813 B2 JP 6306813B2 JP 2012208203 A JP2012208203 A JP 2012208203A JP 2012208203 A JP2012208203 A JP 2012208203A JP 6306813 B2 JP6306813 B2 JP 6306813B2
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Japan
Prior art keywords
substrate
processing unit
reactor
processing
module
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JP2012208203A
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English (en)
Japanese (ja)
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JP2013077819A5 (https=
JP2013077819A (ja
Inventor
へー．エム． オーステルラケン，テオドルス
ヘー．エム． オーステルラケン，テオドルス
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ASM International NV
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ASM International NV
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Publication of JP2013077819A5 publication Critical patent/JP2013077819A5/ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2012208203A 2011-09-29 2012-09-21 モジュール式半導体処理システム Active JP6306813B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/248,468 2011-09-29
US13/248,468 US9048271B2 (en) 2011-09-29 2011-09-29 Modular semiconductor processing system

Publications (3)

Publication Number Publication Date
JP2013077819A JP2013077819A (ja) 2013-04-25
JP2013077819A5 JP2013077819A5 (https=) 2015-11-12
JP6306813B2 true JP6306813B2 (ja) 2018-04-04

Family

ID=47993334

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012208203A Active JP6306813B2 (ja) 2011-09-29 2012-09-21 モジュール式半導体処理システム

Country Status (3)

Country Link
US (1) US9048271B2 (https=)
JP (1) JP6306813B2 (https=)
KR (1) KR101764444B1 (https=)

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JP5617708B2 (ja) * 2011-03-16 2014-11-05 東京エレクトロン株式会社 蓋体開閉装置
US9991139B2 (en) * 2012-12-03 2018-06-05 Asm Ip Holding B.V. Modular vertical furnace processing system
US9818633B2 (en) * 2014-10-17 2017-11-14 Lam Research Corporation Equipment front end module for transferring wafers and method of transferring wafers
US10515834B2 (en) 2015-10-12 2019-12-24 Lam Research Corporation Multi-station tool with wafer transfer microclimate systems
US10566216B2 (en) 2017-06-09 2020-02-18 Lam Research Corporation Equipment front end module gas recirculation
US10651066B2 (en) * 2017-11-24 2020-05-12 Taiwan Semiconductor Manufacturing Co., Ltd. Metrology method in wafer transportation
US11049740B1 (en) 2019-12-05 2021-06-29 Applied Materials, Inc. Reconfigurable mainframe with replaceable interface plate
CN117174604B (zh) * 2022-05-27 2026-02-06 弘塑科技股份有限公司 整合式晶圆解键合与清洗设备及解键合与清洗方法
TWI809901B (zh) 2022-05-27 2023-07-21 弘塑科技股份有限公司 整合式晶圓解鍵合與清洗設備及解鍵合與清洗方法

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JPH06105742B2 (ja) * 1983-11-28 1994-12-21 株式会社日立製作所 真空処理方法及び装置
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KR0153250B1 (ko) 1990-06-28 1998-12-01 카자마 겐쥬 종형 열처리 장치
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JP3965343B2 (ja) * 1994-08-19 2007-08-29 東京エレクトロン株式会社 処理装置
JP3453223B2 (ja) * 1994-08-19 2003-10-06 東京エレクトロン株式会社 処理装置
US6176667B1 (en) * 1996-04-30 2001-01-23 Applied Materials, Inc. Multideck wafer processing system
US5820366A (en) 1996-07-10 1998-10-13 Eaton Corporation Dual vertical thermal processing furnace
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JP2001023872A (ja) * 1999-07-09 2001-01-26 Hitachi Ltd 半導体基板処理装置
JP2001351963A (ja) * 2000-06-09 2001-12-21 Hitachi Kokusai Electric Inc 基板処理装置
US6630053B2 (en) * 2000-08-22 2003-10-07 Asm Japan K.K. Semiconductor processing module and apparatus
JP2002246439A (ja) * 2001-02-20 2002-08-30 Tokyo Electron Ltd 被処理体の搬出入装置と処理システム
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JP2006278619A (ja) * 2005-03-29 2006-10-12 Hitachi Kokusai Electric Inc 半導体製造装置
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US7690881B2 (en) * 2006-08-30 2010-04-06 Asm Japan K.K. Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus
US7740437B2 (en) * 2006-09-22 2010-06-22 Asm International N.V. Processing system with increased cassette storage capacity
US20080210168A1 (en) 2007-01-18 2008-09-04 May Su Single chamber, multiple tube high efficiency vertical furnace system
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JP5736687B2 (ja) 2009-10-06 2015-06-17 東京エレクトロン株式会社 基板処理装置

Also Published As

Publication number Publication date
KR20130035198A (ko) 2013-04-08
KR101764444B1 (ko) 2017-08-02
US20130085593A1 (en) 2013-04-04
JP2013077819A (ja) 2013-04-25
US9048271B2 (en) 2015-06-02

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