KR101764444B1 - 모듈식 반도체 처리 시스템 - Google Patents

모듈식 반도체 처리 시스템 Download PDF

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Publication number
KR101764444B1
KR101764444B1 KR1020120104952A KR20120104952A KR101764444B1 KR 101764444 B1 KR101764444 B1 KR 101764444B1 KR 1020120104952 A KR1020120104952 A KR 1020120104952A KR 20120104952 A KR20120104952 A KR 20120104952A KR 101764444 B1 KR101764444 B1 KR 101764444B1
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South Korea
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substrate
processing unit
processing
reactor
substrates
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Korean (ko)
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KR20130035198A (ko
Inventor
테오도루스 지.엠. 우스테르라켄
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에이에스엠 인터내셔널 엔.브이.
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020120104952A 2011-09-29 2012-09-21 모듈식 반도체 처리 시스템 Active KR101764444B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/248,468 2011-09-29
US13/248,468 US9048271B2 (en) 2011-09-29 2011-09-29 Modular semiconductor processing system

Publications (2)

Publication Number Publication Date
KR20130035198A KR20130035198A (ko) 2013-04-08
KR101764444B1 true KR101764444B1 (ko) 2017-08-02

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KR1020120104952A Active KR101764444B1 (ko) 2011-09-29 2012-09-21 모듈식 반도체 처리 시스템

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US (1) US9048271B2 (https=)
JP (1) JP6306813B2 (https=)
KR (1) KR101764444B1 (https=)

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JP5617708B2 (ja) * 2011-03-16 2014-11-05 東京エレクトロン株式会社 蓋体開閉装置
US9991139B2 (en) * 2012-12-03 2018-06-05 Asm Ip Holding B.V. Modular vertical furnace processing system
US9818633B2 (en) * 2014-10-17 2017-11-14 Lam Research Corporation Equipment front end module for transferring wafers and method of transferring wafers
US10515834B2 (en) 2015-10-12 2019-12-24 Lam Research Corporation Multi-station tool with wafer transfer microclimate systems
US10566216B2 (en) 2017-06-09 2020-02-18 Lam Research Corporation Equipment front end module gas recirculation
US10651066B2 (en) * 2017-11-24 2020-05-12 Taiwan Semiconductor Manufacturing Co., Ltd. Metrology method in wafer transportation
US11049740B1 (en) 2019-12-05 2021-06-29 Applied Materials, Inc. Reconfigurable mainframe with replaceable interface plate
CN117174604B (zh) * 2022-05-27 2026-02-06 弘塑科技股份有限公司 整合式晶圆解键合与清洗设备及解键合与清洗方法
TWI809901B (zh) 2022-05-27 2023-07-21 弘塑科技股份有限公司 整合式晶圓解鍵合與清洗設備及解鍵合與清洗方法

Citations (3)

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JP2002246439A (ja) * 2001-02-20 2002-08-30 Tokyo Electron Ltd 被処理体の搬出入装置と処理システム
JP3453223B2 (ja) * 1994-08-19 2003-10-06 東京エレクトロン株式会社 処理装置
JP4385954B2 (ja) * 2005-01-25 2009-12-16 株式会社Ｉｈｉ ワーク搬送システムおよびワーク搬送装置

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KR0153250B1 (ko) 1990-06-28 1998-12-01 카자마 겐쥬 종형 열처리 장치
US5387265A (en) 1991-10-29 1995-02-07 Kokusai Electric Co., Ltd. Semiconductor wafer reaction furnace with wafer transfer means
NL9200446A (nl) 1992-03-10 1993-10-01 Tempress B V Inrichting voor het behandelen van microschakeling-schijven (wafers).
JP3258748B2 (ja) 1993-02-08 2002-02-18 東京エレクトロン株式会社 熱処理装置
JP3965343B2 (ja) * 1994-08-19 2007-08-29 東京エレクトロン株式会社 処理装置
US6176667B1 (en) * 1996-04-30 2001-01-23 Applied Materials, Inc. Multideck wafer processing system
US5820366A (en) 1996-07-10 1998-10-13 Eaton Corporation Dual vertical thermal processing furnace
NL1008143C2 (nl) 1998-01-27 1999-07-28 Asm Int Stelsel voor het behandelen van wafers.
JP2001023872A (ja) * 1999-07-09 2001-01-26 Hitachi Ltd 半導体基板処理装置
JP2001351963A (ja) * 2000-06-09 2001-12-21 Hitachi Kokusai Electric Inc 基板処理装置
US6630053B2 (en) * 2000-08-22 2003-10-07 Asm Japan K.K. Semiconductor processing module and apparatus
JP2003077974A (ja) * 2001-08-31 2003-03-14 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
JP2003142360A (ja) * 2001-11-02 2003-05-16 Daikin Ind Ltd 半導体装置の製造装置
US6732006B2 (en) * 2002-02-06 2004-05-04 Asm International Nv Method and system to process semiconductor wafers
US7351291B2 (en) * 2002-02-20 2008-04-01 Tokyo Electron Limited Semiconductor processing system
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US7833351B2 (en) * 2006-06-26 2010-11-16 Applied Materials, Inc. Batch processing platform for ALD and CVD
US7690881B2 (en) * 2006-08-30 2010-04-06 Asm Japan K.K. Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus
US7740437B2 (en) * 2006-09-22 2010-06-22 Asm International N.V. Processing system with increased cassette storage capacity
US20080210168A1 (en) 2007-01-18 2008-09-04 May Su Single chamber, multiple tube high efficiency vertical furnace system
JP5511273B2 (ja) 2008-09-12 2014-06-04 株式会社日立国際電気 基板処理装置及び基板処理方法
JP5736687B2 (ja) 2009-10-06 2015-06-17 東京エレクトロン株式会社 基板処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3453223B2 (ja) * 1994-08-19 2003-10-06 東京エレクトロン株式会社 処理装置
JP2002246439A (ja) * 2001-02-20 2002-08-30 Tokyo Electron Ltd 被処理体の搬出入装置と処理システム
JP4385954B2 (ja) * 2005-01-25 2009-12-16 株式会社Ｉｈｉ ワーク搬送システムおよびワーク搬送装置

Also Published As

Publication number Publication date
JP6306813B2 (ja) 2018-04-04
KR20130035198A (ko) 2013-04-08
US20130085593A1 (en) 2013-04-04
JP2013077819A (ja) 2013-04-25
US9048271B2 (en) 2015-06-02

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