JP6298719B2 - 樹脂封止装置及び樹脂封止方法 - Google Patents

樹脂封止装置及び樹脂封止方法 Download PDF

Info

Publication number
JP6298719B2
JP6298719B2 JP2014118565A JP2014118565A JP6298719B2 JP 6298719 B2 JP6298719 B2 JP 6298719B2 JP 2014118565 A JP2014118565 A JP 2014118565A JP 2014118565 A JP2014118565 A JP 2014118565A JP 6298719 B2 JP6298719 B2 JP 6298719B2
Authority
JP
Japan
Prior art keywords
resin
plate
resin sealing
release film
resin material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014118565A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015233039A (ja
Inventor
敬太 水間
敬太 水間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP2014118565A priority Critical patent/JP6298719B2/ja
Priority to TW104115153A priority patent/TWI570862B/zh
Priority to CN201510250069.4A priority patent/CN105269744B/zh
Priority to KR1020150081128A priority patent/KR101659690B1/ko
Publication of JP2015233039A publication Critical patent/JP2015233039A/ja
Application granted granted Critical
Publication of JP6298719B2 publication Critical patent/JP6298719B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Engineering & Computer Science (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Manufacturing & Machinery (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP2014118565A 2014-06-09 2014-06-09 樹脂封止装置及び樹脂封止方法 Active JP6298719B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014118565A JP6298719B2 (ja) 2014-06-09 2014-06-09 樹脂封止装置及び樹脂封止方法
TW104115153A TWI570862B (zh) 2014-06-09 2015-05-13 Resin sealing device and resin sealing method
CN201510250069.4A CN105269744B (zh) 2014-06-09 2015-05-15 树脂封装装置及树脂封装方法
KR1020150081128A KR101659690B1 (ko) 2014-06-09 2015-06-09 수지 밀봉 장치 및 수지 밀봉 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014118565A JP6298719B2 (ja) 2014-06-09 2014-06-09 樹脂封止装置及び樹脂封止方法

Publications (2)

Publication Number Publication Date
JP2015233039A JP2015233039A (ja) 2015-12-24
JP6298719B2 true JP6298719B2 (ja) 2018-03-20

Family

ID=54934349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014118565A Active JP6298719B2 (ja) 2014-06-09 2014-06-09 樹脂封止装置及び樹脂封止方法

Country Status (4)

Country Link
JP (1) JP6298719B2 (ko)
KR (1) KR101659690B1 (ko)
CN (1) CN105269744B (ko)
TW (1) TWI570862B (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6491464B2 (ja) 2014-11-28 2019-03-27 Ｔｏｗａ株式会社 成形品製造装置及び成形品製造方法
JP6639931B2 (ja) * 2016-02-02 2020-02-05 Ｔｏｗａ株式会社 電子部品の製造装置及び製造方法並びに電子部品
JP6506717B2 (ja) * 2016-03-30 2019-04-24 Ｔｏｗａ株式会社 樹脂成形装置、樹脂成形方法、フィルム搬送用ローラ及び樹脂成形装置用フィルム供給装置
JP6672103B2 (ja) * 2016-08-01 2020-03-25 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品製造方法
JP6654994B2 (ja) * 2016-10-31 2020-02-26 Ｔｏｗａ株式会社 回路部品の製造方法
JP6284996B1 (ja) * 2016-11-04 2018-02-28 Ｔｏｗａ株式会社 検査方法、樹脂封止装置、樹脂封止方法及び樹脂封止品の製造方法
US10199299B1 (en) 2017-08-07 2019-02-05 Micron Technology, Inc. Semiconductor mold compound transfer system and associated methods
TWI787411B (zh) * 2018-02-16 2022-12-21 日商山田尖端科技股份有限公司 樹脂模製裝置
JP7134926B2 (ja) * 2019-07-10 2022-09-12 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7417429B2 (ja) * 2020-01-17 2024-01-18 Ｔｏｗａ株式会社 樹脂成形装置、樹脂成形品の製造方法
CN111446352B (zh) * 2020-03-23 2022-03-18 东莞市中麒光电技术有限公司 Led显示屏模组的制作方法
JP7284514B2 (ja) * 2020-05-11 2023-05-31 アピックヤマダ株式会社 樹脂モールド装置及びクリーニング方法
JP2022061238A (ja) * 2020-10-06 2022-04-18 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP7428384B2 (ja) * 2020-10-06 2024-02-06 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP7447050B2 (ja) * 2021-04-21 2024-03-11 Ｔｏｗａ株式会社 成形型、樹脂成形装置及び樹脂成形品の製造方法
JP2024138704A (ja) * 2023-03-27 2024-10-09 Ｔｏｗａ株式会社 クリーニング装置、樹脂成形装置及び樹脂成形品の製造方法
CN116598214B (zh) * 2023-05-13 2024-03-19 江苏爱矽半导体科技有限公司 一种功率半导体器件封装结构

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1197576A (ja) * 1997-09-22 1999-04-09 Matsushita Electric Ind Co Ltd 半導体装置
JPH11307561A (ja) * 1998-04-17 1999-11-05 Towa Corp 電子部品の樹脂封止成形装置
JP5101788B2 (ja) * 2003-12-22 2012-12-19 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP2005203485A (ja) 2004-01-14 2005-07-28 Ngk Spark Plug Co Ltd 電子部品収納容器
JP2007109831A (ja) * 2005-10-13 2007-04-26 Towa Corp 電子部品の樹脂封止成形方法
JP5128095B2 (ja) * 2006-08-25 2013-01-23 Ｔｏｗａ株式会社 電子部品の樹脂封止成形装置
JP2009083438A (ja) * 2007-10-03 2009-04-23 Towa Corp 電子部品の圧縮成形方法
JP5153509B2 (ja) * 2008-08-08 2013-02-27 Ｔｏｗａ株式会社 電子部品の圧縮成形方法及び金型装置
JP5153536B2 (ja) * 2008-09-17 2013-02-27 Ｔｏｗａ株式会社 半導体チップの圧縮成形用金型
KR101292594B1 (ko) * 2010-07-02 2013-08-12 엘지이노텍 주식회사 금속 댐이 형성된 임베디드 인쇄회로기판 및 그 제조 방법
KR101207273B1 (ko) * 2010-09-03 2012-12-03 에스케이하이닉스 주식회사 임베디드 패키지 및 그 형성방법
JP5764821B2 (ja) * 2011-08-25 2015-08-19 アピックヤマダ株式会社 圧縮成形方法及び装置
JP6039198B2 (ja) * 2012-03-07 2016-12-07 Ｔｏｗａ株式会社 樹脂封止電子部品の製造方法及び樹脂封止電子部品の製造装置

Also Published As

Publication number Publication date
TW201546977A (zh) 2015-12-16
KR101659690B1 (ko) 2016-09-26
TWI570862B (zh) 2017-02-11
CN105269744A (zh) 2016-01-27
KR20150141153A (ko) 2015-12-17
CN105269744B (zh) 2018-04-20
JP2015233039A (ja) 2015-12-24

Similar Documents

Publication Publication Date Title
JP6298719B2 (ja) 樹脂封止装置及び樹脂封止方法
JP6310773B2 (ja) 樹脂成形装置及び樹脂成形方法
KR102455987B1 (ko) 성형 금형, 성형 장치, 성형품의 제조 방법 및 수지 몰드 방법
TWI647085B (zh) 樹脂成形裝置及樹脂成形方法
TWI684509B (zh) 成型模、樹脂成型裝置、樹脂成型方法及樹脂成型品的製造方法
JP6430143B2 (ja) 樹脂成形装置及び樹脂成形方法並びに成形製品の製造方法
JP5697919B2 (ja) 樹脂封止装置及び樹脂封止方法
JP2015211091A (ja) 樹脂封止電子部品の製造方法、突起電極付き板状部材、及び樹脂封止電子部品
JP2016022672A (ja) 成形金型、成形装置および成形品の製造方法
CN107685412B (zh) 成型模、树脂成型装置及树脂成型品的制造方法
JP6431757B2 (ja) 成形金型
JP6176416B1 (ja) 半導体パッケージの樹脂封止装置、及び半導体パッケージの樹脂封止方法
JP2012045839A (ja) 樹脂封止済基板の冷却装置、冷却方法及び搬送装置、並びに樹脂封止装置
TWI718447B (zh) 成型模、樹脂成型裝置及樹脂成型品的製造方法
JP7240339B2 (ja) 樹脂成形品の製造方法及び樹脂成形装置
JP2018174290A (ja) 半導体パッケージの樹脂封止装置、及び半導体パッケージの樹脂封止方法
JP2022121827A (ja) 搬送機構、樹脂成形装置及び樹脂成形品の製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170428

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20180115

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180130

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180226

R150 Certificate of patent or registration of utility model

Ref document number: 6298719

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250