JP6286911B2 - 実装構造、電気光学装置及び電子機器 - Google Patents

実装構造、電気光学装置及び電子機器 Download PDF

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Publication number
JP6286911B2
JP6286911B2 JP2013155348A JP2013155348A JP6286911B2 JP 6286911 B2 JP6286911 B2 JP 6286911B2 JP 2013155348 A JP2013155348 A JP 2013155348A JP 2013155348 A JP2013155348 A JP 2013155348A JP 6286911 B2 JP6286911 B2 JP 6286911B2
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Japan
Prior art keywords
terminal
alignment mark
substrate
terminals
mounting structure
Prior art date
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JP2013155348A
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English (en)
Japanese (ja)
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JP2015025943A (ja
JP2015025943A5 (enExample
Inventor
秀隆 斉藤
秀隆 斉藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2013155348A priority Critical patent/JP6286911B2/ja
Priority to US14/326,729 priority patent/US9345129B2/en
Priority to CN201410354300.XA priority patent/CN104347008B/zh
Publication of JP2015025943A publication Critical patent/JP2015025943A/ja
Publication of JP2015025943A5 publication Critical patent/JP2015025943A5/ja
Application granted granted Critical
Publication of JP6286911B2 publication Critical patent/JP6286911B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
JP2013155348A 2013-07-26 2013-07-26 実装構造、電気光学装置及び電子機器 Active JP6286911B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013155348A JP6286911B2 (ja) 2013-07-26 2013-07-26 実装構造、電気光学装置及び電子機器
US14/326,729 US9345129B2 (en) 2013-07-26 2014-07-09 Mounting structure, electro-optical apparatus, and electronic apparatus
CN201410354300.XA CN104347008B (zh) 2013-07-26 2014-07-24 安装结构、电光学装置以及电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013155348A JP6286911B2 (ja) 2013-07-26 2013-07-26 実装構造、電気光学装置及び電子機器

Publications (3)

Publication Number Publication Date
JP2015025943A JP2015025943A (ja) 2015-02-05
JP2015025943A5 JP2015025943A5 (enExample) 2016-07-28
JP6286911B2 true JP6286911B2 (ja) 2018-03-07

Family

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JP2013155348A Active JP6286911B2 (ja) 2013-07-26 2013-07-26 実装構造、電気光学装置及び電子機器

Country Status (3)

Country Link
US (1) US9345129B2 (enExample)
JP (1) JP6286911B2 (enExample)
CN (1) CN104347008B (enExample)

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KR102289634B1 (ko) * 2014-11-05 2021-08-13 삼성디스플레이 주식회사 연성인쇄회로기판 및 표시 장치
CN104661430A (zh) * 2015-03-17 2015-05-27 京东方科技集团股份有限公司 一种对位标识、电路板和显示装置
TWI607552B (zh) * 2015-05-27 2017-12-01 友達光電股份有限公司 畫素陣列基板、顯示面板及其母板
WO2017040482A1 (en) * 2015-09-02 2017-03-09 3M Innovative Properties Company Fiducial mark for chip bonding
KR102559170B1 (ko) * 2015-12-15 2023-07-24 엘지디스플레이 주식회사 인쇄회로기판 및 이를 포함하는 표시장치
EP3217428B1 (de) * 2016-03-07 2022-09-07 Infineon Technologies AG Mehrfachsubstrat sowie verfahren zu dessen herstellung
KR20170113748A (ko) * 2016-03-24 2017-10-13 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
JP2019066750A (ja) * 2017-10-04 2019-04-25 株式会社ジャパンディスプレイ 表示装置
KR102395221B1 (ko) * 2017-12-05 2022-05-10 삼성디스플레이 주식회사 표시 장치
CN109994461B (zh) * 2017-12-30 2021-10-08 苏州旭创科技有限公司 光学组件、光模块及其封装方法
JPWO2019208455A1 (ja) * 2018-04-24 2021-05-13 Ａｇｃ株式会社 光学素子、光学系、および撮像装置
JP2019200360A (ja) * 2018-05-17 2019-11-21 日本電産サンキョー株式会社 振れ補正機能付き光学ユニット及びその製造方法
WO2019239454A1 (ja) * 2018-06-11 2019-12-19 シャープ株式会社 表示デバイスの製造方法、表示デバイスの製造装置
JP6780677B2 (ja) * 2018-07-26 2020-11-04 セイコーエプソン株式会社 電気光学パネル、電気光学装置および電子機器
CN109102761B (zh) * 2018-09-07 2021-01-12 武汉天马微电子有限公司 一种显示面板及显示装置
KR102776430B1 (ko) * 2019-02-21 2025-03-05 삼성디스플레이 주식회사 표시 장치
TWI699580B (zh) * 2019-03-07 2020-07-21 友達光電股份有限公司 陣列基板
JP7321792B2 (ja) * 2019-06-26 2023-08-07 株式会社ジャパンディスプレイ 異方性導電膜及び表示装置
CN111061112B (zh) * 2020-01-02 2023-02-17 上海天马微电子有限公司 显示面板及其制作方法、显示装置
KR102873275B1 (ko) * 2020-06-17 2025-10-20 주식회사 엘지에너지솔루션 연성인쇄회로기판의 제조 방법
CN114883372A (zh) * 2022-05-11 2022-08-09 深圳市华星光电半导体显示技术有限公司 显示面板和显示面板的制作方法
CN116344514A (zh) * 2023-03-31 2023-06-27 天马新型显示技术研究院(厦门)有限公司 显示面板、显示装置及显示装置的制作方法

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JPS61123868A (ja) * 1984-11-21 1986-06-11 キヤノン株式会社 パネル基板の位置合せ保証方法
JP3256391B2 (ja) * 1994-11-28 2002-02-12 キヤノン株式会社 回路基板構造
JPH10209202A (ja) * 1997-01-20 1998-08-07 Seiko Epson Corp 液晶表示装置
JP3013801B2 (ja) * 1997-02-06 2000-02-28 セイコーエプソン株式会社 液晶表示装置の組立方法
JP2001005031A (ja) * 1999-06-23 2001-01-12 Nec Corp 薄膜トランジスタアレイ基板及びその製造方法
JP3833425B2 (ja) * 1999-10-27 2006-10-11 富士通株式会社 プリント配線板どうしの接続方法およびプリント基板
JP4742441B2 (ja) * 2001-04-16 2011-08-10 日本電気株式会社 フレキシブルプリント回路と配線基板との接続構造、その接続方法、液晶表示装置及びその製造方法
JP2004128324A (ja) * 2002-10-04 2004-04-22 Casio Comput Co Ltd アライメントマーク対
JP3871634B2 (ja) * 2002-10-04 2007-01-24 シャープ株式会社 Ｃｏｆ半導体装置の製造方法
JP4024773B2 (ja) * 2004-03-30 2007-12-19 シャープ株式会社 配線基板、半導体装置およびその製造方法並びに半導体モジュール装置
US7449284B2 (en) * 2004-05-11 2008-11-11 Miradia Inc. Method and structure for fabricating mechanical mirror structures using backside alignment techniques
JP2006235503A (ja) 2005-02-28 2006-09-07 Optrex Corp 表示装置
JP2007011010A (ja) 2005-06-30 2007-01-18 Optrex Corp 表示素子
TWI302290B (en) * 2005-08-17 2008-10-21 Au Optronics Corp Structure for circuit assembly
JP4984465B2 (ja) 2005-09-21 2012-07-25 セイコーエプソン株式会社 電気光学装置の製造方法
JP4923528B2 (ja) * 2005-11-14 2012-04-25 パナソニック株式会社 プラズマディスプレイ装置
JP2007234915A (ja) * 2006-03-02 2007-09-13 Sony Corp 配線基板、配線ケーブル、電子機器および配線接続方法
JP2008078628A (ja) * 2006-08-25 2008-04-03 Canon Inc 電子モジュールおよびその製造方法
JP2009098407A (ja) * 2007-10-17 2009-05-07 Hitachi Displays Ltd 表示装置
CN101546053B (zh) * 2008-03-24 2012-02-29 索尼公司 安装结构体、电光装置及电子设备
BRPI0914554A2 (pt) * 2008-08-11 2015-12-15 Sharp Kk substrativo flexível e estrutura de circuito elétrico
JP2010243585A (ja) * 2009-04-01 2010-10-28 Funai Electric Co Ltd 液晶モジュール
WO2011102152A1 (ja) * 2010-02-17 2011-08-25 シャープ株式会社 基板セット、電子機器、基板セットの製造方法
WO2013030888A1 (ja) * 2011-08-31 2013-03-07 パナソニック株式会社 表示パネル装置及びその製造方法
CN105138172B (zh) * 2011-11-27 2018-08-07 宸鸿科技(厦门)有限公司 触控感测装置及其制造方法

Also Published As

Publication number Publication date
CN104347008A (zh) 2015-02-11
JP2015025943A (ja) 2015-02-05
US9345129B2 (en) 2016-05-17
US20150029680A1 (en) 2015-01-29
CN104347008B (zh) 2019-10-01

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