CN104347008B - 安装结构、电光学装置以及电子设备 - Google Patents

安装结构、电光学装置以及电子设备 Download PDF

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Publication number
CN104347008B
CN104347008B CN201410354300.XA CN201410354300A CN104347008B CN 104347008 B CN104347008 B CN 104347008B CN 201410354300 A CN201410354300 A CN 201410354300A CN 104347008 B CN104347008 B CN 104347008B
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CN
China
Prior art keywords
terminal
alignment mark
substrate
mounting structure
electro
Prior art date
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Active
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CN201410354300.XA
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English (en)
Chinese (zh)
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CN104347008A (zh
Inventor
齐藤秀隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
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Publication date
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Publication of CN104347008A publication Critical patent/CN104347008A/zh
Application granted granted Critical
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
CN201410354300.XA 2013-07-26 2014-07-24 安装结构、电光学装置以及电子设备 Active CN104347008B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013155348A JP6286911B2 (ja) 2013-07-26 2013-07-26 実装構造、電気光学装置及び電子機器
JP2013-155348 2013-07-26

Publications (2)

Publication Number Publication Date
CN104347008A CN104347008A (zh) 2015-02-11
CN104347008B true CN104347008B (zh) 2019-10-01

Family

ID=52390365

Family Applications (1)

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CN201410354300.XA Active CN104347008B (zh) 2013-07-26 2014-07-24 安装结构、电光学装置以及电子设备

Country Status (3)

Country Link
US (1) US9345129B2 (enExample)
JP (1) JP6286911B2 (enExample)
CN (1) CN104347008B (enExample)

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KR102289634B1 (ko) * 2014-11-05 2021-08-13 삼성디스플레이 주식회사 연성인쇄회로기판 및 표시 장치
CN104661430A (zh) * 2015-03-17 2015-05-27 京东方科技集团股份有限公司 一种对位标识、电路板和显示装置
TWI607552B (zh) * 2015-05-27 2017-12-01 友達光電股份有限公司 畫素陣列基板、顯示面板及其母板
CN113543462A (zh) 2015-09-02 2021-10-22 3M创新有限公司 用于芯片键合的基准标记
KR102559170B1 (ko) * 2015-12-15 2023-07-24 엘지디스플레이 주식회사 인쇄회로기판 및 이를 포함하는 표시장치
EP3217428B1 (de) * 2016-03-07 2022-09-07 Infineon Technologies AG Mehrfachsubstrat sowie verfahren zu dessen herstellung
KR20170113748A (ko) * 2016-03-24 2017-10-13 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
JP2019066750A (ja) * 2017-10-04 2019-04-25 株式会社ジャパンディスプレイ 表示装置
KR102395221B1 (ko) * 2017-12-05 2022-05-10 삼성디스플레이 주식회사 표시 장치
CN109994461B (zh) * 2017-12-30 2021-10-08 苏州旭创科技有限公司 光学组件、光模块及其封装方法
JPWO2019208455A1 (ja) * 2018-04-24 2021-05-13 Ａｇｃ株式会社 光学素子、光学系、および撮像装置
JP2019200360A (ja) * 2018-05-17 2019-11-21 日本電産サンキョー株式会社 振れ補正機能付き光学ユニット及びその製造方法
WO2019239454A1 (ja) * 2018-06-11 2019-12-19 シャープ株式会社 表示デバイスの製造方法、表示デバイスの製造装置
JP6780677B2 (ja) * 2018-07-26 2020-11-04 セイコーエプソン株式会社 電気光学パネル、電気光学装置および電子機器
CN109102761B (zh) * 2018-09-07 2021-01-12 武汉天马微电子有限公司 一种显示面板及显示装置
KR102776430B1 (ko) * 2019-02-21 2025-03-05 삼성디스플레이 주식회사 표시 장치
TWI699580B (zh) * 2019-03-07 2020-07-21 友達光電股份有限公司 陣列基板
JP7321792B2 (ja) * 2019-06-26 2023-08-07 株式会社ジャパンディスプレイ 異方性導電膜及び表示装置
CN111061112B (zh) * 2020-01-02 2023-02-17 上海天马微电子有限公司 显示面板及其制作方法、显示装置
KR102873275B1 (ko) * 2020-06-17 2025-10-20 주식회사 엘지에너지솔루션 연성인쇄회로기판의 제조 방법
CN114883372A (zh) * 2022-05-11 2022-08-09 深圳市华星光电半导体显示技术有限公司 显示面板和显示面板的制作方法
CN116344514A (zh) * 2023-03-31 2023-06-27 天马新型显示技术研究院(厦门)有限公司 显示面板、显示装置及显示装置的制作方法

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TW200709162A (en) * 2005-08-17 2007-03-01 Au Optronics Corp Structure for circuit assembly
EP2237101A1 (en) * 2009-04-01 2010-10-06 Funai Electric Co., Ltd. Liquid crystal module
CN101546053B (zh) * 2008-03-24 2012-02-29 索尼公司 安装结构体、电光装置及电子设备

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JP3256391B2 (ja) * 1994-11-28 2002-02-12 キヤノン株式会社 回路基板構造
JPH10209202A (ja) * 1997-01-20 1998-08-07 Seiko Epson Corp 液晶表示装置
JP3013801B2 (ja) * 1997-02-06 2000-02-28 セイコーエプソン株式会社 液晶表示装置の組立方法
JP2001005031A (ja) * 1999-06-23 2001-01-12 Nec Corp 薄膜トランジスタアレイ基板及びその製造方法
JP3833425B2 (ja) * 1999-10-27 2006-10-11 富士通株式会社 プリント配線板どうしの接続方法およびプリント基板
JP4742441B2 (ja) * 2001-04-16 2011-08-10 日本電気株式会社 フレキシブルプリント回路と配線基板との接続構造、その接続方法、液晶表示装置及びその製造方法
JP3871634B2 (ja) * 2002-10-04 2007-01-24 シャープ株式会社 Ｃｏｆ半導体装置の製造方法
JP2004128324A (ja) * 2002-10-04 2004-04-22 Casio Comput Co Ltd アライメントマーク対
JP4024773B2 (ja) * 2004-03-30 2007-12-19 シャープ株式会社 配線基板、半導体装置およびその製造方法並びに半導体モジュール装置
US7449284B2 (en) * 2004-05-11 2008-11-11 Miradia Inc. Method and structure for fabricating mechanical mirror structures using backside alignment techniques
JP2006235503A (ja) 2005-02-28 2006-09-07 Optrex Corp 表示装置
JP2007011010A (ja) 2005-06-30 2007-01-18 Optrex Corp 表示素子
JP4984465B2 (ja) 2005-09-21 2012-07-25 セイコーエプソン株式会社 電気光学装置の製造方法
JP4923528B2 (ja) * 2005-11-14 2012-04-25 パナソニック株式会社 プラズマディスプレイ装置
JP2007234915A (ja) * 2006-03-02 2007-09-13 Sony Corp 配線基板、配線ケーブル、電子機器および配線接続方法
JP2008078628A (ja) * 2006-08-25 2008-04-03 Canon Inc 電子モジュールおよびその製造方法
JP2009098407A (ja) * 2007-10-17 2009-05-07 Hitachi Displays Ltd 表示装置
EP2323466A1 (en) * 2008-08-11 2011-05-18 Sharp Kabushiki Kaisha Flexible substrate and electric circuit structure
US20130186678A1 (en) * 2010-02-17 2013-07-25 Sharp Kabushiki Kaisha Substrate set, electronic device, and method for manufacturing substrate set
WO2013030888A1 (ja) * 2011-08-31 2013-03-07 パナソニック株式会社 表示パネル装置及びその製造方法
CN106406594B (zh) * 2011-11-27 2019-07-16 宸鸿科技(厦门)有限公司 触控感测装置及其制造方法

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
US4721365A (en) * 1984-11-21 1988-01-26 Canon Kabushiki Kaisha Electronic device including panels with electrical alignment means
TW200709162A (en) * 2005-08-17 2007-03-01 Au Optronics Corp Structure for circuit assembly
CN101546053B (zh) * 2008-03-24 2012-02-29 索尼公司 安装结构体、电光装置及电子设备
EP2237101A1 (en) * 2009-04-01 2010-10-06 Funai Electric Co., Ltd. Liquid crystal module

Also Published As

Publication number Publication date
JP2015025943A (ja) 2015-02-05
US20150029680A1 (en) 2015-01-29
CN104347008A (zh) 2015-02-11
US9345129B2 (en) 2016-05-17
JP6286911B2 (ja) 2018-03-07

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