JP6280109B2 - 封止膜、有機ｅｌデバイス、可撓性基板、および、封止膜の製造方法 - Google Patents

封止膜、有機ｅｌデバイス、可撓性基板、および、封止膜の製造方法 Download PDF

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Publication number
JP6280109B2
JP6280109B2 JP2015518089A JP2015518089A JP6280109B2 JP 6280109 B2 JP6280109 B2 JP 6280109B2 JP 2015518089 A JP2015518089 A JP 2015518089A JP 2015518089 A JP2015518089 A JP 2015518089A JP 6280109 B2 JP6280109 B2 JP 6280109B2
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sealing film
hydrogen concentration
film
organic
silicon nitride
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JPWO2014188731A1 (ja
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友香 伊佐治
友香 伊佐治
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/34—Nitrides
    • C23C16/345—Silicon nitride
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
  • Chemical Vapour Deposition (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2015518089A 2013-05-24 2014-05-23 封止膜、有機ｅｌデバイス、可撓性基板、および、封止膜の製造方法 Active JP6280109B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013109726 2013-05-24
JP2013109726 2013-05-24
JP2014059002 2014-03-20
JP2014059002 2014-03-20
PCT/JP2014/002723 WO2014188731A1 (ja) 2013-05-24 2014-05-23 封止膜、有機ｅｌデバイス、可撓性基板、および、封止膜の製造方法

Related Child Applications (1)

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JP2018005877A Division JP6691149B2 (ja) 2013-05-24 2018-01-17 封止膜、有機ｅｌデバイス、可撓性基板、および、封止膜の製造方法

Publications (2)

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JPWO2014188731A1 JPWO2014188731A1 (ja) 2017-02-23
JP6280109B2 true JP6280109B2 (ja) 2018-02-21

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JP2015518089A Active JP6280109B2 (ja) 2013-05-24 2014-05-23 封止膜、有機ｅｌデバイス、可撓性基板、および、封止膜の製造方法
JP2018005877A Active JP6691149B2 (ja) 2013-05-24 2018-01-17 封止膜、有機ｅｌデバイス、可撓性基板、および、封止膜の製造方法

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US (5) US9601718B2 (https=)
EP (1) EP3006597B1 (https=)
JP (2) JP6280109B2 (https=)
CN (1) CN105637117A (https=)
WO (1) WO2014188731A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9601718B2 (en) 2013-05-24 2017-03-21 Panasonic Corporation Barrier film, organic el device, flexible substrate, and method for manufacturing barrier film
KR20150011231A (ko) * 2013-07-22 2015-01-30 삼성디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
JP6613196B2 (ja) * 2016-03-31 2019-11-27 株式会社Ｊｏｌｅｄ 有機ｅｌ表示パネル
JP6783573B2 (ja) * 2016-07-22 2020-11-11 株式会社ジャパンディスプレイ 表示装置
KR101801688B1 (ko) 2017-01-18 2017-11-27 (주)이녹스첨단소재 Oled 패널 하부 보호필름 및 이를 포함하는 oled 패널
JP7170509B2 (ja) * 2018-11-12 2022-11-14 キヤノン株式会社 半導体装置及びその製造方法、表示装置、光電変換装置、電子機器、照明装置並びに移動体
KR102584458B1 (ko) * 2020-10-20 2023-10-06 한국과학기술연구원 필름 구조체 및 이를 포함하는 표시 장치
KR102505829B1 (ko) * 2020-12-11 2023-03-06 한국과학기술연구원 신축성 표시 장치 및 신축성 표시 장치 제조 방법
EP4120378A1 (en) * 2021-07-12 2023-01-18 Samsung Display Co., Ltd. Display device and method of manufacturing the same

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JP3231470B2 (ja) * 1993-03-31 2001-11-19 株式会社リコー 半導体装置
JP2004087253A (ja) * 2002-08-26 2004-03-18 Toyota Central Res & Dev Lab Inc 有機電子デバイス
AU2003254851A1 (en) * 2002-08-07 2004-02-25 Kabushiki Kaisha Toyota Chuo Kenkyusho Laminate having adherent layer and laminate having protective film
JP2005339863A (ja) 2004-05-25 2005-12-08 Toppan Printing Co Ltd フィルム有機ｅｌ素子
US20060093795A1 (en) 2004-11-04 2006-05-04 Eastman Kodak Company Polymeric substrate having a desiccant layer
JP4777717B2 (ja) * 2005-08-10 2011-09-21 東京エレクトロン株式会社 成膜方法、プラズマ処理装置および記録媒体
JP2007184251A (ja) 2005-12-07 2007-07-19 Sony Corp 表示装置
JP4400636B2 (ja) 2007-03-01 2010-01-20 株式会社豊田中央研究所 バリア膜及びバリア膜の製造方法
US20080286984A1 (en) * 2007-05-14 2008-11-20 Taylor Jason B Silicon-rich low-hydrogen content silicon nitride film
US7897482B2 (en) * 2007-05-31 2011-03-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP4719210B2 (ja) 2007-12-28 2011-07-06 富士通株式会社 半導体装置及びその製造方法
JP2010197813A (ja) 2009-02-26 2010-09-09 Hitachi Displays Ltd 画像表示装置
JP5056777B2 (ja) 2009-03-09 2012-10-24 セイコーエプソン株式会社 有機エレクトロルミネッセンス装置、その製造方法および電子機器
JP2010211893A (ja) 2009-03-12 2010-09-24 Funai Electric Co Ltd 再生リスト共有システム及び再生リスト共有方法
JP5593630B2 (ja) 2009-04-01 2014-09-24 セイコーエプソン株式会社 有機ｅｌ装置および電子機器
JP2011018686A (ja) 2009-07-07 2011-01-27 Hitachi Displays Ltd 有機ｅｌ表示装置
KR101065318B1 (ko) 2009-12-03 2011-09-16 삼성모바일디스플레이주식회사 플렉서블 디스플레이 장치의 제조 방법
US9000442B2 (en) 2010-01-20 2015-04-07 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, flexible light-emitting device, electronic device, and method for manufacturing light-emitting device and flexible-light emitting device
JP5197666B2 (ja) 2010-03-23 2013-05-15 株式会社東芝 有機発光装置、照明装置、表示装置及び有機発光装置の製造方法
JP5375732B2 (ja) 2010-04-26 2013-12-25 株式会社島津製作所 バリヤ膜を形成する方法およびバリヤ膜を形成するために用いるｃｖｄ装置
JP5609941B2 (ja) * 2012-09-26 2014-10-22 セイコーエプソン株式会社 表示装置および電子機器
US9601718B2 (en) * 2013-05-24 2017-03-21 Panasonic Corporation Barrier film, organic el device, flexible substrate, and method for manufacturing barrier film

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Publication number Publication date
EP3006597B1 (en) 2020-07-01
EP3006597A1 (en) 2016-04-13
US9601718B2 (en) 2017-03-21
US20220359848A1 (en) 2022-11-10
JP2018088414A (ja) 2018-06-07
US11411203B2 (en) 2022-08-09
JPWO2014188731A1 (ja) 2017-02-23
US20160013445A1 (en) 2016-01-14
CN105637117A (zh) 2016-06-01
US10903452B2 (en) 2021-01-26
US20210111375A1 (en) 2021-04-15
US11903241B2 (en) 2024-02-13
US20190198813A1 (en) 2019-06-27
US10256437B2 (en) 2019-04-09
EP3006597A4 (en) 2016-07-13
WO2014188731A1 (ja) 2014-11-27
US20170155090A1 (en) 2017-06-01
JP6691149B2 (ja) 2020-04-28

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