CN105637117A - 密封膜、有机el器件、挠性基板以及密封膜的制造方法 - Google Patents

密封膜、有机el器件、挠性基板以及密封膜的制造方法 Download PDF

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Publication number
CN105637117A
CN105637117A CN201480010098.7A CN201480010098A CN105637117A CN 105637117 A CN105637117 A CN 105637117A CN 201480010098 A CN201480010098 A CN 201480010098A CN 105637117 A CN105637117 A CN 105637117A
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CN
China
Prior art keywords
sealing film
hydrogen concentration
organic
film
derived
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480010098.7A
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English (en)
Chinese (zh)
Inventor
伊佐治友香
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN105637117A publication Critical patent/CN105637117A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/34—Nitrides
    • C23C16/345—Silicon nitride
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
  • Chemical Vapour Deposition (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CN201480010098.7A 2013-05-24 2014-05-23 密封膜、有机el器件、挠性基板以及密封膜的制造方法 Pending CN105637117A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013109726 2013-05-24
JP2013-109726 2013-05-24
JP2014-059002 2014-03-20
JP2014059002 2014-03-20
PCT/JP2014/002723 WO2014188731A1 (ja) 2013-05-24 2014-05-23 封止膜、有機ｅｌデバイス、可撓性基板、および、封止膜の製造方法

Publications (1)

Publication Number Publication Date
CN105637117A true CN105637117A (zh) 2016-06-01

Family

ID=51933298

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480010098.7A Pending CN105637117A (zh) 2013-05-24 2014-05-23 密封膜、有机el器件、挠性基板以及密封膜的制造方法

Country Status (5)

Country Link
US (5) US9601718B2 (https=)
EP (1) EP3006597B1 (https=)
JP (2) JP6280109B2 (https=)
CN (1) CN105637117A (https=)
WO (1) WO2014188731A1 (https=)

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* Cited by examiner, † Cited by third party
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US9601718B2 (en) 2013-05-24 2017-03-21 Panasonic Corporation Barrier film, organic el device, flexible substrate, and method for manufacturing barrier film
KR20150011231A (ko) * 2013-07-22 2015-01-30 삼성디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
JP6613196B2 (ja) * 2016-03-31 2019-11-27 株式会社Ｊｏｌｅｄ 有機ｅｌ表示パネル
JP6783573B2 (ja) * 2016-07-22 2020-11-11 株式会社ジャパンディスプレイ 表示装置
KR101801688B1 (ko) 2017-01-18 2017-11-27 (주)이녹스첨단소재 Oled 패널 하부 보호필름 및 이를 포함하는 oled 패널
JP7170509B2 (ja) * 2018-11-12 2022-11-14 キヤノン株式会社 半導体装置及びその製造方法、表示装置、光電変換装置、電子機器、照明装置並びに移動体
KR102584458B1 (ko) * 2020-10-20 2023-10-06 한국과학기술연구원 필름 구조체 및 이를 포함하는 표시 장치
KR102505829B1 (ko) * 2020-12-11 2023-03-06 한국과학기술연구원 신축성 표시 장치 및 신축성 표시 장치 제조 방법
EP4120378A1 (en) * 2021-07-12 2023-01-18 Samsung Display Co., Ltd. Display device and method of manufacturing the same

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JP3231470B2 (ja) * 1993-03-31 2001-11-19 株式会社リコー 半導体装置
JP2004087253A (ja) * 2002-08-26 2004-03-18 Toyota Central Res & Dev Lab Inc 有機電子デバイス
AU2003254851A1 (en) * 2002-08-07 2004-02-25 Kabushiki Kaisha Toyota Chuo Kenkyusho Laminate having adherent layer and laminate having protective film
JP2005339863A (ja) 2004-05-25 2005-12-08 Toppan Printing Co Ltd フィルム有機ｅｌ素子
US20060093795A1 (en) 2004-11-04 2006-05-04 Eastman Kodak Company Polymeric substrate having a desiccant layer
JP4777717B2 (ja) * 2005-08-10 2011-09-21 東京エレクトロン株式会社 成膜方法、プラズマ処理装置および記録媒体
JP2007184251A (ja) 2005-12-07 2007-07-19 Sony Corp 表示装置
JP4400636B2 (ja) 2007-03-01 2010-01-20 株式会社豊田中央研究所 バリア膜及びバリア膜の製造方法
US20080286984A1 (en) * 2007-05-14 2008-11-20 Taylor Jason B Silicon-rich low-hydrogen content silicon nitride film
US7897482B2 (en) * 2007-05-31 2011-03-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP4719210B2 (ja) 2007-12-28 2011-07-06 富士通株式会社 半導体装置及びその製造方法
JP2010197813A (ja) 2009-02-26 2010-09-09 Hitachi Displays Ltd 画像表示装置
JP5056777B2 (ja) 2009-03-09 2012-10-24 セイコーエプソン株式会社 有機エレクトロルミネッセンス装置、その製造方法および電子機器
JP2010211893A (ja) 2009-03-12 2010-09-24 Funai Electric Co Ltd 再生リスト共有システム及び再生リスト共有方法
JP5593630B2 (ja) 2009-04-01 2014-09-24 セイコーエプソン株式会社 有機ｅｌ装置および電子機器
JP2011018686A (ja) 2009-07-07 2011-01-27 Hitachi Displays Ltd 有機ｅｌ表示装置
KR101065318B1 (ko) 2009-12-03 2011-09-16 삼성모바일디스플레이주식회사 플렉서블 디스플레이 장치의 제조 방법
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JP5197666B2 (ja) 2010-03-23 2013-05-15 株式会社東芝 有機発光装置、照明装置、表示装置及び有機発光装置の製造方法
JP5375732B2 (ja) 2010-04-26 2013-12-25 株式会社島津製作所 バリヤ膜を形成する方法およびバリヤ膜を形成するために用いるｃｖｄ装置
JP5609941B2 (ja) * 2012-09-26 2014-10-22 セイコーエプソン株式会社 表示装置および電子機器
US9601718B2 (en) * 2013-05-24 2017-03-21 Panasonic Corporation Barrier film, organic el device, flexible substrate, and method for manufacturing barrier film

Also Published As

Publication number Publication date
EP3006597B1 (en) 2020-07-01
EP3006597A1 (en) 2016-04-13
US9601718B2 (en) 2017-03-21
JP6280109B2 (ja) 2018-02-21
US20220359848A1 (en) 2022-11-10
JP2018088414A (ja) 2018-06-07
US11411203B2 (en) 2022-08-09
JPWO2014188731A1 (ja) 2017-02-23
US20160013445A1 (en) 2016-01-14
US10903452B2 (en) 2021-01-26
US20210111375A1 (en) 2021-04-15
US11903241B2 (en) 2024-02-13
US20190198813A1 (en) 2019-06-27
US10256437B2 (en) 2019-04-09
EP3006597A4 (en) 2016-07-13
WO2014188731A1 (ja) 2014-11-27
US20170155090A1 (en) 2017-06-01
JP6691149B2 (ja) 2020-04-28

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Application publication date: 20160601

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