JP6231721B2 - 多孔質セラミック構造体 - Google Patents
多孔質セラミック構造体 Download PDFInfo
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- JP6231721B2 JP6231721B2 JP2017506416A JP2017506416A JP6231721B2 JP 6231721 B2 JP6231721 B2 JP 6231721B2 JP 2017506416 A JP2017506416 A JP 2017506416A JP 2017506416 A JP2017506416 A JP 2017506416A JP 6231721 B2 JP6231721 B2 JP 6231721B2
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- Prior art keywords
- porous ceramic
- ceramic structure
- adhesive
- bulk body
- main surface
- Prior art date
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- 239000000919 ceramic Substances 0.000 title claims description 123
- 239000000853 adhesive Substances 0.000 claims description 55
- 230000001070 adhesive effect Effects 0.000 claims description 49
- 239000002245 particle Substances 0.000 claims description 29
- 239000010419 fine particle Substances 0.000 claims description 13
- 239000011148 porous material Substances 0.000 claims description 13
- 238000009413 insulation Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000005192 partition Methods 0.000 description 23
- 238000000034 method Methods 0.000 description 18
- 239000000463 material Substances 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 13
- 239000002002 slurry Substances 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 150000004706 metal oxides Chemical class 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
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- 238000012545 processing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
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- 230000036961 partial effect Effects 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
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- 239000000843 powder Substances 0.000 description 2
- 238000004663 powder metallurgy Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
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- 230000003247 decreasing effect Effects 0.000 description 1
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- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
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- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910002077 partially stabilized zirconia Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Structural Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Nanotechnology (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Porous Artificial Stone Or Porous Ceramic Products (AREA)
- Laminated Bodies (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Producing Shaped Articles From Materials (AREA)
Description
1/10≦ha/ta≦9/10
であることが好ましい。
1/10≦ha/ta≦7/10
がさらに好ましく、
1/10≦ha/ta≦1/2
がより好ましい。
(a) 粘着力が高いほど多孔質セラミック構造体10を強固に固定することができる。
(b) 引張伸度が高いほど曲面に追従させることができる。
(c) 厚みが薄いほど曲面に追従させやすい。
多孔質セラミック構造体10として、気孔率が60%、最小長が50μm、アスペクト比が10、切れ込み16の深さhaと多孔質セラミック構造体10の厚みtaとの関係がha/ta=1/2である多孔質セラミック構造体を使用し、上述した製造方法に準じて実施例1に係るバルク体22を作製した。すなわち、先ず、多孔質セラミック構造体10が1つの面に貼り付けられたシート28を使用した。そして、対象物24に接着剤26(熱伝導率2W/mK)を塗布した後、上記シート28を使って、対象物24の接着剤26上に多孔質セラミック構造体10を転写し、熱をかけることでシート28を剥がした。その上から接着剤26を塗布した後、接着剤26を固化して、対象物24の表面にバルク体22を設置した。
実施例1において、気孔率測定用の多孔質セラミック構造体とバルク体用の多孔質セラミック構造体を以下のようにして作製した。これは、後述する実施例2〜4並びに比較例1及び2についても同様である。
多孔質セラミック構造体10として、気孔率が60%、最小長が100μm、アスペクト比が5、ha/ta=1/2である多孔質セラミック構造体を使用した点以外は、実施例1と同様にして実施例2に係るバルク体22を作製した。
多孔質セラミック構造体10として、気孔率が75%、最小長が80μm、アスペクト比が7、ha/ta=1/7である多孔質セラミック構造体を使用した点以外は、実施例1と同様にして実施例3に係るバルク体22を作製した。
多孔質セラミック構造体10として、気孔率が30%、最小長が100μm、アスペクト比が5、ha/ta=1/2である多孔質セラミック構造体を使用した点以外は、実施例1と同様にして実施例4に係るバルク体22を作製した。
多孔質セラミック構造体10として、気孔率が10%、最小長が50μm、アスペクト比が10、ha/ta=1/2である多孔質セラミック構造体を使用した点以外は、実施例1と同様にして比較例1に係るバルク体22を作製した。
多孔質セラミック構造体10として、気孔率が60%、最小長が50μm、アスペクト比が10、ha/ta=1/20である多孔質セラミック構造体を使用した点以外は、実施例1と同様にして比較例2に係るバルク体22を作製した。
先ず、気孔率測定用の多孔質セラミック構造体10を複数の区画片30に分離した。複数の区画片30から無作為に10個の区画片30を選んで樹脂に埋込み、電子顕微鏡にて区画片30を観察することができる観察箇所まで研磨して、樹脂埋め研磨面とした。そして、この樹脂埋め研磨面に対して電子顕微鏡観察(画像解析)を行った。画像解析より、10個の区画片30の各気孔率を算出し、10個分の区画片30の平均値を多孔質セラミック構造体10の気孔率とした。
多孔質セラミック構造体10の平均気孔径を、株式会社島津製作所の自動ポロシメータ(商品名「オートポア9200」)を使用して計測した。
先ず、水銀ポロシメータでバルク体22の密度を測定した。次に、DSC(Differential Scanning Calorimeter)法でバルク体22の比熱を測定した。次に、レーザーフラッシュ法でバルク体22の熱拡散率を測定した。その後、熱拡散率×比熱×密度=熱伝導率の関係式から、バルク体22の熱伝導率を算出し、以下の評価基準に基づいて、実施例1〜4、比較例1及び2を評価した。
A:0.9W/mK以下
B:1.0W/mK以上1.4W/mK以下
C:1.5W/mK以上
テープ剥離試験を行うことで、バルク体22の対象物24への密着性を評価した。バルク体22が対象物24から一部でも剥離した場合を×、バルク体22が剥離しなかった場合を○と評価した。×の評価であった場合は、バルク体22の熱伝導率の測定を行わなかった。
実施例1〜4、比較例1及び2の内訳及び評価結果を下記表1に示す。
Claims (6)
- 接着剤(26)が塗布されたバルク体(22)として基材に貼着され、気孔率が20〜99%である断熱用途の多孔質セラミック構造体であって、
一主面(12a)と、該一主面(12a)と対向する他主面(12b)とを有し、
前記一主面(12a)から前記他主面(12b)に向かって少なくとも1つの切れ込み(16)が形成され、
厚みが500μm以下であり、
前記切れ込み(16)で区画された部分(18)のアスペクト比が3以上であり、
前記バルク体(22)とした場合の熱伝導率が1W/mK以下であることを特徴とする多孔質セラミック構造体。 - 請求項1記載の多孔質セラミック構造体において、
前記切れ込み(16)の深さをha、当該多孔質セラミック構造体(10)の厚みをtaとしたとき、1/10≦ha/ta≦9/10を満足することを特徴とする多孔質セラミック構造体。 - 請求項1又は2記載の多孔質セラミック構造体において、
最小長(Lb)が500μm以下であることを特徴とする多孔質セラミック構造体。 - 請求項1〜3のいずれか1項に記載の多孔質セラミック構造体において、
平均気孔径が500nm以下であることを特徴とする多孔質セラミック構造体。 - 請求項1〜4のいずれか1項に記載の多孔質セラミック構造体において、
微粒子が三次元に繋がった構造を有し、
前記微粒子の粒径が1nm〜5μmであることを特徴とする多孔質セラミック構造体。 - 請求項1〜5のいずれか1項に記載の多孔質セラミック構造体において、
粘着力のあるシート(28)に貼り付けられていることを特徴とする多孔質セラミック構造体。
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