JP6212467B2 - 液面計及び液体原料気化供給装置 - Google Patents
液面計及び液体原料気化供給装置 Download PDFInfo
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- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
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- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
- G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
- G01F23/24—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of resistance of resistors due to contact with conductor fluid
- G01F23/246—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of resistance of resistors due to contact with conductor fluid thermal devices
- G01F23/247—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of resistance of resistors due to contact with conductor fluid thermal devices for discrete levels
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- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
- G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
- G01F23/26—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of capacity or inductance of capacitors or inductors arising from the presence of liquid or fluent solid material in the electric or electromagnetic fields
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
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- Electromagnetism (AREA)
- Chemical Vapour Deposition (AREA)
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Description
2 気化チャンバ
3 保護管
4 流量制御装置
L 液体原料
L1 液面
9 フランジ
10 金属ガスケット
9c、2f ガスケット用凹部
9d、2g ガスケット押え用環状突起
12 蒸気遮板
Claims (18)
- 液面検知部材と温度測定部材とを有し、液体を貯留するチャンバ内に設けられる液面計であって、前記液面検知部材が、測温抵抗体を収容した保護管を備え、前記チャンバ内に水平に配置されており、
前記保護管が前記チャンバの側壁に水平方向に挿入されて固定されており、前記保護管が前記チャンバの側壁に固定するためのフランジを備え、該フランジと前記チャンバ側壁の外側面との間に該保護管の周囲を囲む金属ガスケットが介在され、該フランジと前記チャンバ側壁の外側面の各々に形成されて前記金属ガスケットを収容するガスケット用凹部が備えられていることを特徴とする前記液面計。 - 前記温度測定部材が、測温抵抗体が収容された保護管を備え、前記チャンバ内に水平に配置されていることを特徴とする請求項1に記載の液面計。
- 前記液面検知部材の保護管に備えられた前記フランジに前記温度測定部材の保護管が取り付けられて前記液面検知部材の保護管と前記温度測定部材の保護管とが一体化されていることを特徴とする請求項2に記載の液面計。
- 前記温度測定部材が、熱電対、サーミスタ、又は赤外温度計が収容された保護管を備えていることを特徴とする請求項1又は2に記載の液面計。
- 前記温度測定部材と前記液面検知部材とが同じ水平高さに配置されていることを特徴とする請求項2又は3に記載の液面計。
- 前記液面検知部材の測温抵抗体に温度測定用電流より大きな電流値の電流を流して該液面検知部材により測定された検知温度を、前記温度測定部材により測定された温度と比較することにより前記液面検知部材が液相部内に存在するか気相部内に存在するかを検知するように構成されている、請求項1に記載の液面計。
- 前記温度測定部材の測温抵抗体に温度測定用の第1の電流を流すとともに、前記液面検知部材の測温抵抗体に前記第1の電流より大きい第2の電流を流し、前記各測温抵抗体の抵抗値を比較することにより前記液面検知部材が液相部内に存在するか気相部内に存在するかを検知するように構成されている、請求項2に記載の液面計。
- 前記温度測定部材が予め設定された下限液位より下方に配置され、前記液面検知部材が前記下限液位及び予め設定された上限液位の少なくとも一方の液位に配置されていることを特徴とする請求項7に記載の液面計。
- 液体原料を貯留するチャンバ内に水平に配置され、測温抵抗体が収容された1つの保護管を備え、
前記保護管が前記チャンバの側壁に水平方向に挿入されて固定されており、前記保護管が前記チャンバの側壁に固定するためのフランジを備え、該フランジと前記チャンバ側壁の外側面との間に該保護管の周囲を囲む金属ガスケットが介在され、該フランジと前記チャンバ側壁の外側面の各々に形成されて前記金属ガスケットを収容するガスケット用凹部が備えられ、
前記測温抵抗体に温度測定用の第1の電流値の電流と該第1の電流値より大きい第2の電流値の電流とを交互に流し、各々の電流値に対する前記測温抵抗体の抵抗値を比較することにより、前記保護管が液相部内に存在するか気相部内に存在するかを検知するように構成されている液面計。 - 液体を貯留するチャンバ内に水平に配置され、測温抵抗体が収容された1つの保護管を備え、
前記保護管が前記チャンバの側壁に水平方向に挿入されて固定されており、前記保護管が前記チャンバの側壁に固定するためのフランジを備え、該フランジと前記チャンバ側壁の外側面との間に該保護管の周囲を囲む金属ガスケットが介在され、該フランジと前記チャンバ側壁の外側面の各々に形成されて前記金属ガスケットを収容するガスケット用凹部が備えられ、
前記測温抵抗体に温度測定用電流より大きな所定の電流値の電流を流し、前記保護管が液相部内にあるときと気相部内にあるときとの抵抗値変化に基づいて、前記保護管が液相部内にあるか気相部内にあるかを検知するように構成されている液面計。 - 前記保護管に不動態処理が施されていることを特徴とする請求項1〜10の何れかに記載の液面計。
- 液体原料を貯留し気化させるチャンバと、前記チャンバ内に配置された液面検知部材と、前記チャンバ内の温度を測定する温度測定部材と、前記チャンバ内で気化された原料ガスの流量を制御する流量制御装置と、を備え、前記液面検知部材が、測温抵抗体を収容した保護管を備え、前記チャンバ内に水平に配置されており、
前記保護管が前記チャンバの側壁に水平方向に挿入されて固定されており、前記保護管が前記チャンバの側壁に固定するためのフランジを備え、該フランジと前記チャンバ側壁の外側面との間に該保護管の周囲を囲む金属ガスケットが介在され、該フランジと前記チャンバ側壁の外側面の各々に形成されて前記金属ガスケットを収容するガスケット用凹部が備えられていることを特徴とする、液体原料気化供給装置。 - 該フランジと前記チャンバ側壁の外側面の各々に形成された前記ガスケット用凹部の其々にガスケット押え用環状突起が形成されていることを特徴とする請求項12に記載の液体原料気化供給装置。
- 前記温度測定部材が、測温抵抗体又は熱電対を収容した保護管を備え、前記チャンバ内に水平に配置されており、
前記液面検知部材と前記温度測定部材とが、同じ水平高さに配置されていることを特徴とする請求項12に記載の液面計を備えた液体原料気化供給装置。 - 前記保護管の下方に、液体原料から上昇する蒸気を遮るための蒸気遮板が設けられていることを特徴とする請求項12に記載の液体原料気化供給装置。
- 前記蒸気遮板が傾斜状に延びていることを特徴とする請求項15に記載の液面計を備えた液体原料気化供給装置。
- 前記液面検知部材の保護管に備えられた前記フランジに前記温度測定部材の保護管が取り付けられて前記液面検知部材の保護管と前記温度測定部材の保護管とが一体化されていることを特徴とする請求項14に記載の液体原料気化供給装置。
- 該フランジと前記チャンバ側壁の外側面の各々に形成された前記ガスケット用凹部の其々にガスケット押え用環状突起が形成されていることを特徴とする請求項1または9または10に記載の液面計。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
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JP2014231119A JP6212467B2 (ja) | 2014-11-13 | 2014-11-13 | 液面計及び液体原料気化供給装置 |
PCT/JP2015/005498 WO2016075892A1 (ja) | 2014-11-13 | 2015-11-02 | 液面計及び液体原料気化供給装置 |
US15/525,479 US10604840B2 (en) | 2014-11-13 | 2015-11-02 | Liquid level indicator and liquid raw material vaporization feeder |
CN201580044670.6A CN107003168B (zh) | 2014-11-13 | 2015-11-02 | 液面计以及液体原料气化供给装置 |
KR1020177003066A KR101930303B1 (ko) | 2014-11-13 | 2015-11-02 | 액면계 및 액체 원료 기화 공급 장치 |
TW104137016A TWI592639B (zh) | 2014-11-13 | 2015-11-10 | Liquid level gauge and liquid material gasification supply device |
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JP6212467B2 (ja) * | 2014-11-13 | 2017-10-11 | 株式会社フジキン | 液面計及び液体原料気化供給装置 |
JP6704809B2 (ja) * | 2016-07-05 | 2020-06-03 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法および記憶媒体 |
JP6830265B2 (ja) * | 2016-12-27 | 2021-02-17 | 株式会社フジキン | 液面計、それを備えた気化器、及び液面検知方法 |
JP7137921B2 (ja) * | 2017-11-07 | 2022-09-15 | 株式会社堀場エステック | 気化システム及び気化システム用プログラム |
CN109489764A (zh) * | 2018-12-18 | 2019-03-19 | 中国矿业大学(北京) | 一种实验室规模气体体积自动计量装置及方法 |
CN112843756A (zh) * | 2020-12-29 | 2021-05-28 | 东华理工大学 | 液体蒸发气体发生器及其控制方法 |
KR102347205B1 (ko) * | 2021-02-26 | 2022-01-06 | (주)지오엘리먼트 | 전구체의 레벨 측정 기능을 구비한 기화기 시스템 |
JP2024008209A (ja) * | 2022-07-07 | 2024-01-19 | 大陽日酸株式会社 | 固体材料容器、固体材料供給装置、及び固体材料供給方法 |
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US3181557A (en) * | 1962-11-02 | 1965-05-04 | Jr James E Lannan | Liquid interface sensor |
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US3983751A (en) * | 1974-07-17 | 1976-10-05 | Atlantic Richfield Company | Method of measuring the level of elevated temperature particulate material |
JPS6446717U (ja) * | 1987-09-17 | 1989-03-22 | ||
JPS6446716U (ja) * | 1987-09-17 | 1989-03-22 | ||
JPH039809A (ja) | 1989-06-06 | 1991-01-17 | Daietsu:Kk | 水分計測方法 |
JPH0651834U (ja) * | 1992-12-18 | 1994-07-15 | ティーディーケイ株式会社 | 液面及び異常過熱検出装置 |
JP3009809B2 (ja) * | 1993-08-26 | 2000-02-14 | 株式会社鷺宮製作所 | 半導体加工用液体原料収容容器における液面検出装置 |
JP3009809U (ja) * | 1994-10-03 | 1995-04-11 | タックメディカル株式会社 | 趾間部保護シート |
JP2951954B1 (ja) * | 1998-09-17 | 1999-09-20 | ムサシノ機器株式会社 | 気圧式液面計 |
JP3869169B2 (ja) | 1999-09-29 | 2007-01-17 | 株式会社鷺宮製作所 | 液面検出装置 |
JP3826072B2 (ja) * | 2002-06-03 | 2006-09-27 | アドバンスド エナジー ジャパン株式会社 | 液体材料気化供給装置 |
JP4405315B2 (ja) * | 2004-05-28 | 2010-01-27 | シャープ株式会社 | 蒸気調理器 |
JP4999605B2 (ja) * | 2007-08-23 | 2012-08-15 | 日本エア・リキード株式会社 | 液化ガスの気化方法、気化装置およびこれを用いた液化ガス供給装置 |
JP5461786B2 (ja) | 2008-04-01 | 2014-04-02 | 株式会社フジキン | 気化器を備えたガス供給装置 |
JP5350824B2 (ja) | 2009-02-03 | 2013-11-27 | 株式会社フジキン | 液体材料の気化供給システム |
US8438919B2 (en) * | 2010-07-23 | 2013-05-14 | Rosemount Aerospace Inc. | Systems and methods for liquid level sensing having a differentiating output |
JP5400816B2 (ja) | 2011-01-31 | 2014-01-29 | 株式会社トリケミカル研究所 | 液面レベルセンサー |
JP5913888B2 (ja) | 2011-09-30 | 2016-04-27 | 国立大学法人東北大学 | 気化器 |
US9357881B2 (en) * | 2012-03-31 | 2016-06-07 | Pitco Frialator, Inc. | Oil level detection system for deep fat fryer |
JP2014211345A (ja) | 2013-04-18 | 2014-11-13 | 株式会社八洲測器 | 液面検出装置 |
US20150323938A1 (en) * | 2014-05-09 | 2015-11-12 | Honeywell International Inc. | Temperature-based level detection and control method and apparatus |
EP2995913B1 (en) * | 2014-09-10 | 2020-06-17 | Bruker Switzerland AG | Robust dynamical method for detecting the level of a liquid using resistance temperature detectors |
JP6212467B2 (ja) * | 2014-11-13 | 2017-10-11 | 株式会社フジキン | 液面計及び液体原料気化供給装置 |
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KR20170026607A (ko) | 2017-03-08 |
TW201631299A (zh) | 2016-09-01 |
US10604840B2 (en) | 2020-03-31 |
WO2016075892A1 (ja) | 2016-05-19 |
CN107003168B (zh) | 2019-12-20 |
CN107003168A (zh) | 2017-08-01 |
JP2016095212A (ja) | 2016-05-26 |
US20170327949A1 (en) | 2017-11-16 |
TWI592639B (zh) | 2017-07-21 |
KR101930303B1 (ko) | 2018-12-18 |
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