JP7005531B2 - 改善されたプロセス侵襲を有するプロセス流体温度計測システム - Google Patents
改善されたプロセス侵襲を有するプロセス流体温度計測システム Download PDFInfo
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- JP7005531B2 JP7005531B2 JP2018565387A JP2018565387A JP7005531B2 JP 7005531 B2 JP7005531 B2 JP 7005531B2 JP 2018565387 A JP2018565387 A JP 2018565387A JP 2018565387 A JP2018565387 A JP 2018565387A JP 7005531 B2 JP7005531 B2 JP 7005531B2
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- temperature
- thermowell
- process fluid
- fluid temperature
- thermal conductivity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/02—Means for indicating or recording specially adapted for thermometers
- G01K1/024—Means for indicating or recording specially adapted for thermometers for remote indication
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K17/00—Measuring quantity of heat
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K17/00—Measuring quantity of heat
- G01K17/06—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/42—Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
Claims (11)
- プロセス流体温度計測システムであって、
プロセス流体導管の壁へ結合されるように形成された断熱性カラー、
前記断熱性カラーに結合するように且つ前記プロセス流体導管の壁を通って延在するように構成されたサーモウェル;
前記サーモウェル内に配置された温度センサアセンブリであって、前記温度センサアセンブリが、
前記サーモウェルの壁から離間し、前記サーモウェル内に配置された第1の感温素子と、
前記サーモウェル内に配置され、前記サーモウェルの遠位端に隣接し、既知の熱伝導率を有して粉末から形成されたスペーサに沿って前記第1の感温素子から離間した第2の感温素子と、
を含む温度センサアセンブリ;及び
送信回路であって、
前記第1及び第2の感温素子に結合された計測回路と、
プロセス通信プロトコルに従って通信するように構成された通信回路と、
前記計測回路と前記通信回路に結合されたマイクロプロセッサであって、前記第1及び第2の感温素子からの各信号に基づいて第1及び第2の各温度の値を計算し、前記第1及び第2の各温度の値と前記スペーサの前記既知の熱伝導率を使用して熱流束計算を実行し、前記通信回路を使用して前記プロセス通信プロトコルに従い、プロセス流体温度出力を提供するマイクロプロセッサと、
を含む送信回路;
を備えている、
上記プロセス流体温度計測システム。 - 前記熱流束計算は、前記サーモウェルの遠位端の熱伝導率と、前記第1及び第2の感温素子の間の前記スペーサの熱伝導率に基づく、請求項1に記載のプロセス流体温度計測システム。
- 前記熱流束計算は、前記スペーサの熱伝導率に対する前記サーモウェルの遠位端の熱伝導率の比に基づく、請求項2に記載のプロセス流体温度計測システム。
- 前記熱流束計算は、前記第2の感温素子によって計測された温度から前記第1の感温素子によって計測された温度が減算された差に、前記比が乗算され、さらに、前記第2の感温素子によって計測された温度が加算されたものに基づく、請求項3に記載のプロセス流体温度計測システム。
- 前記粉末は、酸化マグネシウム粉末である、請求項1に記載のプロセス流体温度計測システム。
- 前記断熱性カラーは、前記サーモウェルに係合するように構成された内側ねじと、前記導管壁に係合するように構成された外側ねじとを有し、前記断熱性カラーは、サーモウェルの熱伝導率よりも小さい熱伝導率を有する、請求項1に記載のプロセス流体温度計測システム。
- 導管内のプロセス流体温度を検出する方法であって、
前記導管の壁へ断熱性カラーを結合すること;
前記断熱性カラーへ前記導管の壁を通って延在するように構成されたサーモウェルを結合すること;
プロセス流体温度送信機の計測回路を使用して、前記サーモウェル内で前記サーモウェルの壁から離間した位置に配置された第1の感温素子を用いて第1の温度を感知すること;
前記プロセス流体温度送信機の計測回路を使用して、前記サーモウェル内の遠位端に隣接した第2の感温素子を用いて第2の温度を感知し、前記第2の感温素子は、既知の熱伝導率を有して粉末から形成されたスペーサによって前記第1の感温素子から離間していること;及び
前記プロセス流体温度送信機のマイクロプロセッサを使用して、前記第1及び第2の感知された各温度と前記スペーサの前記既知の熱伝導率を用いて熱流束の計算を実行すること;
前記第1及び第2の感知された各温度と前記熱流束に基づいて、プロセス通信プロトコルに従って、プロセス流体温度出力を提供すること;
を包含する、
上記方法。 - 前記粉末は、酸化マグネシウム粉末である、請求項7に記載の方法。
- 前記プロセス流体温度出力は、前記プロセス流体温度送信器の通信回路を用いて提供される、請求項7に記載の方法。
- 前記プロセス流体温度出力は、有線プロセス通信チャネルを介して提供される、請求項9に記載の方法。
- 前記プロセス流体温度出力は、無線で提供される、請求項9に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/196,569 | 2016-06-29 | ||
US15/196,569 US11067520B2 (en) | 2016-06-29 | 2016-06-29 | Process fluid temperature measurement system with improved process intrusion |
PCT/US2017/037222 WO2018005082A1 (en) | 2016-06-29 | 2017-06-13 | Process fluid temperature measurement system with improved process intrusion |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019519779A JP2019519779A (ja) | 2019-07-11 |
JP7005531B2 true JP7005531B2 (ja) | 2022-01-21 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018565387A Active JP7005531B2 (ja) | 2016-06-29 | 2017-06-13 | 改善されたプロセス侵襲を有するプロセス流体温度計測システム |
Country Status (7)
Country | Link |
---|---|
US (1) | US11067520B2 (ja) |
EP (1) | EP3479090A4 (ja) |
JP (1) | JP7005531B2 (ja) |
CN (2) | CN206656811U (ja) |
CA (1) | CA3029201A1 (ja) |
RU (1) | RU2710520C1 (ja) |
WO (1) | WO2018005082A1 (ja) |
Families Citing this family (17)
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US11067520B2 (en) * | 2016-06-29 | 2021-07-20 | Rosemount Inc. | Process fluid temperature measurement system with improved process intrusion |
US11181427B2 (en) | 2018-01-18 | 2021-11-23 | In-Situ, Inc. | Fast response temperature sensors |
US10976204B2 (en) | 2018-03-07 | 2021-04-13 | Rosemount Inc. | Heat flux sensor with improved heat transfer |
US11073429B2 (en) * | 2018-09-24 | 2021-07-27 | Rosemount Inc. | Non-invasive process fluid temperature indication for high temperature applications |
US11002582B2 (en) * | 2018-09-28 | 2021-05-11 | Rosemount Inc. | Process transmitter with thermal fluid detection for decreasing damage to the process transmitter components |
JP7368462B2 (ja) | 2018-09-28 | 2023-10-24 | ローズマウント インコーポレイテッド | 誤差が減少した非侵襲的プロセス流体温度表示 |
US20200103293A1 (en) | 2018-09-28 | 2020-04-02 | Rosemount Inc. | Non-invasive process fluid temperature indication |
CH715585B1 (de) | 2018-11-23 | 2021-12-30 | Belimo Holding Ag | Regelventil. |
CN109443444B (zh) * | 2018-12-17 | 2020-03-31 | 西安交通大学 | 利用流型和温度测量装置预测管路内凝结水击的方法 |
MX2021015697A (es) | 2019-07-01 | 2022-02-21 | Thermasense Corp | Aparatos, sistemas y metodos de interrogacion termica no invasiva. |
US11022321B1 (en) | 2019-12-16 | 2021-06-01 | June Life, Inc. | Cooking appliance accessory and method of use |
JP6716799B1 (ja) * | 2020-02-07 | 2020-07-01 | 三菱日立パワーシステムズ株式会社 | 温度計保護筒、温度計測器具及び蒸気配管構造物並びに温度計保護筒の設置方法 |
WO2021207976A1 (en) | 2020-04-15 | 2021-10-21 | Rosemount Inc. | Vibration resistant temperature sensing assembly |
USD978600S1 (en) | 2021-06-11 | 2023-02-21 | June Life, Inc. | Cooking vessel |
USD1007224S1 (en) | 2021-06-11 | 2023-12-12 | June Life, Inc. | Cooking vessel |
CN113820044B (zh) * | 2021-11-25 | 2022-03-01 | 东营昱辰技术有限公司 | 一种防止水锤冲击的温度变送器 |
CN114136477B (zh) * | 2021-11-29 | 2023-02-24 | 盐城市苏瑞思电子有限责任公司 | 一种基于铂热电阻的温度传感装置 |
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2016
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2017
- 2017-01-23 CN CN201720091539.1U patent/CN206656811U/zh not_active Withdrawn - After Issue
- 2017-01-23 CN CN201710049532.8A patent/CN107543625B/zh active Active
- 2017-06-13 CA CA3029201A patent/CA3029201A1/en not_active Abandoned
- 2017-06-13 RU RU2019102184A patent/RU2710520C1/ru active
- 2017-06-13 EP EP17820891.4A patent/EP3479090A4/en active Pending
- 2017-06-13 JP JP2018565387A patent/JP7005531B2/ja active Active
- 2017-06-13 WO PCT/US2017/037222 patent/WO2018005082A1/en unknown
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Also Published As
Publication number | Publication date |
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EP3479090A1 (en) | 2019-05-08 |
JP2019519779A (ja) | 2019-07-11 |
WO2018005082A1 (en) | 2018-01-04 |
EP3479090A4 (en) | 2020-02-19 |
US20180003655A1 (en) | 2018-01-04 |
CA3029201A1 (en) | 2018-01-04 |
CN107543625B (zh) | 2021-08-06 |
RU2710520C1 (ru) | 2019-12-26 |
CN107543625A (zh) | 2018-01-05 |
US11067520B2 (en) | 2021-07-20 |
CN206656811U (zh) | 2017-11-21 |
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