JP6197619B2 - 電子装置及び電子装置の製造方法 - Google Patents

電子装置及び電子装置の製造方法 Download PDF

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JP6197619B2
JP6197619B2 JP2013254372A JP2013254372A JP6197619B2 JP 6197619 B2 JP6197619 B2 JP 6197619B2 JP 2013254372 A JP2013254372 A JP 2013254372A JP 2013254372 A JP2013254372 A JP 2013254372A JP 6197619 B2 JP6197619 B2 JP 6197619B2
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Prior art keywords
terminal
electronic component
bonding material
circuit board
semiconductor package
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JP2013254372A
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Japanese (ja)
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JP2015115363A5 (enExample
JP2015115363A (ja
Inventor
浩三 清水
浩三 清水
作山　誠樹
誠樹 作山
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Fujitsu Ltd
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Fujitsu Ltd
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Priority to JP2013254372A priority Critical patent/JP6197619B2/ja
Priority to US14/532,032 priority patent/US9490232B2/en
Priority to CN201710096783.1A priority patent/CN107424983A/zh
Priority to CN201611027509.0A priority patent/CN107039379A/zh
Priority to CN201410708719.0A priority patent/CN104701281B/zh
Priority to CN201710096431.6A priority patent/CN106887418A/zh
Publication of JP2015115363A publication Critical patent/JP2015115363A/ja
Priority to US15/142,690 priority patent/US9530745B2/en
Priority to US15/271,744 priority patent/US9761552B2/en
Priority to US15/351,992 priority patent/US9812418B2/en
Publication of JP2015115363A5 publication Critical patent/JP2015115363A5/ja
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    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
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    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
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    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
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    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
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    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
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    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
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    • B23K35/24—Selection of soldering or welding materials proper
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    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
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    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
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    • B23K2101/00—Articles made by soldering, welding or cutting
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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
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US14/532,032 US9490232B2 (en) 2013-12-09 2014-11-04 Electronic apparatus and method for fabricating the same
CN201710096783.1A CN107424983A (zh) 2013-12-09 2014-11-26 电子设备及其制造方法
CN201611027509.0A CN107039379A (zh) 2013-12-09 2014-11-26 电子设备及其制造方法
CN201410708719.0A CN104701281B (zh) 2013-12-09 2014-11-26 电子设备及其制造方法
CN201710096431.6A CN106887418A (zh) 2013-12-09 2014-11-26 电子设备及其制造方法
US15/142,690 US9530745B2 (en) 2013-12-09 2016-04-29 Electronic apparatus and method for fabricating the same
US15/271,744 US9761552B2 (en) 2013-12-09 2016-09-21 Electronic apparatus and method for fabricating the same
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