JP6064903B2 - 導電性シート - Google Patents

導電性シート Download PDF

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Publication number
JP6064903B2
JP6064903B2 JP2013517880A JP2013517880A JP6064903B2 JP 6064903 B2 JP6064903 B2 JP 6064903B2 JP 2013517880 A JP2013517880 A JP 2013517880A JP 2013517880 A JP2013517880 A JP 2013517880A JP 6064903 B2 JP6064903 B2 JP 6064903B2
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JP
Japan
Prior art keywords
conductive
fine particles
layer
conductive layer
dendritic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013517880A
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English (en)
Japanese (ja)
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JPWO2012164925A1 (ja
Inventor
祐司 西山
祐司 西山
冨永　浩史
浩史 冨永
邦広 古川
邦広 古川
英宣 小林
英宣 小林
和規 松戸
和規 松戸
孝洋 松沢
孝洋 松沢
晟 瞿
晟 瞿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Ink SC Holdings Co Ltd
Toyochem Co Ltd
Original Assignee
Toyo Ink SC Holdings Co Ltd
Toyochem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=47258797&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP6064903(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Toyo Ink SC Holdings Co Ltd, Toyochem Co Ltd filed Critical Toyo Ink SC Holdings Co Ltd
Publication of JPWO2012164925A1 publication Critical patent/JPWO2012164925A1/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/105—Metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/304—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
JP2013517880A 2011-05-31 2012-05-30 導電性シート Active JP6064903B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2011121188 2011-05-31
JP2011121188 2011-05-31
JP2011233528 2011-10-25
JP2011233528 2011-10-25
PCT/JP2012/003541 WO2012164925A1 (ja) 2011-05-31 2012-05-30 導電性シート及びその製造方法、並びに電子部品

Publications (2)

Publication Number Publication Date
JPWO2012164925A1 JPWO2012164925A1 (ja) 2015-02-23
JP6064903B2 true JP6064903B2 (ja) 2017-01-25

Family

ID=47258797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013517880A Active JP6064903B2 (ja) 2011-05-31 2012-05-30 導電性シート

Country Status (4)

Country Link
JP (1) JP6064903B2 (ko)
KR (2) KR101931274B1 (ko)
CN (1) CN103597551B (ko)
WO (1) WO2012164925A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190088385A (ko) 2018-01-18 2019-07-26 타츠타 전선 주식회사 도전성 접착 필름 및 이것을 사용한 전자파 차폐 필름

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* Cited by examiner, † Cited by third party
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JP6025532B2 (ja) * 2012-11-30 2016-11-16 三井金属鉱業株式会社 導電性フィルム及び電子部品パッケージ
KR20170037878A (ko) * 2014-07-31 2017-04-05 다츠다 덴센 가부시키가이샤 도전성 조성물 및 이것을 포함한 도전성 시트
EP3187279A4 (en) * 2014-08-26 2018-04-18 Sumitomo Metal Mining Co., Ltd. Silver-coated copper powder, and conductive paste, conductive coating material and conductive sheet each of which uses same
JP6542526B2 (ja) * 2014-11-12 2019-07-10 デクセリアルズ株式会社 熱硬化性接着組成物、及び熱硬化性接着シート
WO2016076096A1 (ja) * 2014-11-12 2016-05-19 デクセリアルズ株式会社 熱硬化性接着組成物
JP5892282B1 (ja) * 2015-04-27 2016-03-23 東洋インキＳｃホールディングス株式会社 導電性接着剤、導電性接着シート、および配線デバイス
JP5871098B1 (ja) * 2015-07-16 2016-03-01 東洋インキＳｃホールディングス株式会社 導電性接着剤層、導電性接着シートおよびプリント配線板
JP5972489B1 (ja) * 2016-02-10 2016-08-17 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
JP5989928B1 (ja) * 2016-02-10 2016-09-07 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
JP6005313B1 (ja) 2016-02-10 2016-10-12 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
JP6005312B1 (ja) 2016-02-10 2016-10-12 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
JP5972490B1 (ja) 2016-02-10 2016-08-17 古河電気工業株式会社 導電性接着剤組成物ならびにこれを用いた導電性接着フィルムおよびダイシング・ダイボンディングフィルム
KR102009416B1 (ko) * 2016-12-01 2019-08-12 율촌화학 주식회사 전자파 간섭 노이즈 차폐와 흡수 및 방열 복합 시트용 조성물 및 이를 포함하는 복합 시트
KR101935882B1 (ko) * 2016-12-30 2019-01-07 한화큐셀앤드첨단소재 주식회사 전자파 차폐필름 및 이의 제조방법
US11242472B2 (en) * 2017-02-17 2022-02-08 Showa Denko Materials Co., Ltd. Adhesive film
JP7031203B2 (ja) * 2017-09-29 2022-03-08 東洋インキＳｃホールディングス株式会社 放熱用接着シート、放熱接着部材用積層体、及び複合部材
BR112020008287A2 (pt) 2017-11-02 2020-10-20 Zephyros, Inc. material adesivo/selante para aquecimento por indução
KR102075979B1 (ko) * 2017-12-26 2020-02-12 율촌화학 주식회사 전자파 차폐, 방열 및 전자파 간섭 노이즈 흡수 성능이 우수한 복합시트 및 이의 제조 방법
WO2019131923A1 (ja) * 2017-12-28 2019-07-04 日立化成株式会社 接着剤フィルム
JP6431998B1 (ja) * 2018-03-20 2018-11-28 タツタ電線株式会社 導電性接着剤層
JP6753455B2 (ja) * 2018-12-13 2020-09-09 東洋インキＳｃホールディングス株式会社 導電性樹脂組成物、導電性接着シート、およびプリント配線板
KR102404193B1 (ko) 2019-05-20 2022-05-30 타츠타 전선 주식회사 도전성 접착 시트

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JP3151712B2 (ja) * 1992-10-28 2001-04-03 タツタ電線株式会社 電子部品用電磁波遮蔽フィルム
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JPH08199109A (ja) * 1995-01-23 1996-08-06 Tokuyama Corp 銅ペースト及びその製造方法
WO2001064807A1 (fr) * 2000-02-29 2001-09-07 Matsushita Electric Industrial Co., Ltd. Adhesif conducteur, appareil de montage de composant electronique, et procede de montage d'un tel composant
JP2004297005A (ja) * 2003-03-28 2004-10-21 Hitachi Chem Co Ltd 電波吸収シート用ペースト
JP4149364B2 (ja) * 2003-11-18 2008-09-10 三井金属鉱業株式会社 デンドライト状微粒銀粉及びその製造方法
JP2005236153A (ja) * 2004-02-23 2005-09-02 Sumitomo Bakelite Co Ltd 多層回路基板およびその製造方法
JP4646663B2 (ja) * 2005-03-25 2011-03-09 住友電工プリントサーキット株式会社 シールドフレキシブル配線板の製造方法
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190088385A (ko) 2018-01-18 2019-07-26 타츠타 전선 주식회사 도전성 접착 필름 및 이것을 사용한 전자파 차폐 필름

Also Published As

Publication number Publication date
CN103597551B (zh) 2016-04-06
WO2012164925A1 (ja) 2012-12-06
CN103597551A (zh) 2014-02-19
KR101846474B1 (ko) 2018-04-06
KR20180036806A (ko) 2018-04-09
KR101931274B1 (ko) 2018-12-20
KR20140031325A (ko) 2014-03-12
JPWO2012164925A1 (ja) 2015-02-23

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