JP5984504B2 - 静電チャック、静電チャックの製造方法 - Google Patents

静電チャック、静電チャックの製造方法 Download PDF

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Publication number
JP5984504B2
JP5984504B2 JP2012116035A JP2012116035A JP5984504B2 JP 5984504 B2 JP5984504 B2 JP 5984504B2 JP 2012116035 A JP2012116035 A JP 2012116035A JP 2012116035 A JP2012116035 A JP 2012116035A JP 5984504 B2 JP5984504 B2 JP 5984504B2
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Japan
Prior art keywords
hole
electrostatic chuck
flow path
insulating
gas
Prior art date
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JP2012116035A
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English (en)
Japanese (ja)
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JP2013243267A (ja
JP2013243267A5 (enExample
Inventor
則雄 白岩
則雄 白岩
治郎 川合
治郎 川合
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2012116035A priority Critical patent/JP5984504B2/ja
Priority to US13/890,566 priority patent/US9660557B2/en
Priority to TW102116978A priority patent/TWI591751B/zh
Priority to KR1020130055479A priority patent/KR102048789B1/ko
Publication of JP2013243267A publication Critical patent/JP2013243267A/ja
Publication of JP2013243267A5 publication Critical patent/JP2013243267A5/ja
Application granted granted Critical
Publication of JP5984504B2 publication Critical patent/JP5984504B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
JP2012116035A 2012-05-21 2012-05-21 静電チャック、静電チャックの製造方法 Active JP5984504B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012116035A JP5984504B2 (ja) 2012-05-21 2012-05-21 静電チャック、静電チャックの製造方法
US13/890,566 US9660557B2 (en) 2012-05-21 2013-05-09 Electrostatic chuck and method for manufacturing the electrostatic chuck
TW102116978A TWI591751B (zh) 2012-05-21 2013-05-14 靜電夾頭及製造靜電夾頭之方法
KR1020130055479A KR102048789B1 (ko) 2012-05-21 2013-05-16 정전 척 및 정전 척의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012116035A JP5984504B2 (ja) 2012-05-21 2012-05-21 静電チャック、静電チャックの製造方法

Publications (3)

Publication Number Publication Date
JP2013243267A JP2013243267A (ja) 2013-12-05
JP2013243267A5 JP2013243267A5 (enExample) 2015-06-18
JP5984504B2 true JP5984504B2 (ja) 2016-09-06

Family

ID=49581114

Family Applications (1)

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JP2012116035A Active JP5984504B2 (ja) 2012-05-21 2012-05-21 静電チャック、静電チャックの製造方法

Country Status (4)

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US (1) US9660557B2 (enExample)
JP (1) JP5984504B2 (enExample)
KR (1) KR102048789B1 (enExample)
TW (1) TWI591751B (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5811513B2 (ja) * 2014-03-27 2015-11-11 Toto株式会社 静電チャック
JP6658509B2 (ja) * 2015-02-18 2020-03-04 住友大阪セメント株式会社 静電チャック装置及び半導体製造装置
KR102315180B1 (ko) * 2017-06-13 2021-10-20 엔지케이 인슐레이터 엘티디 반도체 제조 장치용 부재
US11515192B2 (en) 2017-10-26 2022-11-29 Kyocera Corporation Sample holder
WO2019104040A1 (en) 2017-11-21 2019-05-31 Watlow Electric Manufacturing Company Dual-purpose vias for use in ceramic pedestals
US11456161B2 (en) * 2018-06-04 2022-09-27 Applied Materials, Inc. Substrate support pedestal
KR102188779B1 (ko) * 2018-10-15 2020-12-08 세메스 주식회사 기판 지지 장치 및 그 제조방법
US11842915B2 (en) 2019-01-24 2023-12-12 Kyocera Corporation Electrostatic chuck
CN111508883B (zh) * 2019-01-31 2024-02-13 台湾积体电路制造股份有限公司 静电吸盘及其制造方法
TWI684241B (zh) * 2019-01-31 2020-02-01 台灣積體電路製造股份有限公司 靜電吸盤及其製造方法
JP7291046B2 (ja) * 2019-09-18 2023-06-14 新光電気工業株式会社 基板固定装置
KR20210057384A (ko) * 2019-11-12 2021-05-21 주식회사 미코세라믹스 정전척
JP7521903B2 (ja) * 2020-02-21 2024-07-24 株式会社巴川コーポレーション 静電チャック装置
JP7760579B2 (ja) * 2021-03-25 2025-10-27 京セラ株式会社 静電チャック
CN115732387A (zh) * 2021-08-31 2023-03-03 Toto株式会社 静电吸盘以及处理装置
CN115732386A (zh) * 2021-08-31 2023-03-03 Toto株式会社 静电吸盘以及处理装置
JP7514817B2 (ja) * 2021-12-27 2024-07-11 日本碍子株式会社 半導体製造装置用部材
JP7734117B2 (ja) * 2022-06-30 2025-09-04 日本特殊陶業株式会社 保持装置
KR20250095635A (ko) * 2022-10-24 2025-06-26 도쿄엘렉트론가부시키가이샤 기판 지지기 및 플라즈마 처리 장치
KR102772614B1 (ko) * 2023-01-26 2025-02-26 엔지케이 인슐레이터 엘티디 웨이퍼 적재대
WO2024166181A1 (ja) * 2023-02-06 2024-08-15 日本碍子株式会社 サセプタ
JP7647781B2 (ja) * 2023-02-22 2025-03-18 Toto株式会社 静電チャック及びその製造方法
JP7480876B1 (ja) 2023-02-22 2024-05-10 Toto株式会社 静電チャック及びその製造方法
JP7409536B1 (ja) 2023-02-22 2024-01-09 Toto株式会社 静電チャック及びその製造方法
JP7647782B2 (ja) * 2023-02-22 2025-03-18 Toto株式会社 静電チャック及びその製造方法
JP7409535B1 (ja) 2023-02-22 2024-01-09 Toto株式会社 静電チャック及びその製造方法
JP7647783B2 (ja) * 2023-02-22 2025-03-18 Toto株式会社 静電チャック及びその製造方法
KR102642523B1 (ko) * 2023-06-07 2024-03-04 주식회사 미코세라믹스 서셉터 제조 방법 및 그 방법에 의해 제조된 서셉터

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5720818A (en) * 1996-04-26 1998-02-24 Applied Materials, Inc. Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck
US7479456B2 (en) * 2004-08-26 2009-01-20 Applied Materials, Inc. Gasless high voltage high contact force wafer contact-cooling electrostatic chuck
US7697260B2 (en) * 2004-03-31 2010-04-13 Applied Materials, Inc. Detachable electrostatic chuck
KR101132632B1 (ko) * 2004-12-07 2012-04-02 주성엔지니어링(주) 정전척
JP4557814B2 (ja) * 2005-06-09 2010-10-06 パナソニック株式会社 プラズマ処理装置
KR101125885B1 (ko) * 2007-07-31 2012-03-22 어플라이드 머티어리얼스, 인코포레이티드 감소된 플라즈마 침투 및 아킹을 갖는 정전척을 제공하는 방법 및 장치
JP2009123929A (ja) * 2007-11-15 2009-06-04 Tokyo Electron Ltd プラズマ処理装置
JP5331519B2 (ja) * 2008-03-11 2013-10-30 日本碍子株式会社 静電チャック
KR20090097229A (ko) * 2008-03-11 2009-09-16 전영재 반도체 및 ｌｃｄ 제조용 정전척
JP5449750B2 (ja) * 2008-11-19 2014-03-19 株式会社日本セラテック 静電チャックおよびその製造方法
JP5250408B2 (ja) 2008-12-24 2013-07-31 新光電気工業株式会社 基板温調固定装置
JP5604888B2 (ja) 2009-12-21 2014-10-15 住友大阪セメント株式会社 静電チャックの製造方法
JP6096470B2 (ja) * 2012-10-29 2017-03-15 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置

Also Published As

Publication number Publication date
US20130308244A1 (en) 2013-11-21
US9660557B2 (en) 2017-05-23
KR102048789B1 (ko) 2019-11-26
JP2013243267A (ja) 2013-12-05
KR20130129842A (ko) 2013-11-29
TWI591751B (zh) 2017-07-11
TW201409604A (zh) 2014-03-01

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