KR101132632B1 - 정전척 - Google Patents
정전척 Download PDFInfo
- Publication number
- KR101132632B1 KR101132632B1 KR1020040102281A KR20040102281A KR101132632B1 KR 101132632 B1 KR101132632 B1 KR 101132632B1 KR 1020040102281 A KR1020040102281 A KR 1020040102281A KR 20040102281 A KR20040102281 A KR 20040102281A KR 101132632 B1 KR101132632 B1 KR 101132632B1
- Authority
- KR
- South Korea
- Prior art keywords
- pipe
- electrostatic chuck
- cooling gas
- insulating
- gas
- Prior art date
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Abstract
Description
Claims (9)
- 몸체;상기 몸체 상부 표면에 형성된 냉각가스유로;상기 몸체 측면과 상부 표면과 상기 냉각가스유로 위에 형성된 세라믹 코팅막;상기 몸체를 관통하여 형성되고, 상기 냉각가스유로에 냉각가스를 공급하기 위한 냉각가스 유입관;상기 냉각가스 유입관의 내측벽에 장착되는 절연파이프; 및상기 절연파이프를 관통하는 절연봉을 포함하는 정전척.
- 제 1 항에 있어서,상기 냉각가스 유입관은 상기 몸체의 중심부를 관통하는 정전척.
- 제 1 항에 있어서,상기 절연파이프와 상기 절연봉은 세라믹 계열의 재질인 정전척.
- 제 1 항에 있어서,상기 절연파이프는 상기 냉각가스 유입관의 입구에서 출구까지 장착되는 정전척.
- 삭제
- 제 1 항에 있어서,상기 몸체의 상기 냉각가스 유입관과 상기 절연파이프는 실리콘본드에 의해 결합하는 정전척.
- 제 1 항에 있어서,상기 몸체와 상기 냉각가스 유입관과 상기 절연파이프 사이에 진공 실링 수단이 더 포함되는 정전척
- 제 1 항에 있어서,상기 절연파이프는 하부에 플랜지부를 포함하고, 상기 플랜지부와 상기 몸체와 결합하는 정전척.
- 제 1 항에 있어서,상기 절연파이프 또는 상기 절연봉의 직경을 조절하여 상기 절연파이프 및 상기 절연봉 사이의 간격을 조절하므로써상기 냉각가스 유입관으로 공급되는 냉각가스 유로의 직경을 조절하는 정전척.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040102281A KR101132632B1 (ko) | 2004-12-07 | 2004-12-07 | 정전척 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040102281A KR101132632B1 (ko) | 2004-12-07 | 2004-12-07 | 정전척 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060063182A KR20060063182A (ko) | 2006-06-12 |
KR101132632B1 true KR101132632B1 (ko) | 2012-04-02 |
Family
ID=37159229
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020040102281A KR101132632B1 (ko) | 2004-12-07 | 2004-12-07 | 정전척 |
Country Status (1)
Country | Link |
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KR (1) | KR101132632B1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021221728A1 (en) * | 2020-04-30 | 2021-11-04 | Applied Materials, Inc. | Cooled substrate support assembly for radio frequency environments |
US11241769B2 (en) | 2014-10-30 | 2022-02-08 | Applied Materials, Inc. | Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes |
KR102635658B1 (ko) | 2023-08-14 | 2024-02-13 | 주식회사 제스코 | 아킹 방지 기능이 향상된 정전척 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5984504B2 (ja) * | 2012-05-21 | 2016-09-06 | 新光電気工業株式会社 | 静電チャック、静電チャックの製造方法 |
US20220028719A1 (en) * | 2018-11-30 | 2022-01-27 | Kyocera Corporation | Sample holder |
KR20230006574A (ko) | 2020-05-11 | 2023-01-10 | 엔테그리스, 아이엔씨. | 가스 유동 특징부를 갖는 정전기 척, 및 관련 방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0982683A (ja) * | 1995-09-12 | 1997-03-28 | Toshiba Corp | ドライエッチング装置 |
JP2001160586A (ja) | 2000-09-11 | 2001-06-12 | Hitachi Ltd | 基板保持装置 |
KR20030021012A (ko) * | 2001-09-05 | 2003-03-12 | 주성엔지니어링(주) | 아크 방지용 정전척 |
JP2004031665A (ja) | 2002-06-26 | 2004-01-29 | Ngk Spark Plug Co Ltd | 静電チャック |
-
2004
- 2004-12-07 KR KR1020040102281A patent/KR101132632B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0982683A (ja) * | 1995-09-12 | 1997-03-28 | Toshiba Corp | ドライエッチング装置 |
JP2001160586A (ja) | 2000-09-11 | 2001-06-12 | Hitachi Ltd | 基板保持装置 |
KR20030021012A (ko) * | 2001-09-05 | 2003-03-12 | 주성엔지니어링(주) | 아크 방지용 정전척 |
JP2004031665A (ja) | 2002-06-26 | 2004-01-29 | Ngk Spark Plug Co Ltd | 静電チャック |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11241769B2 (en) | 2014-10-30 | 2022-02-08 | Applied Materials, Inc. | Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes |
WO2021221728A1 (en) * | 2020-04-30 | 2021-11-04 | Applied Materials, Inc. | Cooled substrate support assembly for radio frequency environments |
KR102635658B1 (ko) | 2023-08-14 | 2024-02-13 | 주식회사 제스코 | 아킹 방지 기능이 향상된 정전척 |
Also Published As
Publication number | Publication date |
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KR20060063182A (ko) | 2006-06-12 |
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