TWI591751B - 靜電夾頭及製造靜電夾頭之方法 - Google Patents
靜電夾頭及製造靜電夾頭之方法 Download PDFInfo
- Publication number
- TWI591751B TWI591751B TW102116978A TW102116978A TWI591751B TW I591751 B TWI591751 B TW I591751B TW 102116978 A TW102116978 A TW 102116978A TW 102116978 A TW102116978 A TW 102116978A TW I591751 B TWI591751 B TW I591751B
- Authority
- TW
- Taiwan
- Prior art keywords
- gas passage
- insulating
- hole portion
- hole
- electrostatic chuck
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000000034 method Methods 0.000 title claims description 11
- 239000000758 substrate Substances 0.000 claims description 85
- 238000010438 heat treatment Methods 0.000 claims description 79
- 238000009413 insulation Methods 0.000 claims description 17
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 17
- 239000011810 insulating material Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 239000007789 gas Substances 0.000 description 138
- 239000000919 ceramic Substances 0.000 description 66
- 229920002050 silicone resin Polymers 0.000 description 32
- 230000002159 abnormal effect Effects 0.000 description 29
- 229910052782 aluminium Inorganic materials 0.000 description 23
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 23
- 230000000052 comparative effect Effects 0.000 description 16
- 239000000112 cooling gas Substances 0.000 description 16
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000011800 void material Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012116035A JP5984504B2 (ja) | 2012-05-21 | 2012-05-21 | 静電チャック、静電チャックの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201409604A TW201409604A (zh) | 2014-03-01 |
| TWI591751B true TWI591751B (zh) | 2017-07-11 |
Family
ID=49581114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102116978A TWI591751B (zh) | 2012-05-21 | 2013-05-14 | 靜電夾頭及製造靜電夾頭之方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9660557B2 (enExample) |
| JP (1) | JP5984504B2 (enExample) |
| KR (1) | KR102048789B1 (enExample) |
| TW (1) | TWI591751B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI766038B (zh) * | 2017-06-13 | 2022-06-01 | 日商日本碍子股份有限公司 | 半導體製造裝置用構件 |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5811513B2 (ja) * | 2014-03-27 | 2015-11-11 | Toto株式会社 | 静電チャック |
| JP6658509B2 (ja) * | 2015-02-18 | 2020-03-04 | 住友大阪セメント株式会社 | 静電チャック装置及び半導体製造装置 |
| US11515192B2 (en) | 2017-10-26 | 2022-11-29 | Kyocera Corporation | Sample holder |
| WO2019104040A1 (en) | 2017-11-21 | 2019-05-31 | Watlow Electric Manufacturing Company | Dual-purpose vias for use in ceramic pedestals |
| US11456161B2 (en) * | 2018-06-04 | 2022-09-27 | Applied Materials, Inc. | Substrate support pedestal |
| KR102188779B1 (ko) * | 2018-10-15 | 2020-12-08 | 세메스 주식회사 | 기판 지지 장치 및 그 제조방법 |
| US11842915B2 (en) | 2019-01-24 | 2023-12-12 | Kyocera Corporation | Electrostatic chuck |
| CN111508883B (zh) * | 2019-01-31 | 2024-02-13 | 台湾积体电路制造股份有限公司 | 静电吸盘及其制造方法 |
| TWI684241B (zh) * | 2019-01-31 | 2020-02-01 | 台灣積體電路製造股份有限公司 | 靜電吸盤及其製造方法 |
| JP7291046B2 (ja) * | 2019-09-18 | 2023-06-14 | 新光電気工業株式会社 | 基板固定装置 |
| KR20210057384A (ko) * | 2019-11-12 | 2021-05-21 | 주식회사 미코세라믹스 | 정전척 |
| JP7521903B2 (ja) * | 2020-02-21 | 2024-07-24 | 株式会社巴川コーポレーション | 静電チャック装置 |
| JP7760579B2 (ja) * | 2021-03-25 | 2025-10-27 | 京セラ株式会社 | 静電チャック |
| CN115732387A (zh) * | 2021-08-31 | 2023-03-03 | Toto株式会社 | 静电吸盘以及处理装置 |
| CN115732386A (zh) * | 2021-08-31 | 2023-03-03 | Toto株式会社 | 静电吸盘以及处理装置 |
| JP7514817B2 (ja) * | 2021-12-27 | 2024-07-11 | 日本碍子株式会社 | 半導体製造装置用部材 |
| JP7734117B2 (ja) * | 2022-06-30 | 2025-09-04 | 日本特殊陶業株式会社 | 保持装置 |
| KR20250095635A (ko) * | 2022-10-24 | 2025-06-26 | 도쿄엘렉트론가부시키가이샤 | 기판 지지기 및 플라즈마 처리 장치 |
| KR102772614B1 (ko) * | 2023-01-26 | 2025-02-26 | 엔지케이 인슐레이터 엘티디 | 웨이퍼 적재대 |
| WO2024166181A1 (ja) * | 2023-02-06 | 2024-08-15 | 日本碍子株式会社 | サセプタ |
| JP7647781B2 (ja) * | 2023-02-22 | 2025-03-18 | Toto株式会社 | 静電チャック及びその製造方法 |
| JP7480876B1 (ja) | 2023-02-22 | 2024-05-10 | Toto株式会社 | 静電チャック及びその製造方法 |
| JP7409536B1 (ja) | 2023-02-22 | 2024-01-09 | Toto株式会社 | 静電チャック及びその製造方法 |
| JP7647782B2 (ja) * | 2023-02-22 | 2025-03-18 | Toto株式会社 | 静電チャック及びその製造方法 |
| JP7409535B1 (ja) | 2023-02-22 | 2024-01-09 | Toto株式会社 | 静電チャック及びその製造方法 |
| JP7647783B2 (ja) * | 2023-02-22 | 2025-03-18 | Toto株式会社 | 静電チャック及びその製造方法 |
| KR102642523B1 (ko) * | 2023-06-07 | 2024-03-04 | 주식회사 미코세라믹스 | 서셉터 제조 방법 및 그 방법에 의해 제조된 서셉터 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5720818A (en) * | 1996-04-26 | 1998-02-24 | Applied Materials, Inc. | Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck |
| US7479456B2 (en) * | 2004-08-26 | 2009-01-20 | Applied Materials, Inc. | Gasless high voltage high contact force wafer contact-cooling electrostatic chuck |
| US7697260B2 (en) * | 2004-03-31 | 2010-04-13 | Applied Materials, Inc. | Detachable electrostatic chuck |
| KR101132632B1 (ko) * | 2004-12-07 | 2012-04-02 | 주성엔지니어링(주) | 정전척 |
| JP4557814B2 (ja) * | 2005-06-09 | 2010-10-06 | パナソニック株式会社 | プラズマ処理装置 |
| KR101125885B1 (ko) * | 2007-07-31 | 2012-03-22 | 어플라이드 머티어리얼스, 인코포레이티드 | 감소된 플라즈마 침투 및 아킹을 갖는 정전척을 제공하는 방법 및 장치 |
| JP2009123929A (ja) * | 2007-11-15 | 2009-06-04 | Tokyo Electron Ltd | プラズマ処理装置 |
| JP5331519B2 (ja) * | 2008-03-11 | 2013-10-30 | 日本碍子株式会社 | 静電チャック |
| KR20090097229A (ko) * | 2008-03-11 | 2009-09-16 | 전영재 | 반도체 및 ｌｃｄ 제조용 정전척 |
| JP5449750B2 (ja) * | 2008-11-19 | 2014-03-19 | 株式会社日本セラテック | 静電チャックおよびその製造方法 |
| JP5250408B2 (ja) | 2008-12-24 | 2013-07-31 | 新光電気工業株式会社 | 基板温調固定装置 |
| JP5604888B2 (ja) | 2009-12-21 | 2014-10-15 | 住友大阪セメント株式会社 | 静電チャックの製造方法 |
| JP6096470B2 (ja) * | 2012-10-29 | 2017-03-15 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
-
2012
- 2012-05-21 JP JP2012116035A patent/JP5984504B2/ja active Active
-
2013
- 2013-05-09 US US13/890,566 patent/US9660557B2/en active Active
- 2013-05-14 TW TW102116978A patent/TWI591751B/zh active
- 2013-05-16 KR KR1020130055479A patent/KR102048789B1/ko active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI766038B (zh) * | 2017-06-13 | 2022-06-01 | 日商日本碍子股份有限公司 | 半導體製造裝置用構件 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20130308244A1 (en) | 2013-11-21 |
| US9660557B2 (en) | 2017-05-23 |
| KR102048789B1 (ko) | 2019-11-26 |
| JP5984504B2 (ja) | 2016-09-06 |
| JP2013243267A (ja) | 2013-12-05 |
| KR20130129842A (ko) | 2013-11-29 |
| TW201409604A (zh) | 2014-03-01 |
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