JP7291046B2 - 基板固定装置 - Google Patents
基板固定装置 Download PDFInfo
- Publication number
- JP7291046B2 JP7291046B2 JP2019169649A JP2019169649A JP7291046B2 JP 7291046 B2 JP7291046 B2 JP 7291046B2 JP 2019169649 A JP2019169649 A JP 2019169649A JP 2019169649 A JP2019169649 A JP 2019169649A JP 7291046 B2 JP7291046 B2 JP 7291046B2
- Authority
- JP
- Japan
- Prior art keywords
- recess
- hole
- fixing device
- substrate fixing
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Description
図3及び図4は、本実施形態に係る基板固定装置の製造工程を例示する図であり、図1(b)に対応する断面を示している。ここでは、図3及び図4を参照しながら、静電チャック30にガス孔33を形成する工程等を中心に説明する。
10 ベースプレート
10a 上面
10b 下面
11 ガス供給部
15 冷却機構
20 接着層
30 静電チャック
31 基体
31a 載置面
32 静電電極
33 ガス孔
33s 未充填領域
60 多孔質体
111 ガス流路
112 ガス注入部
113 ガス排出部
151 冷媒流路
152 冷媒導入部
153 冷媒排出部
331、332 凹部
331a、332a 底面
333、335 貫通孔
333a 端面
601 球状酸化物セラミックス粒子
602 混合酸化物
Claims (8)
- 内部にガス供給部を備えたベースプレートと、前記ベースプレート上に設けられた静電チャックと、を有し、
前記静電チャックは、一方の面が吸着対象物の載置面である基体と、前記基体を貫通するガス孔と、を備え、
前記ガス孔を介して、前記ガス供給部から前記載置面にガスが供給される基板固定装置であって、
前記ガス孔は、前記基体の前記載置面の反対面から前記載置面側に窪む第1凹部と、前記第1凹部の底面から更に前記載置面側に窪む第2凹部と、前記第2凹部の底面から前記載置面に貫通する貫通孔と、を有し、
前記第1凹部内の全領域、及び前記第2凹部内の未充填領域を除く領域に、多孔質体が充填され、
前記未充填領域は、前記第2凹部の底面の前記貫通孔と連通する位置から前記反対面側に窪む凹部であり、前記凹部は前記貫通孔と連通する空間である基板固定装置。 - 平面視において、前記第2凹部の大きさは前記第1凹部の大きさよりも小さく、前記貫通孔の大きさは前記第2凹部の大きさよりも更に小さい請求項1に記載の基板固定装置。
- 前記第2凹部の深さは、50μm以上500μm以下である請求項1又は2に記載の基板固定装置。
- 前記多孔質体は、連通する複数の気孔を備え、
前記連通する複数の気孔を介して、前記ガスが供給される請求項1乃至3の何れか一項に記載の基板固定装置。 - 前記基体と前記多孔質体は、同一の酸化物セラミックスを含む請求項1乃至4の何れか一項に記載の基板固定装置。
- 前記酸化物セラミックスは、酸化アルミニウムである請求項5に記載の基板固定装置。
- 前記基体と前記多孔質体は、同一の2種以上の元素の酸化物を含み、
前記基体内の前記酸化物の組成比は、前記多孔質体の内の前記酸化物の組成比と同じに設定されている請求項1乃至6の何れか一項に記載の基板固定装置。 - 前記2種以上の元素は、ケイ素、マグネシウム、カルシウム、及びイットリウムから選択される請求項7に記載の基板固定装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019169649A JP7291046B2 (ja) | 2019-09-18 | 2019-09-18 | 基板固定装置 |
US17/010,149 US20210082731A1 (en) | 2019-09-18 | 2020-09-02 | Substrate fixing device and electrostatic chuck |
KR1020200116594A KR20210033420A (ko) | 2019-09-18 | 2020-09-11 | 기판 고정 장치 및 정전 척 |
CN202010959801.6A CN112530778A (zh) | 2019-09-18 | 2020-09-14 | 基板固定装置 |
TW109131660A TWI849222B (zh) | 2019-09-18 | 2020-09-15 | 基板固定裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019169649A JP7291046B2 (ja) | 2019-09-18 | 2019-09-18 | 基板固定装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021048243A JP2021048243A (ja) | 2021-03-25 |
JP7291046B2 true JP7291046B2 (ja) | 2023-06-14 |
Family
ID=74869759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019169649A Active JP7291046B2 (ja) | 2019-09-18 | 2019-09-18 | 基板固定装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20210082731A1 (ja) |
JP (1) | JP7291046B2 (ja) |
KR (1) | KR20210033420A (ja) |
CN (1) | CN112530778A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024079880A1 (ja) * | 2022-10-14 | 2024-04-18 | 日本碍子株式会社 | ウエハ載置台 |
WO2024166181A1 (ja) * | 2023-02-06 | 2024-08-15 | 日本碍子株式会社 | サセプタ |
JP7547537B1 (ja) | 2023-03-27 | 2024-09-09 | 日本特殊陶業株式会社 | 保持装置 |
JP7551888B1 (ja) | 2023-11-14 | 2024-09-17 | 日本特殊陶業株式会社 | 保持装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6490145B1 (en) | 2001-07-18 | 2002-12-03 | Applied Materials, Inc. | Substrate support pedestal |
JP2013232641A (ja) | 2012-04-27 | 2013-11-14 | Ngk Insulators Ltd | 半導体製造装置用部材 |
JP2013243267A (ja) | 2012-05-21 | 2013-12-05 | Shinko Electric Ind Co Ltd | 静電チャック、静電チャックの製造方法 |
JP2014209615A (ja) | 2013-03-29 | 2014-11-06 | Toto株式会社 | 静電チャック |
JP2019519927A (ja) | 2016-06-07 | 2019-07-11 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | ガス孔に開口縮小プラグを有する大電力静電チャック |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5720818A (en) * | 1996-04-26 | 1998-02-24 | Applied Materials, Inc. | Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck |
CN101371341B (zh) * | 2006-01-20 | 2010-08-18 | 东京毅力科创株式会社 | 等离子处理装置 |
JP6722518B2 (ja) * | 2016-06-09 | 2020-07-15 | 新光電気工業株式会社 | 焼結体及びその製造方法と静電チャック |
US10741425B2 (en) * | 2017-02-22 | 2020-08-11 | Lam Research Corporation | Helium plug design to reduce arcing |
US10688750B2 (en) * | 2017-10-03 | 2020-06-23 | Applied Materials, Inc. | Bonding structure of E chuck to aluminum base configuration |
US11626310B2 (en) * | 2018-10-30 | 2023-04-11 | Toto Ltd. | Electrostatic chuck |
CN111668150B (zh) * | 2019-03-05 | 2024-06-28 | Toto株式会社 | 静电吸盘及处理装置 |
-
2019
- 2019-09-18 JP JP2019169649A patent/JP7291046B2/ja active Active
-
2020
- 2020-09-02 US US17/010,149 patent/US20210082731A1/en active Pending
- 2020-09-11 KR KR1020200116594A patent/KR20210033420A/ko active Search and Examination
- 2020-09-14 CN CN202010959801.6A patent/CN112530778A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6490145B1 (en) | 2001-07-18 | 2002-12-03 | Applied Materials, Inc. | Substrate support pedestal |
JP2013232641A (ja) | 2012-04-27 | 2013-11-14 | Ngk Insulators Ltd | 半導体製造装置用部材 |
JP2013243267A (ja) | 2012-05-21 | 2013-12-05 | Shinko Electric Ind Co Ltd | 静電チャック、静電チャックの製造方法 |
JP2014209615A (ja) | 2013-03-29 | 2014-11-06 | Toto株式会社 | 静電チャック |
JP2019519927A (ja) | 2016-06-07 | 2019-07-11 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | ガス孔に開口縮小プラグを有する大電力静電チャック |
Also Published As
Publication number | Publication date |
---|---|
CN112530778A (zh) | 2021-03-19 |
JP2021048243A (ja) | 2021-03-25 |
TW202114046A (zh) | 2021-04-01 |
KR20210033420A (ko) | 2021-03-26 |
US20210082731A1 (en) | 2021-03-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7291046B2 (ja) | 基板固定装置 | |
JP4929150B2 (ja) | 静電チャック及び基板温調固定装置 | |
JP7296869B2 (ja) | 静電チャック、基板固定装置 | |
KR102663604B1 (ko) | 세라믹 혼합물 페이스트, 다공질체 및 그 제조 방법, 정전척 및 그 제조 방법, 기판 고정 장치 | |
US20230030510A1 (en) | Electrostatic chuck and substrate fixing device | |
JP7449768B2 (ja) | セラミックス基板及びその製造方法、静電チャック、基板固定装置、半導体装置用パッケージ | |
JP2023021622A (ja) | 静電チャック、基板固定装置 | |
CN118077045A (zh) | 保持装置 | |
JP4540407B2 (ja) | 静電チャック | |
TW202105593A (zh) | 靜電夾盤及基板固定裝置 | |
JP5268476B2 (ja) | 静電チャック | |
JP2020145281A (ja) | 静電チャック | |
KR20220086487A (ko) | 정전 척 및 기판 고정 장치 | |
JP5785862B2 (ja) | 静電チャック及びその製造方法、基板温調固定装置 | |
TWI849222B (zh) | 基板固定裝置 | |
JP2020025072A (ja) | 静電チャック | |
JP2014072356A (ja) | 静電チャック | |
JP2023141972A (ja) | セラミックス基板及びその製造方法、静電チャック、基板固定装置、半導体装置用パッケージ | |
JP2023170413A (ja) | セラミックス基板及びその製造方法、静電チャック、基板固定装置、半導体装置用パッケージ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220608 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20230424 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230516 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230602 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7291046 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |