JP5926322B2 - 被覆銅粒子及びその製造方法 - Google Patents

被覆銅粒子及びその製造方法 Download PDF

Info

Publication number
JP5926322B2
JP5926322B2 JP2014112794A JP2014112794A JP5926322B2 JP 5926322 B2 JP5926322 B2 JP 5926322B2 JP 2014112794 A JP2014112794 A JP 2014112794A JP 2014112794 A JP2014112794 A JP 2014112794A JP 5926322 B2 JP5926322 B2 JP 5926322B2
Authority
JP
Japan
Prior art keywords
copper
copper particles
reaction
coated copper
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014112794A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015227476A5 (https=
JP2015227476A (ja
Inventor
邦宏 福本
邦宏 福本
優 小山
優 小山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyoritsu Chemical and Co Ltd
Original Assignee
Kyoritsu Chemical and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2014112794A priority Critical patent/JP5926322B2/ja
Application filed by Kyoritsu Chemical and Co Ltd filed Critical Kyoritsu Chemical and Co Ltd
Priority to KR1020167034561A priority patent/KR101743897B1/ko
Priority to KR1020167027210A priority patent/KR101709458B1/ko
Priority to EP15799589.5A priority patent/EP3150306B1/en
Priority to CN201711328045.1A priority patent/CN108161027B/zh
Priority to CN201580028643.XA priority patent/CN106457407B/zh
Priority to PCT/JP2015/063880 priority patent/WO2015182395A1/ja
Priority to US15/307,227 priority patent/US9744595B2/en
Priority to TW104116484A priority patent/TWI638769B/zh
Publication of JP2015227476A publication Critical patent/JP2015227476A/ja
Publication of JP2015227476A5 publication Critical patent/JP2015227476A5/ja
Application granted granted Critical
Publication of JP5926322B2 publication Critical patent/JP5926322B2/ja
Priority to US15/685,729 priority patent/US20180036805A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
    • B22F9/305—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis of metal carbonyls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/10—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30—Hydrogen technology
    • Y02E60/32—Hydrogen storage

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
JP2014112794A 2014-05-30 2014-05-30 被覆銅粒子及びその製造方法 Active JP5926322B2 (ja)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP2014112794A JP5926322B2 (ja) 2014-05-30 2014-05-30 被覆銅粒子及びその製造方法
US15/307,227 US9744595B2 (en) 2014-05-30 2015-05-14 Coated copper particles and method for producing the same
EP15799589.5A EP3150306B1 (en) 2014-05-30 2015-05-14 Coated copper particles and method for manufacturing same
CN201711328045.1A CN108161027B (zh) 2014-05-30 2015-05-14 被覆铜颗粒
CN201580028643.XA CN106457407B (zh) 2014-05-30 2015-05-14 被覆铜颗粒的制造方法
PCT/JP2015/063880 WO2015182395A1 (ja) 2014-05-30 2015-05-14 被覆銅粒子及びその製造方法
KR1020167034561A KR101743897B1 (ko) 2014-05-30 2015-05-14 피복 구리 입자 및 그 제조 방법
KR1020167027210A KR101709458B1 (ko) 2014-05-30 2015-05-14 피복 구리 입자 및 그 제조 방법
TW104116484A TWI638769B (zh) 2014-05-30 2015-05-22 被覆銅粒子及其製造方法
US15/685,729 US20180036805A1 (en) 2014-05-30 2017-08-24 Coated copper particles and method for producing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014112794A JP5926322B2 (ja) 2014-05-30 2014-05-30 被覆銅粒子及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016084911A Division JP6033485B2 (ja) 2016-04-21 2016-04-21 被覆銅粒子

Publications (3)

Publication Number Publication Date
JP2015227476A JP2015227476A (ja) 2015-12-17
JP2015227476A5 JP2015227476A5 (https=) 2016-02-18
JP5926322B2 true JP5926322B2 (ja) 2016-05-25

Family

ID=54698732

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014112794A Active JP5926322B2 (ja) 2014-05-30 2014-05-30 被覆銅粒子及びその製造方法

Country Status (7)

Country Link
US (2) US9744595B2 (https=)
EP (1) EP3150306B1 (https=)
JP (1) JP5926322B2 (https=)
KR (2) KR101743897B1 (https=)
CN (2) CN106457407B (https=)
TW (1) TWI638769B (https=)
WO (1) WO2015182395A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3117596B2 (ja) 1993-12-29 2000-12-18 オルガノ株式会社 ３分子以上の単糖類分子がグリコシド結合してなる糖類の製造方法

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6715450B2 (ja) * 2016-01-13 2020-07-01 小林　博 金属ないしは金属酸化物からなる個々のナノ粒子が、液体の有機化合物に囲まれて該有機化合物中に分散した懸濁体を製造する製造方法
JP6979150B2 (ja) 2016-03-28 2021-12-08 協立化学産業株式会社 被覆銀粒子とその製造方法、導電性組成物、および導電体
JP7251470B2 (ja) * 2017-03-15 2023-04-04 株式会社レゾナック 接合用金属ペースト、接合体及びその製造方法、並びに半導体装置及びその製造方法
SG11201908356WA (en) * 2017-03-15 2019-10-30 Hitachi Chemical Co Ltd Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
JP6976597B2 (ja) * 2017-04-14 2021-12-08 学校法人 関西大学 銅粒子混合物及びその製造方法、銅粒子混合物分散液、銅粒子混合物含有インク、銅粒子混合物の保存方法及び銅粒子混合物の焼結方法
WO2019093121A1 (ja) * 2017-11-13 2019-05-16 京セラ株式会社 ペースト組成物、半導体装置及び電気・電子部品
WO2019106739A1 (ja) * 2017-11-29 2019-06-06 国立大学法人北海道大学 低温焼結性銅粒子とそれを用いた焼結体の製造方法
KR102514945B1 (ko) * 2018-01-26 2023-03-27 닛신 엔지니어링 가부시키가이샤 구리 미립자
JP7282691B2 (ja) * 2018-01-26 2023-05-29 日清エンジニアリング株式会社 微粒子の製造方法
JP7139258B2 (ja) * 2019-01-22 2022-09-20 大陽日酸株式会社 銅微粒子、導電性材料、銅微粒子の製造方法
CN109655521A (zh) * 2019-01-28 2019-04-19 中国地质科学院水文地质环境地质研究所 基于加速器质谱技术的14c的快速测量方法
EP3950175B1 (en) * 2019-03-29 2025-06-04 Mitsui Mining & Smelting Co., Ltd. Bonding material and uses therof
JP7269565B2 (ja) * 2019-03-29 2023-05-09 学校法人 関西大学 導電性インキ組成物及び導電性積層体
JP7244919B2 (ja) * 2019-08-27 2023-03-23 協立化学産業株式会社 被覆銅ナノ粒子含有組成物、及び物品
CN115461173A (zh) * 2020-08-28 2022-12-09 国立大学法人北海道大学 含氧化物的铜微粒及其制造方法、以及使用该含氧化物的铜微粒的烧结体的制造方法
CN116329539B (zh) * 2023-03-03 2024-05-28 嘉庚创新实验室 铜复合材料及其制备方法、铜导电浆料和铜膜
CN118136337B (zh) * 2024-04-01 2025-06-20 合肥工业大学 一种高收缩率铜导电薄膜的制备方法及其材料
WO2026071000A1 (ja) * 2024-09-27 2026-04-02 昭栄化学工業株式会社 金属粉末の製造方法及び金属粉末
CN119747963A (zh) * 2024-11-20 2025-04-04 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) 一种基于热分解铜盐的自还原铜膏及其制备方法和应用

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2702796B2 (ja) * 1990-02-23 1998-01-26 旭化成工業株式会社 銀合金導電性ペースト
JPH08143916A (ja) 1994-11-24 1996-06-04 Nok Corp 鉄微粒子の製造方法
US6951666B2 (en) * 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
JP3900414B2 (ja) 2002-02-18 2007-04-04 富士フイルム株式会社 ナノ粒子およびナノ粒子の製造方法、並びに、磁気記録媒体
JP4449484B2 (ja) * 2003-02-18 2010-04-14 東レ株式会社 導電性ペーストおよびそれを用いたプラズマディスプレイパネル用部材の製造方法
JP4431085B2 (ja) 2004-06-24 2010-03-10 シャープ株式会社 導電性インキ組成物、反射部材、回路基板、電子装置
JP5205717B2 (ja) * 2006-07-04 2013-06-05 セイコーエプソン株式会社 ギ酸銅錯体、銅粒子の製造方法および配線基板の製造方法
JP2008019461A (ja) * 2006-07-11 2008-01-31 Fujifilm Corp 金属ナノ粒子の製造方法、金属ナノ粒子及び金属ナノ粒子分散物
JP5045015B2 (ja) 2006-07-28 2012-10-10 セイコーエプソン株式会社 ギ酸銅の製造方法、銅粒子の製造方法および配線基板の製造方法
JP4961587B2 (ja) * 2006-10-03 2012-06-27 トヨタ自動車株式会社 銅微粒子、銅微粒子製造方法、絶縁材料、配線構造、配線回路板の製造方法、及び電子・電気機器
JP2008205430A (ja) * 2007-01-26 2008-09-04 Konica Minolta Holdings Inc 金属パターン形成方法及び金属塩混合物
JP2009082828A (ja) * 2007-09-28 2009-04-23 Fujifilm Corp 逆ミセル液、無機ナノ粒子及び無機ナノ粒子の製造方法
JP2009158441A (ja) 2007-12-28 2009-07-16 Namics Corp 導電性ペースト及びそれを用いた銅膜の形成方法
JP5003668B2 (ja) * 2008-12-18 2012-08-15 住友金属鉱山株式会社 酸化物被覆銅微粒子の製造方法
JP5441550B2 (ja) * 2009-07-30 2014-03-12 Ｄｏｗａエレクトロニクス株式会社 金属ナノ粒子分散液
JP5426270B2 (ja) * 2009-08-04 2014-02-26 ハリマ化成株式会社 金属銅微粒子の製造方法
JP5759688B2 (ja) 2010-08-17 2015-08-05 三井金属鉱業株式会社 扁平銅粒子
JPWO2012053456A1 (ja) 2010-10-21 2014-02-24 旭硝子株式会社 水素化銅微粒子分散液の製造方法、導電インクおよび導体付き基材の製造方法
JP5342597B2 (ja) * 2011-04-15 2013-11-13 福田金属箔粉工業株式会社 銅超微粒子分散ペーストおよび導電膜の形成方法
CN102220046A (zh) * 2011-06-01 2011-10-19 上海大学 纳米锡包铜导电墨水的制备方法
JP5848552B2 (ja) * 2011-08-29 2016-01-27 日立金属株式会社 銅微粒子分散液の製造方法、銅微粒子の製造方法、銅微粒子分散液および銅微粒子
KR20150006091A (ko) 2012-02-29 2015-01-15 이슘 리서치 디벨롭먼트 컴퍼니 오브 더 히브루 유니버시티 오브 예루살렘, 엘티디. 금속 전구체 나노입자들을 함유한 잉크
JP2014001443A (ja) * 2012-06-21 2014-01-09 Kyoritsu Kagaku Sangyo Kk 酸化物被覆銅微粒子及びその製造方法
JP2014201618A (ja) * 2013-04-02 2014-10-27 旭硝子株式会社 金属微粒子分散液からなる導電インク、導体付き基材
US10214656B2 (en) * 2014-02-27 2019-02-26 A School Corporation Kansai University Copper nanoparticles and production method for same, copper nanoparticle fluid dispersion, copper nanoink, copper nanoparticle preservation method, and copper nanoparticle sintering method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3117596B2 (ja) 1993-12-29 2000-12-18 オルガノ株式会社 ３分子以上の単糖類分子がグリコシド結合してなる糖類の製造方法

Also Published As

Publication number Publication date
US9744595B2 (en) 2017-08-29
TWI638769B (zh) 2018-10-21
TW201601993A (zh) 2016-01-16
CN108161027A (zh) 2018-06-15
EP3150306B1 (en) 2019-01-30
CN106457407A (zh) 2017-02-22
CN106457407B (zh) 2017-12-05
JP2015227476A (ja) 2015-12-17
KR20160145207A (ko) 2016-12-19
WO2015182395A1 (ja) 2015-12-03
KR20160120786A (ko) 2016-10-18
US20180036805A1 (en) 2018-02-08
EP3150306A1 (en) 2017-04-05
KR101709458B1 (ko) 2017-02-22
EP3150306A4 (en) 2018-01-17
US20170043404A1 (en) 2017-02-16
CN108161027B (zh) 2019-01-08
KR101743897B1 (ko) 2017-06-05

Similar Documents

Publication Publication Date Title
JP5926322B2 (ja) 被覆銅粒子及びその製造方法
JP6033485B2 (ja) 被覆銅粒子
JP6368925B2 (ja) 被覆銅粒子及びその製造方法
US9490044B2 (en) Coated metal fine particle and manufacturing method thereof
JP5623861B2 (ja) 金属ナノ粒子分散組成物
JP2014001443A (ja) 酸化物被覆銅微粒子及びその製造方法
JP6979150B2 (ja) 被覆銀粒子とその製造方法、導電性組成物、および導電体
JP5426270B2 (ja) 金属銅微粒子の製造方法
JP5274000B2 (ja) 低温焼結性銀微粉および銀塗料ならびにそれらの製造法
JP4897624B2 (ja) 低温焼結性銀微粉および銀塗料ならびにそれらの製造法
JP6209249B2 (ja) 酸化物被覆銅微粒子の製造方法
JP5232016B2 (ja) 配線形成用材料
WO2016080544A1 (ja) 金属表面の処理方法並びに当該方法により処理された銀被着銅及び複合金属体
WO2013031670A1 (ja) 分散剤及び分散性金属ナノ粒子組成物
JP2013043157A (ja) 分散剤及び分散性金属ナノ粒子組成物
JP2013043160A (ja) 分散剤及び分散性金属ナノ粒子組成物
JP2012087398A (ja) 金微粒子の製造方法
TWI707052B (zh) 印刷用導電性糊劑及其調製方法與銀奈米粒子分散液之調製方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151218

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20151218

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20151218

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20160119

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160308

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160315

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160405

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160421

R150 Certificate of patent or registration of utility model

Ref document number: 5926322

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250