JP5912403B2 - 塗布処理装置 - Google Patents

塗布処理装置 Download PDF

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Publication number
JP5912403B2
JP5912403B2 JP2011231654A JP2011231654A JP5912403B2 JP 5912403 B2 JP5912403 B2 JP 5912403B2 JP 2011231654 A JP2011231654 A JP 2011231654A JP 2011231654 A JP2011231654 A JP 2011231654A JP 5912403 B2 JP5912403 B2 JP 5912403B2
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JP
Japan
Prior art keywords
substrate
nozzle
unit
substrate transport
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011231654A
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English (en)
Japanese (ja)
Other versions
JP2013089900A (ja
Inventor
義広 川口
義広 川口
光広 坂井
光広 坂井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2011231654A priority Critical patent/JP5912403B2/ja
Priority to TW101137970A priority patent/TWI546127B/zh
Priority to CN2012103938467A priority patent/CN103056067A/zh
Priority to KR1020120116530A priority patent/KR101891349B1/ko
Publication of JP2013089900A publication Critical patent/JP2013089900A/ja
Application granted granted Critical
Publication of JP5912403B2 publication Critical patent/JP5912403B2/ja
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G03F7/2043—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means with the production of a chemical active agent from a fluid, e.g. an etching agent; with meterial deposition from the fluid phase, e.g. contamination resists

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2011231654A 2011-10-21 2011-10-21 塗布処理装置 Active JP5912403B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011231654A JP5912403B2 (ja) 2011-10-21 2011-10-21 塗布処理装置
TW101137970A TWI546127B (zh) 2011-10-21 2012-10-15 Coating treatment device
CN2012103938467A CN103056067A (zh) 2011-10-21 2012-10-17 涂布处理装置
KR1020120116530A KR101891349B1 (ko) 2011-10-21 2012-10-19 도포 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011231654A JP5912403B2 (ja) 2011-10-21 2011-10-21 塗布処理装置

Publications (2)

Publication Number Publication Date
JP2013089900A JP2013089900A (ja) 2013-05-13
JP5912403B2 true JP5912403B2 (ja) 2016-04-27

Family

ID=48099131

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011231654A Active JP5912403B2 (ja) 2011-10-21 2011-10-21 塗布処理装置

Country Status (4)

Country Link
JP (1) JP5912403B2 (zh)
KR (1) KR101891349B1 (zh)
CN (1) CN103056067A (zh)
TW (1) TWI546127B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106516741B (zh) * 2016-11-04 2018-01-02 深圳市龙锋泰自动化有限公司 用于全自动玻璃在线覆膜机的送料系统
JP6845056B2 (ja) * 2017-03-21 2021-03-17 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置および塗布方法
JP6655689B1 (ja) * 2018-09-21 2020-02-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6861198B2 (ja) * 2018-12-12 2021-04-21 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および塗布装置
TWI745822B (zh) * 2019-12-31 2021-11-11 萬潤科技股份有限公司 壓合設備、壓合設備的輸送方法、輸送裝置及搬送機構

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60169148A (ja) * 1984-02-13 1985-09-02 Dainippon Screen Mfg Co Ltd 基板の搬送方法及びその装置
JP4130971B2 (ja) * 2004-03-05 2008-08-13 東京エレクトロン株式会社 塗布膜形成装置および塗布膜形成方法
JP4386430B2 (ja) * 2004-04-07 2009-12-16 東京エレクトロン株式会社 塗布膜形成装置
JP4972504B2 (ja) * 2007-09-12 2012-07-11 大日本スクリーン製造株式会社 塗布装置
JP2009165942A (ja) * 2008-01-15 2009-07-30 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP5244446B2 (ja) * 2008-04-24 2013-07-24 東京応化工業株式会社 塗布装置
JP2010087343A (ja) * 2008-10-01 2010-04-15 Toray Eng Co Ltd 基板処理装置及び基板載置方法
JP2010232472A (ja) * 2009-03-27 2010-10-14 Dainippon Screen Mfg Co Ltd 基板搬送装置および基板処理装置
KR101081886B1 (ko) * 2009-07-21 2011-11-09 주식회사 케이씨텍 부상식 기판 코터 장치
JP4916035B2 (ja) * 2009-08-28 2012-04-11 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法
JP2011086807A (ja) * 2009-10-16 2011-04-28 Tokyo Electron Ltd 減圧乾燥装置
JP5221508B2 (ja) * 2009-12-25 2013-06-26 東京エレクトロン株式会社 基板処理装置

Also Published As

Publication number Publication date
TWI546127B (zh) 2016-08-21
TW201318715A (zh) 2013-05-16
KR20130044172A (ko) 2013-05-02
KR101891349B1 (ko) 2018-08-24
CN103056067A (zh) 2013-04-24
JP2013089900A (ja) 2013-05-13

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