JP5910401B2 - 処理液供給装置の運転方法、処理液供給装置及び記憶媒体 - Google Patents

処理液供給装置の運転方法、処理液供給装置及び記憶媒体 Download PDF

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JP5910401B2
JP5910401B2 JP2012173299A JP2012173299A JP5910401B2 JP 5910401 B2 JP5910401 B2 JP 5910401B2 JP 2012173299 A JP2012173299 A JP 2012173299A JP 2012173299 A JP2012173299 A JP 2012173299A JP 5910401 B2 JP5910401 B2 JP 5910401B2
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processing liquid
filter unit
supply apparatus
liquid supply
filter
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Japanese (ja)
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JP2014033111A (ja
JP2014033111A5 (https=
Inventor
洋 丸本
洋 丸本
康治 ▲高▼▲柳▼
康治 ▲高▼▲柳▼
安達　健二
健二 安達
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2012173299A priority Critical patent/JP5910401B2/ja
Priority to TW102127452A priority patent/TWI544971B/zh
Priority to KR1020130091329A priority patent/KR101788352B1/ko
Priority to US13/956,507 priority patent/US9508574B2/en
Priority to CN201310334130.4A priority patent/CN103567110B/zh
Publication of JP2014033111A publication Critical patent/JP2014033111A/ja
Publication of JP2014033111A5 publication Critical patent/JP2014033111A5/ja
Application granted granted Critical
Publication of JP5910401B2 publication Critical patent/JP5910401B2/ja
Priority to US15/336,856 priority patent/US9576829B1/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D19/00—Degasification of liquids
    • B01D19/0031—Degasification of liquids by filtration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D19/00—Degasification of liquids
    • B01D19/0036—Flash degasification
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D36/00—Filter circuits or combinations of filters with other separating devices
    • B01D36/001—Filters in combination with devices for the removal of gas, air purge systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
JP2012173299A 2012-08-03 2012-08-03 処理液供給装置の運転方法、処理液供給装置及び記憶媒体 Active JP5910401B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012173299A JP5910401B2 (ja) 2012-08-03 2012-08-03 処理液供給装置の運転方法、処理液供給装置及び記憶媒体
TW102127452A TWI544971B (zh) 2012-08-03 2013-07-31 處理液供給裝置之運轉方法、處理液供給裝置及記憶媒體
US13/956,507 US9508574B2 (en) 2012-08-03 2013-08-01 Process liquid supply apparatus operating method, process liquid supply apparatus and non-transitory storage medium
KR1020130091329A KR101788352B1 (ko) 2012-08-03 2013-08-01 처리액 공급 장치의 운전 방법, 처리액 공급 장치 및 기억 매체
CN201310334130.4A CN103567110B (zh) 2012-08-03 2013-08-02 处理液供给装置的运转方法和处理液供给装置
US15/336,856 US9576829B1 (en) 2012-08-03 2016-10-28 Process liquid supply apparatus operating method, process liquid supply apparatus and non-transitory storage medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012173299A JP5910401B2 (ja) 2012-08-03 2012-08-03 処理液供給装置の運転方法、処理液供給装置及び記憶媒体

Publications (3)

Publication Number Publication Date
JP2014033111A JP2014033111A (ja) 2014-02-20
JP2014033111A5 JP2014033111A5 (https=) 2014-10-16
JP5910401B2 true JP5910401B2 (ja) 2016-04-27

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JP2012173299A Active JP5910401B2 (ja) 2012-08-03 2012-08-03 処理液供給装置の運転方法、処理液供給装置及び記憶媒体

Country Status (5)

Country Link
US (2) US9508574B2 (https=)
JP (1) JP5910401B2 (https=)
KR (1) KR101788352B1 (https=)
CN (1) CN103567110B (https=)
TW (1) TWI544971B (https=)

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CN104979236B (zh) * 2014-04-11 2017-09-26 沈阳芯源微电子设备有限公司 一种化学液供给装置及其供给方法
EP3137768B1 (en) * 2014-04-30 2020-10-14 Anthony George Hurter Supercritical water used fuel oil purification apparatus and process
WO2015175790A1 (en) 2014-05-15 2015-11-19 Tokyo Electron Limited Method and apparatus for increased recirculation and filtration in a photoresist dispense system
KR102320180B1 (ko) * 2014-05-30 2021-11-03 세메스 주식회사 필터 유닛 및 그것을 갖는 약액 공급 장치
JP6330624B2 (ja) * 2014-11-04 2018-05-30 東京エレクトロン株式会社 処理液供給装置及び処理液供給装置の洗浄方法
JP6222118B2 (ja) * 2015-01-09 2017-11-01 東京エレクトロン株式会社 処理液濾過装置、薬液供給装置及び処理液濾過方法並びに記憶媒体
JP6319117B2 (ja) * 2015-01-26 2018-05-09 東京エレクトロン株式会社 処理液供給装置、処理液供給方法及び記憶媒体
JP6425669B2 (ja) * 2015-03-31 2018-11-21 東京エレクトロン株式会社 処理液供給方法、読み取り可能なコンピュータ記憶媒体及び処理液供給装置
US10121685B2 (en) * 2015-03-31 2018-11-06 Tokyo Electron Limited Treatment solution supply method, non-transitory computer-readable storage medium, and treatment solution supply apparatus
JP5991403B2 (ja) * 2015-04-21 2016-09-14 東京エレクトロン株式会社 フィルタウエッティング方法、フィルタウエッティング装置及び記憶媒体
KR20170010454A (ko) 2015-06-30 2017-02-01 세메스 주식회사 기포 제거 유닛 및 이를 포함하는 기판 처리 장치
JP6252926B1 (ja) * 2016-07-29 2017-12-27 パナソニックＩｐマネジメント株式会社 微細気泡洗浄装置及び微細気泡洗浄方法
CN109564861B (zh) * 2016-07-29 2019-12-13 松下知识产权经营株式会社 微气泡清洗装置和微气泡清洗方法
JP6803701B2 (ja) * 2016-08-23 2020-12-23 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体
JP6966260B2 (ja) * 2017-08-30 2021-11-10 株式会社Ｓｃｒｅｅｎホールディングス ポンプ装置、処理液供給装置および基板処理装置
US11273396B2 (en) 2018-08-31 2022-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Liquid supply system with improved bubble venting capacity
KR20200126552A (ko) * 2019-04-30 2020-11-09 삼성전자주식회사 다중 필터들을 가진 레지스트 필터링 시스템 및 레지스트 코팅 설비
CN112999701B (zh) 2019-12-20 2023-08-11 台湾积体电路制造股份有限公司 用于从粘性流体去除气泡的设备
KR20260006700A (ko) * 2020-02-05 2026-01-13 도쿄엘렉트론가부시키가이샤 필터 세정 시스템 및 필터 세정 방법
US20210245077A1 (en) 2020-02-12 2021-08-12 Tokyo Electron Limited Vacuum Assisted Filtration
KR102548294B1 (ko) * 2020-04-24 2023-06-28 세메스 주식회사 액 공급 유닛, 기판 처리 장치 및 액 처리 방법
US11446585B2 (en) * 2020-06-08 2022-09-20 Hamilton Sundstrand Corporation Grooved porous media gas trap for terrestrial and microgravity environment
KR102798399B1 (ko) * 2020-10-23 2025-04-23 주식회사 엘지에너지솔루션 전극 절연액 공급장치 및 전극 절연액 공급방법
CN115210934B (zh) * 2020-10-23 2025-04-22 株式会社Lg新能源 电极绝缘液供应设备及电极绝缘液供应方法
JP7510334B2 (ja) * 2020-10-30 2024-07-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7628450B2 (ja) * 2021-03-24 2025-02-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および配管着脱パーツ洗浄方法
CN118391236A (zh) * 2024-06-28 2024-07-26 宁波润华全芯微电子设备有限公司 一种光刻胶恒压泵
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Also Published As

Publication number Publication date
US20140034584A1 (en) 2014-02-06
CN103567110A (zh) 2014-02-12
TW201420209A (zh) 2014-06-01
JP2014033111A (ja) 2014-02-20
KR101788352B1 (ko) 2017-10-19
CN103567110B (zh) 2017-08-11
KR20140018130A (ko) 2014-02-12
US9508574B2 (en) 2016-11-29
US20170043287A1 (en) 2017-02-16
US9576829B1 (en) 2017-02-21
TWI544971B (zh) 2016-08-11

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