JP5908030B2 - 貫通電極を有する半導体パッケージ及びその製造方法 - Google Patents

貫通電極を有する半導体パッケージ及びその製造方法 Download PDF

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JP5908030B2
JP5908030B2 JP2014125069A JP2014125069A JP5908030B2 JP 5908030 B2 JP5908030 B2 JP 5908030B2 JP 2014125069 A JP2014125069 A JP 2014125069A JP 2014125069 A JP2014125069 A JP 2014125069A JP 5908030 B2 JP5908030 B2 JP 5908030B2
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substrate
mold layer
chip
manufacturing
layer
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JP2015005748A (ja
JP2015005748A5 (enExample
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顯秀 鄭
顯秀 鄭
金希 馬
金希 馬
仁榮 李
仁榮 李
文祺 趙
文祺 趙
▲チャ▼済 趙
▲チャ▼済 趙
趙　泰済
泰済 趙
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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