JP5875687B2 - ソースゲートを含む装置および方法 - Google Patents
ソースゲートを含む装置および方法 Download PDFInfo
- Publication number
- JP5875687B2 JP5875687B2 JP2014526130A JP2014526130A JP5875687B2 JP 5875687 B2 JP5875687 B2 JP 5875687B2 JP 2014526130 A JP2014526130 A JP 2014526130A JP 2014526130 A JP2014526130 A JP 2014526130A JP 5875687 B2 JP5875687 B2 JP 5875687B2
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- Prior art keywords
- source
- strings
- gate
- select gate
- biasing
- Prior art date
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Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0483—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells having several storage transistors connected in series
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
- G11C16/12—Programming voltage switching circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
- G11C16/14—Circuits for erasing electrically, e.g. erase voltage switching circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/26—Sensing or reading circuits; Data output circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
- G11C16/3418—Disturbance prevention or evaluation; Refreshing of disturbed memory data
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
- G11C16/3418—Disturbance prevention or evaluation; Refreshing of disturbed memory data
- G11C16/3427—Circuits or methods to prevent or reduce disturbance of the state of a memory cell when neighbouring cells are read or written
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/10—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the top-view layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/20—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels
- H10B41/23—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B41/27—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/10—EEPROM devices comprising charge-trapping gate insulators characterised by the top-view layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels
- H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/210,194 US8797806B2 (en) | 2011-08-15 | 2011-08-15 | Apparatus and methods including source gates |
| US13/210,194 | 2011-08-15 | ||
| PCT/US2012/050783 WO2013025710A1 (en) | 2011-08-15 | 2012-08-14 | Apparatus and methods including source gates |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014529889A JP2014529889A (ja) | 2014-11-13 |
| JP2014529889A5 JP2014529889A5 (https=) | 2015-08-27 |
| JP5875687B2 true JP5875687B2 (ja) | 2016-03-02 |
Family
ID=47712555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014526130A Active JP5875687B2 (ja) | 2011-08-15 | 2012-08-14 | ソースゲートを含む装置および方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (8) | US8797806B2 (https=) |
| EP (2) | EP2745295B1 (https=) |
| JP (1) | JP5875687B2 (https=) |
| KR (2) | KR102212154B1 (https=) |
| CN (1) | CN103782344B (https=) |
| WO (1) | WO2013025710A1 (https=) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8797806B2 (en) * | 2011-08-15 | 2014-08-05 | Micron Technology, Inc. | Apparatus and methods including source gates |
| US8742481B2 (en) * | 2011-08-16 | 2014-06-03 | Micron Technology, Inc. | Apparatuses and methods comprising a channel region having different minority carrier lifetimes |
| US9430735B1 (en) * | 2012-02-23 | 2016-08-30 | Micron Technology, Inc. | Neural network in a memory device |
| US10541029B2 (en) | 2012-08-01 | 2020-01-21 | Micron Technology, Inc. | Partial block memory operations |
| KR102002802B1 (ko) | 2012-09-05 | 2019-07-23 | 삼성전자주식회사 | 반도체 장치 |
| JP2014063952A (ja) * | 2012-09-24 | 2014-04-10 | Toshiba Corp | 不揮発性半導体記憶装置 |
| US9318199B2 (en) | 2012-10-26 | 2016-04-19 | Micron Technology, Inc. | Partial page memory operations |
| JP2015172990A (ja) * | 2014-03-12 | 2015-10-01 | 株式会社東芝 | 不揮発性半導体記憶装置 |
| JP2015176623A (ja) * | 2014-03-14 | 2015-10-05 | 株式会社東芝 | 半導体記憶装置及びメモリコントローラ |
| US9318200B2 (en) | 2014-08-11 | 2016-04-19 | Micron Technology, Inc. | Methods and apparatuses including a string of memory cells having a first select transistor coupled to a second select transistor |
| US9613973B2 (en) | 2014-10-03 | 2017-04-04 | Micron Technology, Inc. | Memory having a continuous channel |
| US9633719B2 (en) * | 2015-05-29 | 2017-04-25 | Micron Technology, Inc. | Programming memory cells to be programmed to different levels to an intermediate level from a lowest level |
| US10103162B2 (en) * | 2015-07-30 | 2018-10-16 | Snu R&Db Foundation | Vertical neuromorphic devices stacked structure and array of the structure |
| US9779829B2 (en) | 2015-11-17 | 2017-10-03 | Micron Technology, Inc. | Erasing memory segments in a memory block of memory cells using select gate control line voltages |
| US9972397B2 (en) * | 2016-06-24 | 2018-05-15 | SK Hynix Inc. | Semiconductor memory device and operating method thereof |
| CN108074618A (zh) * | 2016-11-15 | 2018-05-25 | 旺宏电子股份有限公司 | 存储器阵列的操作方法 |
| US9882566B1 (en) * | 2017-01-10 | 2018-01-30 | Ememory Technology Inc. | Driving circuit for non-volatile memory |
| US11271002B2 (en) * | 2019-04-12 | 2022-03-08 | Micron Technology, Inc. | Methods used in forming a memory array comprising strings of memory cells |
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2011
- 2011-08-15 US US13/210,194 patent/US8797806B2/en active Active
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2012
- 2012-08-14 EP EP12824349.0A patent/EP2745295B1/en active Active
- 2012-08-14 WO PCT/US2012/050783 patent/WO2013025710A1/en not_active Ceased
- 2012-08-14 KR KR1020187015781A patent/KR102212154B1/ko active Active
- 2012-08-14 KR KR1020147006646A patent/KR101866236B1/ko active Active
- 2012-08-14 EP EP20170725.4A patent/EP3706127B1/en active Active
- 2012-08-14 CN CN201280043709.9A patent/CN103782344B/zh active Active
- 2012-08-14 JP JP2014526130A patent/JP5875687B2/ja active Active
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2014
- 2014-08-04 US US14/451,145 patent/US9378839B2/en active Active
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2016
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| EP3706127A1 (en) | 2020-09-09 |
| US9378839B2 (en) | 2016-06-28 |
| US20160343438A1 (en) | 2016-11-24 |
| US12148474B2 (en) | 2024-11-19 |
| KR20180064571A (ko) | 2018-06-14 |
| KR20140059233A (ko) | 2014-05-15 |
| KR101866236B1 (ko) | 2018-06-12 |
| JP2014529889A (ja) | 2014-11-13 |
| EP2745295A4 (en) | 2016-02-24 |
| CN103782344A (zh) | 2014-05-07 |
| WO2013025710A1 (en) | 2013-02-21 |
| US20130044549A1 (en) | 2013-02-21 |
| US20220189552A1 (en) | 2022-06-16 |
| US10783967B2 (en) | 2020-09-22 |
| US9779816B2 (en) | 2017-10-03 |
| US20180122481A1 (en) | 2018-05-03 |
| US20140340963A1 (en) | 2014-11-20 |
| EP2745295B1 (en) | 2020-04-22 |
| US20250124982A1 (en) | 2025-04-17 |
| US8797806B2 (en) | 2014-08-05 |
| US20210174874A1 (en) | 2021-06-10 |
| US20190279715A1 (en) | 2019-09-12 |
| US11211126B2 (en) | 2021-12-28 |
| KR102212154B1 (ko) | 2021-02-05 |
| EP2745295A1 (en) | 2014-06-25 |
| CN103782344B (zh) | 2015-08-19 |
| US10170189B2 (en) | 2019-01-01 |
| EP3706127B1 (en) | 2023-03-08 |
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