JP5863801B2 - 高周波に使用するための多平面印刷配線板 - Google Patents

高周波に使用するための多平面印刷配線板 Download PDF

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Publication number
JP5863801B2
JP5863801B2 JP2013527470A JP2013527470A JP5863801B2 JP 5863801 B2 JP5863801 B2 JP 5863801B2 JP 2013527470 A JP2013527470 A JP 2013527470A JP 2013527470 A JP2013527470 A JP 2013527470A JP 5863801 B2 JP5863801 B2 JP 5863801B2
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Japan
Prior art keywords
printed wiring
wiring board
pcb
ground layer
support substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2013527470A
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English (en)
Japanese (ja)
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JP2013539218A (ja
JP2013539218A5 (enExample
Inventor
ウルリヒ メレル，
ウルリヒ メレル，
マイク シエーフエル，
マイク シエーフエル，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aumovio Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
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Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of JP2013539218A publication Critical patent/JP2013539218A/ja
Publication of JP2013539218A5 publication Critical patent/JP2013539218A5/ja
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Publication of JP5863801B2 publication Critical patent/JP5863801B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0234—Resistors or by disposing resistive or lossy substances in or near power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
JP2013527470A 2010-08-26 2011-08-17 高周波に使用するための多平面印刷配線板 Active JP5863801B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102010035453.8 2010-08-26
DE102010035453A DE102010035453A1 (de) 2010-08-26 2010-08-26 Mehrebenenleiterplatte für Hochfrequenz-Anwendungen
PCT/DE2011/001625 WO2012025100A1 (de) 2010-08-26 2011-08-17 Mehrebenenleiterplatte für hochfrequenz-anwendungen

Publications (3)

Publication Number Publication Date
JP2013539218A JP2013539218A (ja) 2013-10-17
JP2013539218A5 JP2013539218A5 (enExample) 2015-09-03
JP5863801B2 true JP5863801B2 (ja) 2016-02-17

Family

ID=45420519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013527470A Active JP5863801B2 (ja) 2010-08-26 2011-08-17 高周波に使用するための多平面印刷配線板

Country Status (5)

Country Link
US (1) US8878074B2 (enExample)
EP (1) EP2609796B1 (enExample)
JP (1) JP5863801B2 (enExample)
DE (2) DE102010035453A1 (enExample)
WO (1) WO2012025100A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104125760A (zh) * 2013-04-29 2014-10-29 鸿富锦精密工业（深圳）有限公司 防电磁辐射的显示装置
WO2015122203A1 (ja) * 2014-02-12 2015-08-20 株式会社村田製作所 プリント基板
JP6244958B2 (ja) * 2014-02-12 2017-12-13 株式会社村田製作所 半導体装置
CN107404806B (zh) * 2016-05-18 2020-12-01 德昌电机(深圳)有限公司 印刷电路板及电机
JP2018018935A (ja) * 2016-07-27 2018-02-01 イビデン株式会社 プリント配線板及びその製造方法
KR102636487B1 (ko) 2018-10-26 2024-02-14 삼성전자주식회사 신호 전송기 및 이를 구비하는 반도체 소자 검사 장치
CN113727542B (zh) * 2021-08-30 2023-06-20 四创电子股份有限公司 一种超低损耗及高散热的高频印制电路板的制作方法
CN117320254A (zh) * 2022-06-24 2023-12-29 华为技术有限公司 电路板及终端

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0758663B2 (ja) * 1989-12-19 1995-06-21 松下電器産業株式会社 厚膜コンデンサ
JPH0427201A (ja) * 1990-05-22 1992-01-30 Maspro Denkoh Corp 妨害波除去フィルタ
JP3160929B2 (ja) * 1991-04-24 2001-04-25 ソニー株式会社 高周波処理装置
US5886597A (en) * 1997-03-28 1999-03-23 Virginia Tech Intellectual Properties, Inc. Circuit structure including RF/wideband resonant vias
US6104258A (en) * 1998-05-19 2000-08-15 Sun Microsystems, Inc. System and method for edge termination of parallel conductive planes in an electrical interconnecting apparatus
US6775150B1 (en) * 2000-08-30 2004-08-10 Intel Corporation Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
DE10042653A1 (de) * 2000-08-31 2002-03-28 Bosch Gmbh Robert Keramische Mehrlagenschaltung
JP2003060359A (ja) * 2001-08-20 2003-02-28 Tdk Corp 多層回路基板
TWI220070B (en) * 2002-12-31 2004-08-01 Advanced Semiconductor Eng High-frequency substrate
DE10347284A1 (de) * 2003-10-08 2005-05-25 Innosent Gmbh Elektronischer Schaltkreis
US7183651B1 (en) 2004-06-15 2007-02-27 Storage Technology Corporation Power plane decoupling
JP2006303020A (ja) * 2005-04-18 2006-11-02 Mitsubishi Electric Corp コンデンサ内蔵プリント配線板
TWI295102B (en) * 2006-01-13 2008-03-21 Ind Tech Res Inst Multi-functional substrate structure
WO2008018875A1 (en) 2006-08-09 2008-02-14 Geomat Insights, Llc Integral charge storage basement and wideband embedded decoupling structure for integrated circuit
JP5155582B2 (ja) * 2007-03-30 2013-03-06 京セラ株式会社 配線基板および電子装置
US8492658B2 (en) * 2010-11-16 2013-07-23 International Business Machines Corporation Laminate capacitor stack inside a printed circuit board for electromagnetic compatibility capacitance

Also Published As

Publication number Publication date
EP2609796A1 (de) 2013-07-03
DE102010035453A1 (de) 2012-03-01
US8878074B2 (en) 2014-11-04
US20140083756A1 (en) 2014-03-27
JP2013539218A (ja) 2013-10-17
EP2609796B1 (de) 2017-11-08
DE112011102175A5 (de) 2013-04-11
WO2012025100A1 (de) 2012-03-01

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